scholarly journals Dynamic Tensile Properties of CFRP Manufactured by PCM and WCM: Effect of Strain Rate and Configurations

Crystals ◽  
2021 ◽  
Vol 11 (12) ◽  
pp. 1491
Author(s):  
Yujin Yang

Carbon fiber-reinforced plastic (CFRP) is a promising material to achieve lightweight automotive components. The effects of the strain rate and configurations of CFRP on dynamic tensile properties have not yet been fully explored; thus, its lightweight benefits cannot be maximized. In this paper, the dynamic tensile properties of CFRPs, tested using two different processes with two different resins and four different configurations, were studied with a strain rate from 0.001 to 500 s−1. The tensile strength, modulus, failure strain, and fracture mechanism were analyzed. It was found that the dynamic performance enhances the strength and modulus, whereas it decreases the failure strain. The two processes demonstrated the same level of tensile strength but via different fracture mechanisms. Fiber orientation also significantly affects the fracture mode of CFRP. Resins and configurations both have an influence on strain rate sensitivity. An analytic model was proposed to examine the strain rate sensitivity of CFRPs with different processes and configurations. The proposed model agreed well with the experimental data, and it can be used in simulations to maximize the lightweight properties of CFRP.

2019 ◽  
Vol 2019 (1) ◽  
pp. 000480-000487
Author(s):  
Luke A. Wentlent ◽  
James Wilcox ◽  
Xuanyi Ding

Abstract As the electronics industry continues to evolve a concerted effort has developed to implement lower melting point solders. The ability to minimize the thermal exposure that an assembly is subjected to affords significant benefits with respect to both the reliability and the materials that can be used. One of the most popular low melt solder alloys currently being investigated by the industry is the Bi-Sn eutectic system, which has a melting point of 139°C. The BiSn system itself is not particularly novel as it was posited as a SAC alternative during the initial shift from Pb based solders. While a body of knowledge currently exists regarding this system, and the near eutectic variant BiSnAg, there are still concerns regarding its ductility, especially as a function of thermal exposure and strain rate. Bismuth is widely acknowledged as a brittle element and its presence in such quantities raises concerns of not just Cu6Sn5 embrittlement but also solder fragility in high strain rate types of environments. A challenge with regards to near term implementation is that most packages are not available with BiSn solder bumps. Therefore, it will be necessary to use components already balled with SAC 305 solder. This means that the resulting solder interconnect, reflowed below conventional SAC reflow temperatures, will form a type of mixed hybrid microstructure. This non-equilibrium microstructure will be composed of two regions, one Bi-rich region which is well past saturation and a second region which is Bi-deficient. It is of specific industrial interest then to not just investigate the BiSn solder system but also within the context of a realistic mixed interconnect. Recent work by several researchers has shown that this hybrid microstructure is unstable and quite active with respect to the movement and localized concentration of the Bismuth. The degree of mixing of these two regions has been shown to be highly dependent upon reflow temperature and the paste to ball volume ratio. Mixed SAC-BiSn solder joints were formed by placing SAC 305 spheres on BiSn paste deposits for a paste to ball volume ratio of .18. These samples were then reflowed at either 175°C or 200°C. SAC 305 control samples were also made using a conventional Pb-free reflow profile with a peak temperature of 247°C. A 22 mil Cu-OSP pad on a 1.0 mm thick FR4 substrate was used for all samples. A selection of the solder joints were then isothermally aged at 90°C for 200 hours. Using a joint level micromechanical tester, ball shear tests were conducted at a range of strain rates for samples in the as-reflowed and aged state. Using this information, the strain rate sensitivity of the interconnects was mapped and correlated with the observed failure modes. Investigations into the fracture mechanisms were conducted by examining the shear fracture surface with optical and scanning electron microscopy. Additionally, the evolution of the microstructure was characterized. Results showed a clear transition from ductile solder failure to a brittle separation failure at the higher strain rates.


