scholarly journals Texture Evolution and Nanohardness in Cu-Nb Composite Wires

Materials ◽  
2021 ◽  
Vol 14 (18) ◽  
pp. 5294
Author(s):  
Shihua Xiang ◽  
Xiaofang Yang ◽  
Yanxiang Liang ◽  
Lu Wang
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Dynamic Recrystallization ◽  
Texture Evolution ◽  
True Strain ◽  
Cold Drawing ◽  
Electron Backscattered Diffraction ◽  
Grain Sizes ◽  
Transmission Electron ◽  
Composite Wires

Multifilamentary microcomposite copper-niobium (Cu-Nb) wires were fabricated by a series of accumulative drawing and bonding steps (ADB). The texture of the Cu matrix in these wires was studied using electron backscattered diffraction (EBSD) and transmission electron microscopy (TEM). Dynamic recrystallization during cold drawing caused a weakening of the <111> texture in the micron-scale Cu matrix at high values of true strain. A sharp <111> texture was observed in the nano-scale Cu matrix due to the suppression of dynamic recrystallization. The grain size was reduced by the higher level of dynamic recrystallization at high strains. The relation between the nanoindentation behavior of the different Cu matrix and the grain sizes, Cu-Nb interface, and texture was established.

Microstructure Evolution of Hydrogenated Ti6Al4V Alloy during Compression

2012 ◽  
Vol 190-191 ◽  
pp. 517-521
Author(s):  
Bao Guo Yuan ◽  
Qiang Chen ◽  
Hai Ping Yu ◽  
Ping Li ◽  
Ke Min Xue ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Dislocation Density ◽  
Microstructure Evolution ◽  
Room Temperature ◽  
True Strain ◽  
True Stress ◽  
Compression Tests ◽  
Transmission Electron ◽  
Good Repeatability

Compression tests of the hydrogenated Ti6Al4V0.2H alloy were carried out using an Instron 5569 machine at room temperature. True stress-strain curves of the hydrogenated Ti6Al4V0.2H alloy under different compressive strains were obtained. Microstructure evolution of the hydrogenated Ti6Al4V0.2H alloy during the process of compression was investigated by optical microscopy and transmission electron microscopy. Results show that true stress-true strain curves of Ti6Al4V0.2H alloy have good repeatability. The deformation of grains, the dislocation density and slipping evolution during the process of compression are discussed.

scholarly journals Microstructure characterization of ODS-RAFM steels

2008 ◽  
Vol 1125 ◽  
Author(s):  
R. Mateus ◽  
P.A. Carvalho ◽  
D. Nunes ◽  
L.C. Alves ◽  
N. Franco ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Proton Beam ◽  
Nuclear Microprobe ◽  
Elemental Distribution ◽  
Electron Backscattered Diffraction ◽  
Ods Steel ◽  
Transmission Electron ◽  
Eurofer 97

ABSTRACTResults of the microstructural characterization of four different RAFM ODS Eurofer 97 batches are presented and discussed. Analyses and observations were performed by nuclear microprobe and scanning and transmission electron microscopy. X-ray elemental distribution maps obtained with proton beam scans showed homogeneous composition within the proton beam spatial resolution and, in particular, pointed to a uniform distribution of ODS (yttria) nanoparticles in the Eurofer 97 matrix. This was confirmed by transmission electron microscopy. Scanning electron microscopy coupled with energy dispersive spectroscopy made evident the presence of chromium carbide precipitation. Precipitates occurred preferentially along grain boundaries (GB) in three of the batches and presented a discrete distribution in the other, as a result of different thermo-mechanical routes. Additional electron backscattered diffraction experiments revealed the crystalline textures in the ferritic polycrystalline structure of the ODS steel samples.

Prepare of the New Structure PbTiO3 Nanowires and the Study of the Reversible Bending

2013 ◽  
Vol 331 ◽  
pp. 522-526
Author(s):  
Jiang Wang ◽  
Jian Li ◽  
You Wen Wang
Keyword(s):  
Crystal Structure ◽  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Stainless Steel ◽  
Hydrothermal Reaction ◽  
The Self ◽  
X Ray Diffraction ◽  
Electron Backscattered Diffraction ◽  
X Ray ◽  
Transmission Electron

When the self-made with Teflon lined with stainless steel reaction kettle is used to produce PbTiO3 nanowires with the adoption of hydrothermal reaction , PbTiO3 nanowires with new structure can be made when Pb/Ti equals 2.2. Observed through the Transmission Electron Microscopy (TEM), the bending feature of the PbTiO3 nanowires can be observed for several times when X-ray diffraction (XRD) and Electron Backscattered Diffraction (EBSD) are used to analyse and test the crystal structure of the nanowires. The result of the study shows that the degree of the bending of the PbTiO3 nanowires varies with the intensity of the electron beam from the Transmission Electron Microscopy, and its process can be reversible.

Electron Backscattered Diffraction and Transmission Electron Microscopy Analysis of Ribbon Silicon

2012 ◽  
Vol 18 (S2) ◽  
pp. 1442-1443
Author(s):  
S. Rouvimov ◽  
E. Tsidilkovski ◽  
J.J. Donovan
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Electron Backscattered Diffraction ◽  
Transmission Electron Microscopy Analysis ◽  
Transmission Electron ◽  
Electron Microscopy Analysis ◽  
Microscopy Analysis

Extended abstract of a paper presented at Microscopy and Microanalysis 2012 in Phoenix, Arizona, USA, July 29 – August 2, 2012.

