scholarly journals Study on Heat Transfer Performance of Non-integral Capillary Core Sintered Uniform Plate

2021 ◽  
Vol 7 (5) ◽  
pp. 292-301
Keyword(s):  
Heat Transfer ◽  
Particle Size ◽  
Heat Source ◽  
Thermal Resistance ◽  
Copper Powder ◽  
Heat Transfer Performance ◽  
Copper Plate ◽  
Transfer Performance ◽  
Filling Rate ◽  
Large Particle Size

This paper mainly introduces the sintering process of the monolithic capillary wick and analyzes the influence of different copper powder particle size, filling rate, copper powder shape and heat source size on the heat transfer performance of the isothermal plate. The experimental results show that: (1) For the isothermal plate sintered with spherical copper powder, the capillary force of large particle size copper powder is small, but the flow resistance is also small, and the performance of the isothermal plate sintered with large particle size copper powder is better. (2) In the case of low filling rate, the isothermal plate is dried due to insufficient return fluid. In the case of high filling rate, on the one hand, the thickness of the liquid film at the evaporation end of the isothermal plate is large, resulting in additional thermal resistance. On the other hand, the thin film evaporation mode will be transformed into pool boiling mode, which will reduce the heat transfer performance. (3) Spherical copper powder sintered plate with regular shape has the best performance, while dendritic copper powder sintered plate has relatively high thermal resistance. (4) The heat source area has a great influence on the thermal resistance of the plate. Under the same heating power, the thermal resistance of the small area heat source is much higher than that of the large area heat source; The thermal resistance of sintered copper plate is lower than that of pure copper plate under two heat source areas.

Study of Influence Effect on Heat Transfer Performance of Single-Loop Oscillating Heat Pipe

2014 ◽  
Vol 535 ◽  
pp. 114-118 ◽  
Author(s):  
Su Lei
Keyword(s):  
Heat Transfer ◽  
Heat Source ◽  
Thermal Resistance ◽  
Heat Pipe ◽  
Heat Transfer Performance ◽  
Transfer Performance ◽  
Filling Rate ◽  
Oscillating Heat Pipe ◽  
Heating Section ◽  
Cooling Section

s. The experiment studied the effect of heat source temperature, heating section length ratio, cooling air flow rate, liquid filling rate and pipe diameter on the heat transfer performance of the single-loop red copper-water oscillating heat pipe. The results show that increasing heat source temperature or pipe diameter and reducing filling rate can obviously reduce the thermal resistance of the heat pipe; in the air cooling mode, the cooling thermal resistance outside the pipe is affected by both cooling conditions and heat pipe cooling section average temperature; when the heating section is shorter than the cooling section, the heat pipe thermal resistance shows an apparent trend of increasing with the increase of heating section length ratio, when the heating section is longer than the cooling section, the cooling thermal resistance increases with it apparently; the heat transfer power is the highest when the filling rate is 50%.

An Investigation of Flat-Plate Oscillating Heat Pipes

2010 ◽  
Author(s):  
Peng Cheng ◽  
Scott Thompson ◽  
Joe Boswell ◽  
Hongbin Ma
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Flat Plate ◽  
Heat Transfer Performance ◽  
Operating Temperature ◽  
Pure Water ◽  
Heat Pipes ◽  
Copper Plate ◽  
Working Fluid ◽  
Transfer Performance

The heat transfer performance of flat-plate oscillating heat pipes (FP-OHPs) was investigated experimentally and theoretically. Two layers of channels were created by machining grooves on both sides of copper plate, in order to increase the channel number per unit volume. The channels had rectangular cross-sections with hydraulic diameters ranging from 0.762 mm to 1.389 mm. Acetone, water and diamond/acetone, gold/water and diamond/water nanofluids were tested as working fluids. It was found that the FP-OHP’s thermal resistance depended on the power input and operating temperature. The FP-OHP charged with pure water achieved a thermal resistance of 0.078°C/W while removing 560 W with a heat flux of 86.8 W/cm2. The thermal resistance was further decreased when nanofluid was used as the working fluid. A mathematical model predicting the heat transfer performance was developed to predict the effects of channel dimension, heating mode, working fluid and operating temperature on the thermal performance of the FP-OHP. Results presented here will assist in optimization of the FP-OHP and provide a better understanding of heat transfer mechanisms occurring in an OHPs.

