Growth of Cu-Zn5 and Cu5Zn8 Intermetallic Compounds in the Sn-9Zn/Cu Joint during Liquid State Aging

2010 ◽  
Vol 173 ◽  
pp. 90-95 ◽  
Author(s):  
Ramani Mayappan ◽  
Rosyaini A. Zaman ◽  
Zalina Z. Abidin ◽  
Fatinnajihah Alias Asmawati ◽  
Mohd Nazree Derman
Keyword(s):  
Liquid State ◽  
Copper Substrate ◽  
Lead Free ◽  
Lead Free Solder ◽  
X Ray ◽  
Soldering Temperature ◽  
Soldering Time ◽  
Free Solder ◽  
Thickness Measurements ◽  
Scanning Electron

The phase and intermetallic thickness of Cu-Zn5 and Cu5Zn8 has been investigated under liquid state aging using reflow method. Both intermetallics were formed by reacting Sn-9Zn lead free solder with copper substrate. Scanning electron microscope (SEM) was used to see the morphology of the phases and energy dispersive x-ray (EDX) was used to estimate the elemental compositions of the phases. The morphology of the Cu5Zn8 phase was rather flat but when the soldering temperature and time increases, the morphology becomes scallop. Intermetallic thickness measurements show that the thickness of Cu-Zn5 decreases with increasing soldering time and temperature. Whereas, the thickness of Cu5Zn8 intermetallic increases with soldering time and temperature.

Morphology and Intermetallic Study of (Sn-8Zn-3Bi)-1Ni Solder under Liquid State Aging

2015 ◽  
Vol 1087 ◽  
pp. 162-166
Author(s):  
Nor Aishah Jasli ◽  
Hamidi Abd Hamid ◽  
Ramani Mayappan
Keyword(s):  
Liquid State ◽  
Copper Substrate ◽  
Lead Free ◽  
Lead Free Solder ◽  
Reflow Time ◽  
Intermetallic Formation ◽  
X Ray ◽  
Ni Addition ◽  
Free Solder ◽  
Scanning Electron

This study investigated the effect of Ni addition on intermetallic formation in the Sn-8Zn-3Bi solder under liquid state aging. The intermetallic compounds were formed by reacting the solder alloy with copper substrate. Different reflow time was used at temperature 220°C. Morphology of the phases formed was observed using scanning electron microscope (SEM) and in order to determine elemental compositions of the phases, energy dispersive x-ray (EDX) was used. The formation of the reaction layer led by Cu5Zn8 intermetallic and then followed by Cu6Sn5 and Cu3Sn when reflow time increases. Keywords: lead free solder, intermetallic, Cu5Zn8, Cu6Sn5, liquid state aging.

scholarly journals INTERMETALLIC COMPOUNDS FORMATION OF SOLDER ALLOYS ON Ni/Au SURFACE FINISH COPPER

2020 ◽  
Vol 26 (4) ◽  
pp. 184-187
Author(s):  
Ngoc Binh Duong
Keyword(s):  
Intermetallic Compounds ◽  
Melting Temperature ◽  
Surface Finish ◽  
Copper Substrate ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Soldering Temperature ◽  
Substrate Interface ◽  
Free Solder

Intermetallic compounds (IMCs) formation between lead-free solder alloys (Sn-9Zn and Sn-8Zn-3Bi) and Ni/Au surface finish copper substrate were studied. Reaction between the solder and the substrate was carried out at regular soldering temperature, approx. 50 °C above the melting temperature of the solder alloys. Results indicated that Au-Zn was the IMC formed at the interface and the Au layer which is electro-plated on the substrate has completely dissolved into the solder alloys. The amount of Au available at the interface is an important factor that influent the morphology of the IMC with thicker Au layer on the substrate resulted in thicker layer of IMC at the interface. Although Bi does not taken part in the composition of IMC, it influent the formation of IMC, the IMC formed in the Sn9Zn/substrate interface was Au5Zn3, meanwhile it was g2-AuZn3 in the Sn-8Zn-3Bi/substrate interface.

scholarly journals Influences of soldering time on wettability and intermetallic phase between Sn-3.0Cu solder and copper substrate

2018 ◽  
Vol 192 ◽  
pp. 01024
Author(s):  
Niwat Mookam ◽  
Kannachai Kanlayasiri
Keyword(s):  
Intermetallic Phase ◽  
Copper Substrate ◽  
Intermetallic Phases ◽  
Lead Free ◽  
Lead Free Solder ◽  
Hexagonal Crystal ◽  
Reflow Soldering ◽  
Soldering Time ◽  
Diffusion Controlled ◽  
Free Solder