2018 ◽  
Vol 115 (5) ◽  
pp. 507
Author(s):  
Onur Çavusoglu ◽  
Hakan Gürün ◽  
Serkan Toros ◽  
Ahmet Güral

In this study, strain hardening and strain rate sensitivity behavior of commercial DP1000 dual phase steel have been examined in detail at temperatures of 25 °C, 100 °C, 200 °C and 300 °C, at strain rates of 0.0016 s−1 and 0.16 s−1. As the strain rate has increased, the yield strength has increased but no significant change in tensile strength and strain hardening coefficient has been observed. As the temperature has increased, the yield and tensile strength has decreased in between 25 and 200 °C but it has showed an increase at 300 °C. The strain hardening coefficient has increased in parallel with temperature increase. It has been seen that the strain rate sensitivity has not been affected by temperature. No significant difference in the hardening rate has appeared in between 25 and 200 °C, but the highest value has been calculated at 300 °C. It has been determined that the fracture behavior has occurred earlier and load carrying capacity on necking has reduced with the increase of strain rate and not significantly affected by temperature.


2004 ◽  
Vol 366 (1) ◽  
pp. 50-55 ◽  
Author(s):  
Ikuo Shohji ◽  
Tomohiro Yoshida ◽  
Takehiko Takahashi ◽  
Susumu Hioki

2004 ◽  
Vol 53 (3) ◽  
pp. 266-271
Author(s):  
Masashi DAIMARUYA ◽  
Hidetoshi KOBAYASHI ◽  
Yusuke ISHIHATA

Author(s):  
Muhammad Yasir Khalid ◽  
Zia Ullah Arif ◽  
Waqas Ahmed ◽  
Hassan Arshad

There has been an ever-going need for materials containing excellent mechanical properties, lower density, and improved fuel efficiency in the aerospace industry. To date, Fiber Metal Laminates (FMLs) are a prime choice for aerospace applications. The components of aircraft are subjected to various mechanical loadings under operating conditions; therefore, an in-depth understanding of material behavior under expected loading conditions is imperative for the meticulous design and manufacturing of these components. To evaluate the tensile behavior of the FMLs containing Aluminum 7075-T6 sheets as a metallic phase was the primary aim of this study. Furthermore, the manufactured composites were treated with the processes including surface de-greasing, mechanical abrasion, and anodizing. In order to perform mechanical characterization, uniaxial tensile tests were conducted at various strain rates 2×10−4 s−1, 5×10−4 s−1 and 8×10−4 s−1. The FMLs were fabricated through vacuum-assisted resin transfer molding (VARTM) process. The results revealed that FMLs based different combinations of the fiber and metal constituents exhibited a low degree of strain rate-sensitivity. In the case of CARALL, 1.7% increase in tensile strength was observed, and, its tensile strength was increased from 741 MPa to 754 MPa. Whereas, ARALL and GLARE laminates exhibited high degree of strain rate-sensitivity. When the strain rate is increased from 2×10−4 s−1, 5×10−4 s−1 and 8×10−4 s−1 the values are increased in the following patterns: 389 MPa, 411 MPa, and 475 MPa for GLARE laminates, and 253 MPa, 298 MPa 352 MPa for ARALL laminates. Thus, 39% and 22% increase in the tensile strengths were noted for ARALL and GLARE laminates, respectively.


1999 ◽  
Vol 40 (3) ◽  
pp. 140-145 ◽  
Author(s):  
Yu Wang ◽  
Dongliang Lin ◽  
Yuanxing Zhou ◽  
Yuanming Xia ◽  
Chi C. Law

Author(s):  
Jean-Luc Zinszner ◽  
Benjamin Erzar ◽  
Pascal Forquin

Ceramic materials are commonly used to design multi-layer armour systems thanks to their favourable physical and mechanical properties. However, during an impact event, fragmentation of the ceramic plate inevitably occurs due to its inherent brittleness under tensile loading. Consequently, an accurate model of the fragmentation process is necessary in order to achieve an optimum design for a desired armour configuration. In this work, shockless spalling tests have been performed on two silicon carbide grades at strain rates ranging from 10 3 to 10 4  s −1 using a high-pulsed power generator. These spalling tests characterize the tensile strength strain rate sensitivity of each ceramic grade. The microstructural properties of the ceramics appear to play an important role on the strain rate sensitivity and on the dynamic tensile strength. Moreover, this experimental configuration allows for recovering damaged, but unbroken specimens, giving unique insight on the fragmentation process initiated in the ceramics. All the collected data have been compared with corresponding results of numerical simulations performed using the Denoual–Forquin–Hild anisotropic damage model. Good agreement is observed between numerical simulations and experimental data in terms of free surface velocity, size and location of the damaged zones along with crack density in these damaged zones. This article is part of the themed issue ‘Experimental testing and modelling of brittle materials at high strain rates’.


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