An Investigation of Flat-Plate Oscillating Heat Pipes

2010 ◽  
Vol 132 (4) ◽  
Author(s):  
Peng Cheng ◽  
Scott Thompson ◽  
Joe Boswell ◽  
H. B. Ma
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Flat Plate ◽  
Cross Sections ◽  
Heat Transfer Performance ◽  
Heat Pipes ◽  
Power Input ◽  
Copper Plate ◽  
Working Fluid ◽  
Transfer Performance

The heat transfer performance of flat-plate oscillating heat pipes (FP-OHPs) was investigated experimentally and theoretically. Two layers of channels were created by machining grooves on both sides of a copper plate in order to increase the channel number per unit volume. The channels had rectangular cross-sections with hydraulic diameters ranging from 0.762 mm to 1.389 mm. Acetone, water, diamond/acetone, gold/water, and diamond/water nanofluids were tested as working fluids. It was found that the FP-OHP’s thermal resistance depended on the power input and operating temperature. The FP-OHP charged with 0.0003 vol % gold/water nanofluids achieved a thermal resistance of 0.078 K/W while removing 560 W with a heat flux of 86.8 W/cm2. The thermal resistance was further decreased when the nanofluid was used as the working fluid. A mathematical model predicting the heat transfer performance was developed to predict the thermal performance of the FP-OHP. Results presented here will assist in the optimization of the FP-OHP and provide a better understanding of heat transfer mechanisms occurring in OHPs.

scholarly journals Analysis of heat transfer and irreversibility of organic rankine cycle evaporator for selecting working fluid and operating conditions

2020 ◽  
Vol 24 (3 Part B) ◽  
pp. 2013-2022
Author(s):  
Shuang Ye ◽  
Yan Xu ◽  
Yu Chen ◽  
Wei Huang
Keyword(s):  
Heat Transfer ◽  
Heat Source ◽  
Thermal Resistance ◽  
Heat Transfer Performance ◽  
Waste Heat ◽  
Organic Rankine Cycle ◽  
Rankine Cycle ◽  
Working Fluid ◽  
Transfer Performance ◽  
Irreversible Loss

Organic Rankine cycle (ORC) is suitable to converting the normally hard to utilize low temperature thermal energies, such as geothermal energy, solar energy, and industrial waste heat, to electricity through utilizing low boiling organic working fluids. The performance of ORC system is dramatically affected by the selections of working fluid and working conditions. As a key component of waste heat recovery, the irreversible loss of evaporator also has great influence on the performance of ORC system. In this paper, we study the heat transfer performance in evaporator under the condition that the heat source parameters and pinch point temperature difference are identified. It is found that the heat transfer performance is affected by Cr, the ratio of heat capacity flow rates between the working fluid and the heat source fluid. The equivalent thermal resistance, deducing from the concept of entransy, to measure the irreversability during the heat transfer process is used. Then, the parameter ?r, the ratio between latent heat and sensible heat of working fluid is defined. With the parameters Cr and ?r, we investigate the relationship between the heat transfer and irreversible loss, and deduce the condition that maximum heat transfer and minimum equivalent thermal resistance occurs. Finally, a calculation method is established to choose the optimum working fluid and the evaporation condition.

Study on Periodic Thermal-Switching Behavior of Flat Heat Pipe

2015 ◽  
Author(s):  
Shigeki Hirasawa ◽  
Tatsuya Nakamu ◽  
Tsuyoshi Kawanami ◽  
Katsuaki Shirai
Keyword(s):  
Heat Transfer ◽  
Heat Source ◽  
Heat Pipe ◽  
Heat Transfer Performance ◽  
Switching Behavior ◽  
Transfer Performance ◽  
Unsteady Heat Transfer ◽  
Cold Energy ◽  
Thermal Switching ◽  
Flat Heat Pipe

The coupling of the electrocaloric effect in thin films with thermal switches has the potential to be used for efficient refrigeration. We studied the unsteady heat transfer performance and periodic thermal-switching behavior of a flat heat pipe to transfer cold energy from a changing heat source. The condenser of the flat heat pipe was the changing heat source and changed from −20 W to +20 W every 5 s. The temperature of the condenser surface changed in accordance with the heat generation of the heat source. The evaporator was a plate with a mesh wick attached to a water-flow pipe. Cold energy transferred from the condenser surface to the evaporator surface only when the temperature of the condenser surface was lower than that of the evaporator surface. We analyzed the unsteady temperature change and heat transfer performance of the flat heat pipe by numerical simulation. The analytical results showed that it was necessary to have two thermal switches to separate the heat energy and cold energy of the changing heat source. Also, it was important to reduce the thermal resistance and heat capacity of the evaporator surface to improve the unsteady heat transfer performance of the heat pipe. Next, we measured the unsteady heat transfer performance of the flat heat pipe experimentally. The experimental results showed that the thermal-switching behavior was observed when the heat generation of the heat source changed every 5 s.