In this paper, the influences of soldering time on the wettability and intermetallic phase between Sn-3.0Cu lead-free solder and copper substrate were investigated. Reflow soldering was performed at 350 ° C under variable soldering times of 10, 20, 40, 60, 120, 240 and 480 s. The results indicated that the wettability and intermetallic growth depend on the soldering time. In addition, the Cu6Sn5 and Cu3Sn intermetallic phases with a hexagonal crystal structure were found between the lead-free solder and the copper substrate. The growth of intermetallic phases increased with soldering time, and the growth of intermetallic phases remarkably depended on grain boundary diffusion and was volume diffusion-controlled for Cu6Sn5 and Cu3Sn, respectively.

Wetting and Intermetallic Study between Sn-3.5Ag-1.0Cu-xZn Lead-Free Solders and Copper Substrate (x = 0, 0.1, 0.4, 0.7)

2012 ◽  
Vol 501 ◽  
pp. 150-154 ◽  
Author(s):  
Ramani Mayappan
Keyword(s):  
Copper Substrate ◽  
Electronics Industry ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Spreading Area ◽  
Cu Substrate ◽  
Soldering Time ◽  
Free Solder ◽  
Lead Free Solders

The development of lead-free solders has been an essential task in the electronics industry because of the restriction of lead use by legislation. Among the candidates, Sn-Ag-Cu group of solder alloys have great advantages to replace the conventional Sn-Pb solder. In this study, the wetting and intermetallic study between Sn-3.5Ag-1.0Cu-xZn lead-free solder reacting on copper substrate were investigated under different soldering conditions. The addition of 0.7wt% of Zn improved the wettability on Cu substrate since it has the highest spreading area at 310°C. The Cu6Sn5 and Cu3Sn phases are the main interface intermetallic formed and these intermetallics increased in thickness with time and temperature. At 270°C, the addition of 0.7wt% Zn retarded the growth of Cu3Sn intermetallic until 10 min of the soldering time. Generally the addition of Zn was beneficial in retarding the total intermetallic thickness.

Quantitative Evaluation of Voids in Lead Free Solder Joints

2015 ◽  
Vol 772 ◽  
pp. 284-289 ◽  
Author(s):  
Sabuj Mallik ◽  
Jude Njoku ◽  
Gabriel Takyi
Keyword(s):  
Solder Bump ◽  
Solder Joints ◽  
Void Formation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
X Ray ◽  
Size And Shape ◽  
Solder Bumps ◽  
Free Solder

Voiding in solder joints poses a serious reliability concern for electronic products. The aim of this research was to quantify the void formation in lead-free solder joints through X-ray inspections. Experiments were designed to investigate how void formation is affected by solder bump size and shape, differences in reflow time and temperature, and differences in solder paste formulation. Four different lead-free solder paste samples were used to produce solder bumps on a number of test boards, using surface mount reflow soldering process. Using an advanced X-ray inspection system void percentages were measured for three different size and shape solder bumps. Results indicate that the voiding in solder joint is strongly influenced by solder bump size and shape, with voids found to have increased when bump size decreased. A longer soaking period during reflow stage has negatively affectedsolder voids. Voiding was also accelerated with smaller solder particles in solder paste.

scholarly journals Effect of the bismuth content on the interface reactions between copper substrate and Sn-Zn-Al-Bi lead-free solder

2005 ◽  
Vol 41 (Extra) ◽  
pp. 208-212
Author(s):  
D. Soares ◽  
C. Vilarinho ◽  
J. Barbosa ◽  
R. Silva ◽  
F. Castro
Keyword(s):  
Copper Substrate ◽  
Lead Free ◽  
Lead Free Solder ◽  
Bismuth Content ◽  
Interface Reactions ◽  
Free Solder

SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly

2018 ◽  
Vol 30 (1) ◽  
pp. 1-13 ◽  
Author(s):  
Fakhrozi Che Ani ◽  
Azman Jalar ◽  
Abdullah Aziz Saad ◽  
Chu Yee Khor ◽  
Roslina Ismail ◽  
...  
Keyword(s):  
Electron Microscope ◽  
Solder Joint ◽  
Solder Joints ◽  
Ion Beam ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Content Type ◽  
X Ray ◽  
Free Solder

