Effect of Load and Interface Materials on Thermal Contact Resistance between Similar and Dissimilar Materials

2014 ◽  
Vol 592-594 ◽  
pp. 1493-1497 ◽  
Author(s):  
Swamy R. Narayana ◽  
Prabhu K. Narayan
Keyword(s):  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Dissimilar Materials ◽  
Lead Free ◽  
Thermal Interface Materials ◽  
Lead Free Solder ◽  
Thermal Interface ◽  
Free Solder ◽  
Interface Materials

The thermal contact resistance (TCR) between similar and dissimilar materials (copper, aluminium, brass and type 304 stainless steel) was assessed. Copper foil, aluminium foil, lead and Sn-9Zn lead free solder were selected as thermal interface materials (TIMs). The interfacial contact pressure was varied by application of load on materials in contact. The interfacial heat flux was estimated by solving the inverse heat conduction problem (IHCP). At higher load, the temporal variation of thermal contact resistance showed early occurrence of peak and lower values of TCR. The use of thermal interface materials reduced the contact resistance between the hot source and cold sink materials. Among the interface materials used, Sn-9Zn lead free solder showed the lowest contact resistance. This was attributed to the solid to liquid phase transformation at higher temperatures and the conformance of the interface material to surfaces in contact. Factorial experiments were carried out to determine the significance of experimental variables on TCR. The analysis showed that the effect of applied load on TCR was significant compared to other parameters.

scholarly journals Noncured Graphene Thermal Interface Materials for High-Power Electronics: Minimizing the Thermal Contact Resistance

Nanomaterials ◽  
2021 ◽  
Vol 11 (7) ◽  
pp. 1699
Author(s):  
Sriharsha Sudhindra ◽  
Fariborz Kargar ◽  
Alexander A. Balandin
Keyword(s):  
Contact Resistance ◽  
High Power ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Wide Band ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Total Thermal Resistance ◽  
Thermal Interface ◽  
Interface Materials

We report on experimental investigation of thermal contact resistance, RC, of the noncuring graphene thermal interface materials with the surfaces characterized by different degree of roughness, Sq. It is found that the thermal contact resistance depends on the graphene loading, ξ, non-monotonically, achieving its minimum at the loading fraction of ξ ~15 wt %. Decreasing the surface roughness by Sq~1 μm results in approximately the factor of ×2 decrease in the thermal contact resistance for this graphene loading. The obtained dependences of the thermal conductivity, KTIM, thermal contact resistance, RC, and the total thermal resistance of the thermal interface material layer on ξ and Sq can be utilized for optimization of the loading fraction of graphene for specific materials and roughness of the connecting surfaces. Our results are important for the thermal management of high-power-density electronics implemented with diamond and other wide-band-gap semiconductors.

Surface Chemistry and Characteristics Based Model for the Thermal Contact Resistance of Fluidic Interstitial Thermal Interface Materials

2001 ◽  
Vol 123 (5) ◽  
pp. 969-975 ◽  
Author(s):  
Ravi S. Prasher
Keyword(s):  
Experimental Data ◽  
Thermal Conductivity ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Thermal Interface Materials ◽  
Heat Spreader ◽  
Thermal Interface ◽  
Thermal Solution ◽  
Interface Materials

Microprocessor powers are increasing at a phenomenal rate, which requires very small thermal resistance between the die (chip) and the ambient, if the current economical methods of conduction and convection cooling are to be utilized. A typical thermal solution in flip chip technology utilizes two levels of thermal interface materials: between the die and the heat spreader, and between the heat spreader and the heat sink. Phase change materials and thermal greases are among the most prominent interstitial thermal interface materials (TIM) used in electronic packaging. These TIMs are typically polymeric matrix loaded with highly conducting filler particles. The dwindling thermal budget has necessitated a better understanding of the thermal resistance of each component of the thermal solution. Thermal conductivity of these particle-laden materials is better understood than their contact resistance. A careful review of the literature reveals the lack of analytical models for the prediction of contact resistance of these types of interstitial materials, which possess fluidic properties. This paper introduces an analytical model for the thermal contact resistance of these types of interstitial materials. This model is compared with the experimental data obtained on the contact resistance of these TIMs. The model, which depends on parameters such as, surface tension, contact angle, thermal conductivity, roughness and pressure matches very well with the experimental data at low pressures and is still within the error bars at higher pressures.

scholarly journals Hybrid carbon thermal interface materials for thermoelectric generator devices

2020 ◽  
Vol 10 (1) ◽  
Author(s):  
Seok-Hwan Chung ◽  
Jong Tae Kim ◽  
Dong Hwan Kim
Keyword(s):  
Contact Resistance ◽  
Output Power ◽  
Thermoelectric Generator ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Applied Pressure ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Interface Materials ◽  
Hybrid Carbon

Abstract Thermal interface materials (TIMs) are extensively used in electronic devices as efficient heat transfer materials. We fabricated all-carbon TIMs by hybridizing single-wall carbon nanotubes (SWCNTs) with graphite and demonstrated their performance by applying them to a thermoelectric generator (TEG) device. The hybrid carbon TIM exhibited maximum thermal conductivity when the SWCNT content was near 10 wt%. The TIM thermal contact resistance measured by a home-made calorimeter setup was 2.19 × 10−4 m2K/W, which did not vary with temperature but decreased with applied pressure. Post-treatment of the TIM with a silane coupling agent further reduced the TIM thermal contact resistance by 30%. When the TIM was placed between a TEG device and a copper heat reservoir, the TEG output power increased with the temperature difference across the TEG and applied pressure. Moreover, the post-treatment of the TIM enhanced the output power of the TEG device by up to 18.5%. This work provides a simple and effective pathway towards a carbon-based TIM that can be applied to a high temperature TEG.

