Mosaicity and Wafer Bending in SiC Wafers as Measured by Double and Triple Crystal X-Ray Rocking Curve and Peak Position Maps

Author(s):  
K.W. Kirchner ◽  
Kenneth A. Jones ◽  
Michael A. Derenge ◽  
Michael Dudley ◽  
Adrian R. Powell
Keyword(s):  
2007 ◽  
Vol 556-557 ◽  
pp. 213-218 ◽  
Author(s):  
K.W. Kirchner ◽  
Kenneth A. Jones ◽  
Michael A. Derenge ◽  
Michael Dudley ◽  
Adrian R. Powell

Double and triple crystal rocking curve and peak position maps are constructed for a 4HSiC wafer for the symmetric (0 0 0 8) reflection in the normal position, the same reflection for a sample rotated 90º, and an asymmetric (1 23 6) reflection for the wafer in the normal position. These measurements were corrected for the ‘wobble’ in the instrument by scanning a 4” (1 1 1) Si wafer and assuming that the Si wafer was perfect and attributing the variations in the measurements to instrumental error. The x-ray measurements are correlated with a cross polar image, etch pit density map, white beam transmission x-ray topograph, and a laser light scan.


2016 ◽  
Vol 23 (5) ◽  
pp. 1118-1123 ◽  
Author(s):  
Stanislav Stoupin ◽  
Sergey Antipov ◽  
James E. Butler ◽  
Alexander V. Kolyadin ◽  
Andrey Katrusha

Fabrication and results of high-resolution X-ray topography characterization of diamond single-crystal plates with large surface area (10 mm × 10 mm) and (111) crystal surface orientation for applications in high-heat-load X-ray crystal optics are reported. The plates were fabricated by laser-cutting of the (111) facets of diamond crystals grown using high-pressure high-temperature methods. The intrinsic crystal quality of a selected 3 mm × 7 mm crystal region of one of the studied samples was found to be suitable for applications in wavefront-preserving high-heat-load crystal optics. Wavefront characterization was performed using sequential X-ray diffraction topography in the pseudo plane wave configuration and data analysis using rocking-curve topography. The variations of the rocking-curve width and peak position measured with a spatial resolution of 13 µm × 13 µm over the selected region were found to be less than 1 µrad.


1989 ◽  
Vol 145 ◽  
Author(s):  
C.R. Wie ◽  
Y-W. Choi ◽  
H.M. Kim ◽  
J.F. Chen ◽  
T. Vreeland ◽  
...  

AbstractA simple method for determining layer composition and mismatch of semiconductor hetero-epitaxial samples is by measuring the separation of peaks in x-ray rocking curve (XRC). This method fails if the peak separation is affected by other factors. For a small layer thickness, the layer peak position is affected by the x-ray amplitudes of the substrate or other thicker layers through the interference and overlap effects. In this case, a diffraction theory fitting process is necessary for a correct determination of layer parameters. We have used dynamical and kinematical x-ray diffraction theories to calculate the layer peak position as a function of its thickness for various layer/substrate combinations. These two theories yield substantially different results, indicating that the kinematical diffraction theory analysis is no longer valid for these thin layers. When a thick layer is present along with the thin layer, the thick layer is more influential than the substrate to the thin layer peak position, making the dynamical theory fitting necessary even from higher thickness.


2015 ◽  
Vol 24 (03n04) ◽  
pp. 1550007 ◽  
Author(s):  
Tedi Kujofsa ◽  
John E. Ayers

We have analyzed the strain resolution of x-ray rocking curve profiles from measurements of the peak position and peak width made with finite counting statistics. In this work, we have considered x-ray rocking curves which may be Gaussian or Lorentzian in character and have analyzed the influence of the effective number of counts, full-width-at-half-maximum (FWHM) and the Bragg angle on the resolution. Often experimental resolution values are estimated on the order of 10−5 whereas this work predicts more sensitive values (10−9) with smaller FWHM and larger effective counts and Bragg angles.