The Microstructure and Electromigration Performance of Damascene-Fabricated Aluminum Interconnects

1997 ◽  
Vol 473 ◽  
Author(s):  
Paul R. Besser ◽  
John E. Sanchez ◽  
David P. Fields ◽  
Shekhar Pramanick ◽  
Kashmir Sahota
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Grain Size ◽  
Aluminum Alloy ◽  
Crystallographic Texture ◽  
Local Electron ◽  
Electron Backscattered Diffraction ◽  
Transmission Electron ◽  
Parallel Arrays ◽  
Aluminum Interconnects

ABSTRACTNovel metal deposition stack and damascene processing methods have been used to fabricate electrically isolated parallel arrays of 1.0 μm deep aluminum-alloy interconnect trenches varying in width from 0.5 μm to 16 μm. The grain size and crystallographic texture of the Al in these trenches has been characterized using transmission electron microscopy (TEM) and local electron backscattered diffraction (EBSD), respectively. Narrow lines (0.5 and 1.0 μm wide) have a bamboo microstructure, intermediate widths (2.0 μm wide) are nearly bamboo, and wide lines (4.0 μ and wider) are polycrystalline. The <111> texture of the lines degrades with decreasing linewidth. A secondary <100> component is demonstrated and its origin proposed. The electromigration reliability of the narrow damascene Al lines was measured, and the observed enhancement of damascene Al interconnects compared to conventionally-fabricated Al interconnects is correlated with the microstructure.

Microstructural Characterization of Longitudinal Magnetic Recording Media

1999 ◽  
Vol 589 ◽  
Author(s):  
Robert Sinclair ◽  
Dong-Won Park ◽  
Claus Habermeier ◽  
Kai Ma
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Magnetic Recording ◽  
Microstructural Characterization ◽  
Recording Media ◽  
Magnetic Recording Media ◽  
Grain Sizes ◽  
Transmission Electron ◽  
The Media

AbstractThe optimization of disc manufacturing conditions is required to increase the storage capacities of magnetic recording media, which is strongly related to both magnetic properties and microstructural features. Analyzing the microstructure requires transmission electron microscopy (TEM), since the small grain sizes of the media prevent other tools from characterizing them. This paper discusses several fascinating characteristics of TEM in understanding and analyzing the properties of the recording media.

A Transmission Electron Microscopy Study of the Role of Sc+Zr Addition to a 6082-T8 Alloy Subjected to Equal Channel Angular Pressing

2006 ◽  
Vol 503-504 ◽  
pp. 841-846 ◽  
Author(s):  
Marcello Cabibbo ◽  
E. Evangelista ◽  
C. Scalabroni ◽  
Ennio Bonetti
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Equal Channel Angular Pressing ◽  
True Strain ◽  
Microscopy Study ◽  
Electron Microscopy Study ◽  
Angular Pressing ◽  
Transmission Electron ◽  
Parent Alloy

The microstructural evolution with strain was investigated either in a Zr-modified 6082 Al-Mg-Si alloy and in the same alloy added with 0.117wt.% Sc, subjected to severe plastic deformations. Materials were deformed by equal-channel angular pressing using route BC, up to a true strain of ∼12. A strain of ~4 produced a sub-micrometer scale microstructure with very fine cells (nanometer scale) in the grain interior. The role of fine dispersoids (Al3(Sc1-x,Zrx)) was investigated by transmission electron microscopy techniques and discussed. Dispersoids were responsible for a more complex dislocation substructure with strain. Compared to the commercial parent alloy, block wall formation and propagation were favored by the presence of Sc-Zr containing dispersoids, while cell boundary evolution was less affected, compared to the commercial parent alloy. Mean misorientation across block walls increased with strain much more in the Sc-Zr containing alloy, reaching a plateau, starting from a true strain of ∼8. Misorientation across cell boundaries continuously increased to ∼8° and ∼5° for the Sc-Zr and Zr containing alloy, respectively.

Enhanced Strength and Ductility at a Cryogenic Temperature in a Nanostructured Ni-Fe Alloy

2007 ◽  
Vol 539-543 ◽  
pp. 2828-2833
Author(s):  
Hong Qi Li ◽  
Kai Xiang Tao ◽  
Hahn Choo ◽  
Peter K. Liaw
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Cryogenic Temperature ◽  
Room Temperature ◽  
Liquid Nitrogen Temperature ◽  
Compressive Behavior ◽  
Grain Sizes ◽  
Transmission Electron ◽  
Before And After ◽  
Strength And Ductility

The compressive behavior was investigated on an electrodeposited nanocrystalline Ni-20%Fe alloy with a grain size of about 22 nm at room temperature (RT), 298 K, and the liquid nitrogen temperature (LN2T), 77 K. The sensitivity of the yield strength and plastic strain to the test temperature at different grain sizes was discussed. Moreover, through the Transmission Electron Microscopy (TEM) examination and microhardness measurement, the microstructures before and after the compression test at RT and LN2T were studied.

Sign in / Sign up

Export Citation Format

Share Document