scholarly journals Simultaneous Increase of Electrical Conductivity and Hardness of Al–1.5 wt.% Mn Alloy by Addition of 1.5 wt.% Cu and 0.5 wt.% Zr

Metals ◽  
2019 ◽  
Vol 9 (12) ◽  
pp. 1246 ◽  
Author(s):  
Nikolay Belov ◽  
Natalya Korotkova ◽  
Torgom Akopyan ◽  
Kirill Tsydenov
Keyword(s):  
Solid Solution ◽  
Electrical Conductivity ◽  
Annealing Temperature ◽  
Simultaneous Increase ◽  
Aluminum Solid Solution ◽  
Cold Rolled ◽  
Metal Processing

The effect of Cu and Zr additions and annealing temperature on electrical conductivity and hardness of the Al–1.5 wt.% Mn alloy in the form of as-cast ingots and cold rolled sheets has been investigated. It is shown that due to the formation of low alloyed aluminum solid solution and Al20Cu2Mn3 and Al3Zr (L12) phase nanoparticles, the 1.5MnCuZr alloy is superior to the base 1.5Mn alloy both in the hardness (up to two times) and electrical conductivity (up to 30%) after metal processing and annealing. A new alloy can be considered as a replacement for existing 6201 type conductive alloys.

Thermal Annealing of Amorphous CoMnNiO Film on Oxidized Si Substrate

1989 ◽  
Vol 164 ◽  
Author(s):  
Tan Hui ◽  
Qin Dong ◽  
Tao Mingde ◽  
Lin Chenglu ◽  
Zou Shichang
Keyword(s):  
Solid Solution ◽  
Electrical Conductivity ◽  
Electrical Properties ◽  
Annealing Temperature ◽  
Rf Sputtering ◽  
Amorphous Film ◽  
Spinel Solid Solution ◽  
Si Substrate ◽  
Structure Relaxation ◽  
Spinel Solid Solutions

AbstractAmorphous CoMnNiO film is doposited on oxidized Si substrate by RF sputtering equipment. Structure relaxation occurs in the amorphous CoMnNiO film when it is annealed below 550°C. Annealed in the range from 600°C to 1000°C, the amorphous film is converted into the polycrystal. After annealing in rich oxygen atmosphere, the amorphous film is transformed into spinel solid solution with stable structure and good electrical properties. The electrical conductivity will be reduced due to formation of low valence oxides when annealed without oxygen. As annealing temperature is higher than 1000°C, some spinel solid solutions will be resolved into low valence oxides CoO and NiO, reducing the conductivity of the CoMnNiO film.

Diffusional Analysis in Al-Ni Cold Rolled Strip during Annealing Process

2012 ◽  
Vol 487 ◽  
pp. 710-713
Author(s):  
Guo Hui Zhu ◽  
Feng Li Sui ◽  
Qi Wei Chen
Keyword(s):  
Solid Solution ◽  
Annealing Temperature ◽  
Annealing Process ◽  
Rolled Strip ◽  
Diffusion Annealing ◽  
Diffusion Layers ◽  
Diffusion Speed ◽  
Cold Rolled ◽  
Annealing Experiments

Diffusion annealing experiments in Al-Ni cold rolled strip was conducted in nitrogen protection. The characterization of diffusion layers between pure Al and pure Ni metals has been analyzed. The analysis results show that the diffusion layers would be composed of solid-solution of Al in Ni marked as Ni (Al), Ni3Al and Ni5Al3 compounds. During diffusion processing, the diffusion speed of Al to Ni was faster than that of Ni to Al. This implied a possibility to form chemical connection of Al-Ni by solid-solution without intermetallic compounds formation to obtain good mechanical and electric properties through optimizing annealing temperature and holding time.

scholarly journals Microstructure and Mechanical Properties of Novel Quasibinary Al-Cu-Yb and Al-Cu-Gd Alloys