2021 ◽  
Vol 54 (4) ◽  
Author(s):  
Mojmír Meduňa ◽  
Ondřej Caha ◽  
Emanuil Choumas ◽  
Franco Bressan ◽  
Hans von Känel

This work investigates layers of densely spaced SiGe microcrystals epitaxially formed on patterned Si and grown up to extreme heights of 40 and 100 µm using the rocking curve imaging technique with standard laboratory equipment and a 2D X-ray pixel detector. As the crystalline tilt varied both within the epitaxial SiGe layers and inside the individual microcrystals, it was possible to obtain real-space 2D maps of the local lattice bending and distortion across the complete SiGe surface. These X-ray maps, showing the variation of crystalline quality along the sample surface, were compared with optical and scanning electron microscopy images. Knowing the distribution of the X-ray diffraction peak intensity, peak position and peak width immediately yields the crystal lattice bending locally present in the samples as a result of the thermal processes arising during the growth. The results found here by a macroscopic-scale imaging technique reveal that the array of large microcrystals, which tend to fuse at a certain height, forms domains limited by cracks during cooling after the growth. The domains are characterized by uniform lattice bending and their boundaries are observed as higher distortion of the crystal structure. The effect of concave thermal lattice bending inside the microcrystal array is in excellent agreement with the results previously presented on a microscopic scale using scanning nanodiffraction.


Author(s):  
W. Z. Chang ◽  
D. B. Wittry

Since Du Mond and Kirkpatrick first discussed the principle of a bent crystal spectrograph in 1930, curved single crystals have been widely utilized as spectrometric monochromators as well as diffractors for focusing x rays diverging from a point. Curved crystal diffraction theory predicts that the diffraction parameters - the rocking curve width w, and the peak reflection coefficient r of curved crystals will certainly deviate from those of their flat form. Due to a lack of curved crystal parameter data in current literature and the need for optimizing the choice of diffraction geometry and crystal materials for various applications, we have continued the investigation of our technique presented at the last conference. In the present abstract, we describe a more rigorous and quantitative procedure for measuring the parameters of curved crystals.The diffraction image of a singly bent crystal under study can be obtained by using the Johann geometry with an x-ray point source.


2007 ◽  
Vol 539-543 ◽  
pp. 3059-3063 ◽  
Author(s):  
G. Schumacher ◽  
N. Darowski ◽  
I. Zizak ◽  
Hellmuth Klingelhöffer ◽  
W. Chen ◽  
...  

The profiles of 001 and 002 reflections have been measured at 1173 K as a function of time by means of X-ray diffraction (XRD) on tensile-creep deformed specimens of single crystal superalloy SC16. Decrease in line width (full width at half maximum: FWHM) by about 7 % and increase in peak position by about 3x10-4 degrees was detected after 8.5x104 s. Broadening of the 002 peak profile indicated a more negative value of the lattice misfit after the same time period. The results are discussed in the context of the anisotropic arrangement of dislocations at the γ/γ’ interfaces during creep and their rearrangement during the thermal treatment at 1173 K.


2001 ◽  
Vol 696 ◽  
Author(s):  
Gu Hyun Kim ◽  
Jung Bum Choi ◽  
Joo In Lee ◽  
Se-Kyung Kang ◽  
Seung Il Ban ◽  
...  

AbstractWe have studied infrared photoluminescence (PL) and x-ray diffraction (XRD) of 400 nm and 1500 nm thick InAs epilayers on GaAs, and 4 nm thick InAs on graded InGaAs layer with total thickness of 300 nm grown by molecular beam epitaxy. The PL peak positions of 400 nm, 1500 nm and 4 nm InAs epilayer measured at 10 K are blue-shifted from that of InAs bulk by 6.5, 4.5, and 6 meV, respectively, which can be largely explained by the residual strain in the epilayer. The residual strain caused by the lattice mismatch between InAs and GaAs or graded InGaAs/GaAs was observed from XRD measurements. While the PL peak position of 400 nm thick InAs layer is linearly shifted toward higher energy with increase in excitation intensity ranging from 10 to 140 mW, those of 4 nm InAs epilayer on InGaAs and 1500 nm InAs layer on GaAs is gradually blue-shifted and then, saturated above a power of 75 mW. These results suggest that adopting a graded InGaAs layer between InAs and GaAs can efficiently reduce the strain due to lattice mismatch in the structure of InAs/GaAs.


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