scholarly journals Simulation analysis of heat transfer performance of heat sink with reduced material design

2020 ◽  
Vol 12 (5) ◽  
pp. 168781402092130
Author(s):  
Ya-Chu Chang
Keyword(s):  
Heat Transfer ◽  
Reynolds Number ◽  
Thermal Resistance ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
Electronic Device ◽  
Local Heating ◽  
Transfer Performance ◽  
Electronic Components ◽  
Thermal Reliability

The field of electronic device applications is becoming more and more extensive. With the development of science and technology and the improvement of the integration of electronic components, local heating is becoming more and more serious. If heat cannot be discharged immediately, it will cause heat to accumulate, causing the temperature of each component to exceed the limit. The reliability of electronic equipment is greatly reduced. Especially in important fields such as military and aerospace, the thermal reliability of electronic components is higher. The research results show that increasing the Reynolds number is helpful to reduce the overall temperature and thermal resistance of the heat sink, but the increase of the Reynolds number and the decrease of the thermal resistance value are gradually flat. The design concept of material reduction has a significant impact on processing and cost. The results of this article show that selecting the appropriate heat sink fins and matching the specific Reynolds number can effectively improve the heat transfer performance of the heat sink.

scholarly journals Research on Heat Transfer Performance of Micro-Channel Backplane Heat Pipe Air Conditioning System in Data Center

2020 ◽  
Vol 10 (2) ◽  
pp. 583
Author(s):  
Liping Zeng ◽  
Xing Liu ◽  
Quan Zhang ◽  
Jun Yi ◽  
Xianglong Liu ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Exchange ◽  
Heat Pipe ◽  
Temperature Difference ◽  
Air Conditioning ◽  
Heat Transfer Performance ◽  
Transfer Performance ◽  
Micro Channel ◽  
Filling Rate ◽  
Air Conditioning System

This paper deals with the heat transfer performance of a micro-channel backplane heat pipe air conditioning system. The optimal range of the filling rate of a micro-channel backplane heat pipe air conditioning system was determined in the range of 65–75%, almost free from the interference of working conditions. Then, the influence of temperature and air volume flow rate on the heat exchange system were studied. The system maximum heat exchange is 7000–8000 W, and the temperature difference between the inlet and outlet of the evaporator and the condenser is almost 0 °C. Under the optimum refrigerant filling rate, the heat transfer of the micro-channel heat pipe backplane system is approximately linear with the temperature difference between the inlet air temperature of the evaporator and the cooling distribution unit (CDU) inlet water temperature in the range of 18–28 °C. The last part compares the heat transfer characteristics of two refrigerants at different filling rates. The heat transfer, pressure, and refrigerant temperature of R134a and R22 are the same with the change of filling rate, but the heat transfer of R134a is lower than that of R22. The results are of great significance for the operational control and practical application of a backplane heat pipe system.

scholarly journals Experimental Study on the Evaporation and Condensation Heat Transfer Characteristics of a Vapor Chamber

Energies ◽  
2018 ◽  
Vol 12 (1) ◽  
pp. 11
Author(s):  
Yanfei Liu ◽  
Xiaotian Han ◽  
Chaoqun Shen ◽  
Feng Yao ◽  
Mengchen Zhang
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Heat Transfer Performance ◽  
Condensation Heat Transfer ◽  
Transfer Performance ◽  
Vapor Chamber ◽  
Filling Rate ◽  
Transfer Coefficients ◽  
Heat Transfer Coefficients ◽  
Evaporation And Condensation

A vapor chamber can meet the cooling requirements of high heat flux electronic equipment. In this paper, based on a proposed vapor chamber with a side window, a vapor chamber experimental system was designed to visually study its evaporation and condensation heat transfer performance. Using infrared thermal imaging technology, the temperature distribution and the vapor–liquid two-phase interface evolution inside the cavity were experimentally observed. Furthermore, the evaporation and condensation heat transfer coefficients were obtained according to the measured temperature of the liquid near the evaporator surface and the vapor near the condenser surface. The effects of heat load and filling rate on the thermal resistance and the evaporation and condensation heat transfer coefficients are analyzed and discussed. The results indicate that the liquid filling rate that maximized the evaporation heat transfer coefficient was different from the liquid filling rate that maximized the condensation heat transfer coefficient. The vapor chamber showed good heat transfer performance with a liquid filling rate of 33%. According to the infrared thermal images, it was observed that the evaporation/boiling heat transfer could be strengthened by the interference of easily broken bubbles and boiling liquid. When the heat input increased, the uniformity of temperature distribution was improved due to the intensified heat transfer on the evaporator surface.

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