Metals ◽  
2021 ◽  
Vol 11 (3) ◽  
pp. 476
Author(s):  
Sayed Amer ◽  
Ruslan Barkov ◽  
Andrey Pozdniakov
Keyword(s):  
Mechanical Properties ◽  
Tensile Properties ◽  
Mechanism Of Action ◽  
Annealing Temperature ◽  
Eutectic Reaction ◽  
Solidification Process ◽  
Annealed State ◽  
Microstructure And Mechanical Properties ◽  
Cold Rolled ◽  
Hot Rolled

Microstructure of Al-Cu-Yb and Al-Cu-Gd alloys at casting, hot-rolled -cold-rolled and annealed state were observed; the effect of annealing on the microstructure was studied, as were the mechanical properties and forming properties of the alloys, and the mechanism of action was explored. Analysis of the solidification process showed that the primary Al solidification is followed by the eutectic reaction. The second Al8Cu4Yb and Al8Cu4Gd phases play an important role as recrystallization inhibitor. The Al3Yb or (Al, Cu)17Yb2 phase inclusions are present in the Al-Cu-Yb alloy at the boundary between the eutectic and aluminum dendrites. The recrystallization starting temperature of the alloys is in the range of 250–350 °C after rolling with previous quenching at 590 and 605 °C for Al-Cu-Yb and Al-Cu-Gd, respectively. The hardness and tensile properties of Al-Cu-Yb and Al-Cu-Gd as-rolled alloys are reduced by increasing the annealing temperature and time. The as-rolled alloys have high mechanical properties: YS = 303 MPa, UTS = 327 MPa and El. = 3.2% for Al-Cu-Yb alloy, while YS = 290 MPa, UTS = 315 MPa and El. = 2.1% for Al-Cu-Gd alloy.

scholarly journals The Enrichment of (Cu, Sn) Solid Solution Driven by High-Pressure Torsion

Crystals ◽  
2021 ◽  
Vol 11 (7) ◽  
pp. 766
Author(s):  
Boris Straumal ◽  
Askar Kilmametov ◽  
Anna Korneva ◽  
Pawel Zięba ◽  
Yuri Zavorotnev ◽  
...  
Keyword(s):  
Solid Solution ◽  
High Pressure ◽  
Theoretical Analysis ◽  
Annealing Temperature ◽  
High Pressure Torsion

Cu–14 wt% Sn alloy was annealed at temperatures of 320 and 500 °C. The concentration of tin cinit in the copper-based matrix increased with annealing temperature. The annealed samples were subjected to high-pressure torsion (HPT) at 6 GPa, 5 turns, 1 rpa. HPT led to the refinement of Cu grains. The shape of the colonies of α + ε phases changed only slightly. The HPT-driven enrichment of the Cu-based solid solution with Sn atoms cHPT–cinit decreased with increasing cinit. The performed theoretical analysis explained this behavior of the HPT-driven enrichment.

Simultaneous increase in electrical conductivity and fatigue strength of Cu-Ni-Si alloy by utilizing discontinuous precipitates

2021 ◽  
Vol 288 ◽  
pp. 129353
Author(s):  
M. Goto ◽  
T. Yamamoto ◽  
S.Z. Han ◽  
T. Utsunomiya ◽  
S. Kim ◽  
...  
Keyword(s):  
Electrical Conductivity ◽  
Fatigue Strength ◽  
Simultaneous Increase

Effect of Heat Treatment on Microstructure and Properties of Cu-3Ti-1Al Alloy

2013 ◽  
Vol 749 ◽  
pp. 282-286
Author(s):  
Xian Hui Wang ◽  
Xiao Chun Sun ◽  
Xiao Hong Yang ◽  
Shu Hua Liang
Keyword(s):  
Heat Treatment ◽  
Solid Solution ◽  
Electrical Conductivity ◽  
Electron Microscope ◽  
Treatment Process ◽  
Intermetallic Phase ◽  
Strengthening Effect ◽  
Microstructure And Properties ◽  
Optimal Heat Treatment ◽  
Transmission Electron