Purpose This paper aims to investigate the characteristics of ultra-fine lead-free solder joints reinforced with TiO2 nanoparticles in an electronic assembly. Design/methodology/approach This study focused on the microstructure and quality of solder joints. Various percentages of TiO2 nanoparticles were mixed with a lead-free Sn-3.5Ag-0.7Cu solder paste. This new form of nano-reinforced lead-free solder paste was used to assemble a miniature package consisting of an ultra-fine capacitor on a printed circuit board by means of a reflow soldering process. The microstructure and the fillet height were investigated using a focused ion beam, a high-resolution transmission electron microscope system equipped with an energy dispersive X-ray spectrometer (EDS), and a field emission scanning electron microscope coupled with an EDS and X-ray diffraction machine. Findings The experimental results revealed that the intermetallic compound with the lowest thickness was produced by the nano-reinforced solder with a TiO2 content of 0.05 Wt.%. Increasing the TiO2 content to 0.15 Wt.% led to an improvement in the fillet height. The characteristics of the solder joint fulfilled the reliability requirements of the IPC standards. Practical implications This study provides engineers with a profound understanding of the characteristics of ultra-fine nano-reinforced solder joint packages in the microelectronics industry. Originality/value The findings are expected to provide proper guidelines and references with regard to the manufacture of miniaturized electronic packages. This study also explored the effects of TiO2 on the microstructure and the fillet height of ultra-fine capacitors.

The Effect of Dipping Time to the Intermetallic Compound and Free Solder Thickness of Sn-Cu-Ni (SN100C) Lead-Free Solder Coating

2015 ◽  
Vol 754-755 ◽  
pp. 493-497 ◽  
Author(s):  
Fatin Afeeqa Mohd Sobri ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Che Mohd Ruzaidi ◽  
Pavithiran Narayanan
Keyword(s):  
Intermetallic Compound ◽  
Molten Solder ◽  
Lead Free ◽  
Test Machine ◽  
Lead Free Solder ◽  
Time Scanning ◽  
Wetting Time ◽  
Free Solder ◽  
Scanning Electron ◽  
Dipping Time

The effect of dipping time to the intermetallic compound and free solder thickness of Sn-Cu-Ni (SN100C) lead-free solder has been investigated. Dipping of copper strips in molten solder was carried out using GEN3 solderability test machine with 20 s, 60 s, 120 s, 180 s, and 240 s of dipping time. Scanning Electron Microscope (SEM) was used to observe the solder coating on the copper strips. Thickness of IMC, free solder and total solder coating was calculated. The influence of dipping time was established. The results indicated that longer dipping time produced high IMC thickness while the free solder thickness reduced with the growth of IMC. Solderability test was also conducted to know the wettability of SN100C coating for the lowest dipping time which had resulted in 1.571 s of wetting time and 4.066 mN of maximum force.

Intermetallic Study on the Modified Sn-3.5Ag-1.0Cu-1.0Zn Lead Free Solder

2016 ◽  
Vol 857 ◽  
pp. 3-7 ◽  
Author(s):  
Ramani Mayappan ◽  
Nur Nadiah Zainal Abidin ◽  
Noor Asikin Ab Ghani ◽  
Iziana Yahya ◽  
Norlin Shuhaime
Keyword(s):  
Electron Microscope ◽  
Powder Metallurgy ◽  
Joint Strength ◽  
Lead Free ◽  
Environmental Concerns ◽  
Lead Free Solder ◽  
Free Solder ◽  
Lead Free Solders ◽  
Powder Metallurgy Route ◽  
Scanning Electron

Due to environmental concerns, lead-free solders were introduced to replace the lead-based solders in microelectronics devices technology. Although there are many lead-free solders available, the Sn-Ag-Cu solders are considered the best replacement due to their good wettability and joint strength. Although the Sn-Ag-Cu solders are accepted widely, but there are still some room for improvement. In this study, 1wt% Zn, which can be considered high percentage for a dopant, was added into the solder via powder metallurgy route. The effects of adding this dopant into the Sn-3.5Ag-1.0Cu solder on the interface intermetallic and thickness were investigated. The intermetallics phases formed were observed under Scanning Electron Microscope (SEM) and their thicknesses were measured. The SEM results showed the presence of Cu6Sn5, Cu3Sn and (Cu,Zn)6Sn5 intermetallics. It can be concluded that Zn behaved as retarding agent and significantly retarded the growth of Cu-Sn intermetallics.

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