Reliability analysis of SnAgCu lead-free solder thermal interface materials in microelectronics

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Mathias Ekpu
Keyword(s):  
Fatigue Life ◽  
Heat Sink ◽  
Flip Chip ◽  
Lead Free ◽  
Thermal Interface Materials ◽  
Lead Free Solder ◽  
Thermal Interface ◽  
Content Type ◽  
Free Solder ◽  
Interface Materials

Purpose In microelectronics industry, the reliability of its components is a major area of concern for engineers. Therefore, it is imperative that such concerns are addressed by using the most reliable materials available. Thermal interface materials (TIMs) are used in electronic devices to bridge the topologies that exists between a heat sink and the flip chip assembly. Therefore, this study aims to investigate the reliability of SAC405 and SAC396 in a microelectronics assembly. Design/methodology/approach In this paper, SnAgCu solder alloys (SAC405 and SAC396) were used as the TIMs. The model, which comprises the chip, TIM and heat sink base, was developed with ANSYS finite element analysis software and simulated under a thermal cycling load of between −40°C and 85°C. Findings The results obtained from this paper were based on the total deformation, stress, strain and fatigue life of the lead-free solder materials. The analyses of the results showed that SAC405 is more reliable than SAC396. This was evident in the fatigue life analysis where it was predicted that it took about 85 days for SAC405 to fail, whereas it took about 13 days for SAC396 to fail. Therefore, SAC405 is recommended as the TIM of choice compared to SAC396 based upon the findings of this investigation. Originality/value This paper is centred on SnAgCu solders used as TIMs. This paper demonstrated that SAC405 is a reliable solder TIM. This can guide manufacturers of electronic products in deciding which SAC solder to apply as TIM during the assembly process.

scholarly journals Surface Modification Using Polydopamine-Coated Liquid Metal Nanocapsules for Improving Performance of Graphene Paper-Based Thermal Interface Materials

Nanomaterials ◽  
2021 ◽  
Vol 11 (5) ◽  
pp. 1236
Author(s):  
Jingyao Gao ◽  
Qingwei Yan ◽  
Xue Tan ◽  
Le Lv ◽  
Jufeng Ying ◽  
...  
Keyword(s):  
Contact Resistance ◽  
Thermal Management ◽  
Heat Dissipation ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Mating Surface ◽  
Graphene Paper ◽  
Interface Materials

Given the thermal management problem aroused by increasing power densities of electronic components in the system, graphene-based papers have raised considerable interest for applications as thermal interface materials (TIMs) to solve interfacial heat transfer issues. Significant research efforts have focused on enhancing the through-plane thermal conductivity of graphene paper; however, for practical thermal management applications, reducing the thermal contact resistance between graphene paper and the mating surface is also a challenge to be addressed. Here, a strategy aimed at reducing the thermal contact resistance between graphene paper and the mating surface to realize enhanced heat dissipation was demonstrated. For this, graphene paper was decorated with polydopamine EGaIn nanocapsules using a facile dip-coating process. In practical TIM application, there was a decrease in the thermal contact resistance between the TIMs and mating surface after decoration (from 46 to 15 K mm2 W−1), which enabled the decorated paper to realize a 26% enhancement of cooling efficiency compared with the case without decoration. This demonstrated that this method is a promising route to enhance the heat dissipation capacity of graphene-based TIMs for practical electronic cooling applications.

scholarly journals Thermal Properties of the Graphene Composites: Application of Thermal Interface Materials

2018 ◽  
Vol 7 (4.33) ◽  
pp. 530
Author(s):  
Mazlan Mohamed ◽  
Mohd Nazri Omar ◽  
Mohamad Shaiful Ashrul Ishak ◽  
Rozyanty Rahman ◽  
Zaiazmin Y.N ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Matrix Material ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Uniform Thickness ◽  
Thermal Interface ◽  
Interface Materials ◽  
Main Material

Epoxy mixed with others filler for thermal interface material (TIM) had been well conducted and developed. There are problem occurs when previous material were used as matrix material likes epoxy that has non-uniform thickness of thermal interface material produce, time taken for solidification and others. Thermal pad or thermal interface material using graphene as main material to overcome the existing problem and at the same time to increase thermal conductivity and thermal contact resistance. Three types of composite graphene were used for thermal interface material in this research. The sample that contain 10 wt. %, 20 wt. % and 30 wt. % of graphene was used with different contain of graphene oxide (GO).  The thermal conductivity of thermal interface material is both measured and it was found that the increase of amount of graphene used will increase the thermal conductivity of thermal interface material. The highest thermal conductivity is 12.8 W/ (mK) with 30 w. % graphene. The comparison between the present thermal interface material and other thermal interface material show that this present graphene-epoxy is an excellent thermal interface material in increasing thermal conductivity.  

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