The effect of heat treatment on the microstructure and properties of Cu-3Ti-1Al alloy was investigated. The microstructure was characterized by scanning electron microscope (SEM) and transmission electron microscope (TEM), and the hardness and electrical conductivity were tested as well. The results showed that the hardness and electrical conductivity of Cu-3Ti-1Al alloy increased significantly after solid solution and ageing treatment. The strengthening effect of Cu-3Ti-1Al alloy was attributed to the formation of intermetallic phase such as Ti3Al and fine precipitates of coherent β-Cu4Ti. With increase of the aging time and the temperature, the precipitates became coarse and incoherent with Cu matrix, and the discontinuous precipitate β started to grow from grain boundaries toward grain interior, which decreased hardness. As the formation of Ti3Al, β-Cu3Ti and β-Cu4Ti phase can efficiently reduce Ti concentration in Cu matrix. The electrical conductivity of Cu-3Ti-1Al alloy increases. In the range of experiments, the optimal heat treatment process for Cu-3Ti-1Al alloy is solid solution at 850°C for 4h and ageing 500°C for 2h, and the hardness and electrical conductivity are 227HV and 12.3%IACS, respectively.

Structure and Hardness of Cryorolled and Heat-Treated 2xxx Aluminum Alloy

2010 ◽  
Vol 667-669 ◽  
pp. 925-930
Author(s):  
S.V. Krymskiy ◽  
Elena Avtokratova ◽  
M.V. Markushev ◽  
Maxim Yu. Murashkin ◽  
O.S. Sitdikov
Keyword(s):  
Heat Treatment ◽  
Solid Solution ◽  
Plastic Deformation ◽  
Aluminum Alloy ◽  
Severe Plastic Deformation ◽  
Coarse Grained ◽  
Aging Response ◽  
Heat Treated ◽  
Aluminum Solid Solution ◽  
A Cell

The effects of severe plastic deformation (SPD) by isothermal rolling at the temperature of liquid nitrogen combined with prior- and post-SPD heat treatment, on microstructure and hardness of Al-4.4%Cu-1.4%Mg-0.7%Mn (D16) alloy were investigated. It was found no nanostructuring even after straining to 75%. Сryodeformation leads to microshear banding and processing the high-density dislocation substructures with a cell size of ~ 100-200 nm. Such a structure remains almost stable under 1 hr annealing up to 200oC and with further temperature increase initially transforms to bimodal with a small fraction of nanograins and then to uniform coarse grained one. It is found the change in the alloy post–SPD aging response leading to more active decomposition of the preliminary supersaturated aluminum solid solution, and to the alloy extra hardening under aging with shorter times and at lower temperatures compared to T6 temper.

Effect of Intercritical Annealing Temperature on Development of Cold Rolled Dual Phase Steel from Q345 Steel

2013 ◽  
Vol 313-314 ◽  
pp. 693-696
Author(s):  
Ji Yuan Liu ◽  
Fu Xian Zhu ◽  
Shi Cheng Ma
Keyword(s):  
Dual Phase Steel ◽  
Annealing Temperature ◽  
Simulation Experiment ◽  
Intercritical Annealing ◽  
Continuous Annealing ◽  
Dual Phase ◽  
Automotive Applications ◽  
Treatment Procedure ◽  
Annealing Temperatures ◽  
Cold Rolled

Cold rolled dual phase steel was developed from Q345 steel by heat treatment procedure for automotive applications. The ultimate tensile strength was improved about 100MPa higher than the traditional cold-rolled Q345 steel in the continuous annealing simulation experiment. The microstructure presented varied characteristics in different intercritical annealing temperatures; mechanical properties were changed correspondingly as well. The chief discussions are focus on the recrystallization, hardenability of austenite and martensite transformation in the experiment.

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