Stability of the process of electroslag welding with bifilar power circuit without equalizing wire

2021 ◽  
Vol 2021 (12) ◽  
pp. 33-37
Author(s):  
Yu.M. Lankin ◽  
◽  
V.G. Solovyov ◽  
V.G. Tyukalov ◽  
I.Yu. Romanova ◽  
...  
2019 ◽  
Vol 2019 (3) ◽  
pp. 12-17
Author(s):  
I.I. Lychko ◽  
◽  
K.A. Yushchenko ◽  
S.A. Suprun ◽  
S.M. Kozulin ◽  
...  

2020 ◽  
Vol 10 (10) ◽  
pp. 44-51
Author(s):  
Yury Yu. SKOROKHOD ◽  
◽  
Sehgey I. VOL’SKIY ◽  

The power circuit arrangements of on-board high-voltage static converters fed from a 3000 V AC single-phase network that in the general case produce multi-channel AC and DC output voltages are considered. The basic technical requirements posed to such converters are formulated. The general structural diagram of high-voltage converters with improved electric power consumption quality is given. Possible power circuit arrangements for the high-voltage converter input unit based on single-phase input current correction devices are considered. A classification and criteria for comparative evaluation of the possible power circuit arrangements of these devices are proposed. The information presented in the article will be of interest for specialists engaged in designing on-board electrical systems involving high-voltage converters that must comply with strict requirements for the quality of consumed single-phase input current.


Author(s):  
Franco Stellari ◽  
Peilin Song ◽  
James C. Tsang ◽  
Moyra K. McManus ◽  
Mark B. Ketchen

Abstract Hot-carrier luminescence emission is used to diagnose the cause of excess quiescence current, IDDQ, in a low power circuit implemented in CMOS 7SF technology. We found by optical inspection of the chip that the high IDDQ is related to the low threshold, Vt, device process and in particular to transistors with minimum channel length (0.18 μm). In this paper we will also show that it is possible to gain knowledge regarding the operating conditions of the IC from the analysis of optical emission due to leakage current, aside from simply locating defects and failures. In particular, we will show how it is possible to calculate the voltage drop across the circuit power grid from time-integrated acquisitions of leakage luminescence.


Designs ◽  
2021 ◽  
Vol 5 (2) ◽  
pp. 28
Author(s):  
Hyosung Kim

The medium voltage DC (MVDC) type system can connect multiple terminals to a common MVDC bus, so it is possible to connect several renewable DC power sources to the common MVDC bus, but a DC circuit breaker is needed to isolate short circuit accidents that may occur in the MVDC bus. For this purpose, the concept of a hybrid DC circuit breaker that takes advantage of a low conduction loss contact type switch and an arcless-breaking semiconductor switch has been proposed. During break the hybrid switch, a dedicated current commutation device is required to temporarily bypass the load current flowing through the main switch into a semiconductor switch branch. Existing current commutation methods include a proactive method and a reverse current injection method by a LC (Inductor-capacitor) resonant circuit. This paper proposes a power circuit of a new MVDC hybrid circuit breaker using a low withstanding voltage capacitor branch for commutation and a sequence controller according to it, and verifies its operation through an experiment.


2005 ◽  
Vol 15 (02) ◽  
pp. 459-476
Author(s):  
C. PATRICK YUE ◽  
JAEJIN PARK ◽  
RUIFENG SUN ◽  
L. RICK CARLEY ◽  
FRANK O'MAHONY

This paper presents the low-power circuit techniques suitable for high-speed digital parallel interfaces each operating at over 10 Gbps. One potential application for such high-performance I/Os is the interface between the channel IC and the magnetic read head in future compact hard disk systems. First, a crosstalk cancellation technique using a novel data encoding scheme is introduced to suppress electromagnetic interference (EMI) generated by the adjacent parallel I/Os . This technique is implemented utilizing a novel 8-4-PAM signaling with a data look-ahead algorithm. The key circuit components in the high-speed interface transceiver including the receive sampler, the phase interpolator, and the transmitter output driver are described in detail. Designed in a 0.13-μm digital CMOS process, the transceiver consumes 310 mW per 10-Gps channel from a I-V supply based on simulation results. Next, a 20-Gbps continuous-time adaptive passive equalizer utilizing on-chip lumped RLC components is described. Passive equalizers offer the advantages of higher bandwidth and lower power consumption compared with conventional designs using active filter. A low-power, continuous-time servo loop is designed to automatically adjust the equalizer frequency response for the optimal gain compensation. The equalizer not only adapts to different channel characteristics, but also accommodates temperature and process variations. Implemented in a 0.25-μm, 1P6M BiCMOS process, the equalizer can compensate up to 20 dB of loss at 10 GHz while only consumes 32 mW from a 2.5-V supply.


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