Appling Fuzzy Logic for Optimization Formulation of Sapphire Precision Grinding

2010 ◽  
Vol 129-131 ◽  
pp. 1217-1221
Author(s):  
Xiao Wang ◽  
Cong Da Lu
Keyword(s):  
Fuzzy Logic ◽  
Surface Quality ◽  
Fuzzy Theory ◽  
Engineering Application ◽  
Processing Parameters ◽  
Quality Parameters ◽  
Precision Grinding ◽  
Processing Efficiency ◽  
Optimization Parameters

Fuzzy logic is a mathematical theory of inexact reasoning that allows modeling of the reasoning process of humans in linguistic terms, and it is an effective method approved to deal with the fuzzy objects in many areas of engineering application. The purpose of this paper is to explore the relationship between grinding process parameters and surface quality parameters of sapphire wafer by using fuzzy theory and to obtain optimization parameters to enhance the processing efficiency and higher the surface quality of the sapphire in ultra-precision grinding. This paper sets up the triangular fuzzy logic model between processing parameters and surface quality parameters for precision lapping of sapphire, and 2 groups of optimization parameters are selected. Finally, the experimental results verified that the optimization parameters of sapphire lapping obtained by using fuzzy logic which can improve the grinding efficiency and the surface quality of sapphire.

Observation in the Surface Roughness of Silicon Wafer during Semi-Fixed Abrasive Machining with Large Grains

2009 ◽  
Vol 69-70 ◽  
pp. 253-257
Author(s):  
Ping Zhao ◽  
Jia Jie Chen ◽  
Fan Yang ◽  
K.F. Tang ◽  
Ju Long Yuan ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Surface Quality ◽  
Silicon Wafer ◽  
Processing Parameters ◽  
Wafer Surface ◽  
Abrasive Machining ◽  
Fixed Abrasive ◽  
Is Failure ◽  
Better Than

Semi-fixed abrasive is a novel abrasive. It has a ‘trap’ effect on the hard large grains that can prevent defect effectively on the surface of the workpiece which is caused by large grains. In this paper, some relevant experiments towards silicon wafers are carried out under the different processing parameters on the semi-fixed abrasive plates, and 180# SiC is used as large grains. The processed workpieces’ surface roughness Rv are measured. The experimental results show that the surface quality of wafer will be worse because of higher load and faster rotating velocity. And it can make a conclusion that the higher proportion of bond of the plate, the weaker of the ‘trap’ effect it has. Furthermore the wet environment is better than dry for the wafer surface in machining. The practice shows that the ‘trap’ effect is failure when the workpiece is machined by abrasive plate which is 4.5wt% proportion of bond in dry lapping.

scholarly journals Optimization Parameters Tooling Design to Increase the Surface Quality of Orthotic Insole Shoes using the Taguchi Approach and Surface Response Methods

2019 ◽  
Vol 13 ◽  
pp. 47-52
Author(s):  
Baju Bawono ◽  
Paulus Wisnu Anggoro ◽  
Muhamad Tauviqirrahman ◽  
Jamari Jamari ◽  
Athanasius P. Bayuseno ◽  
...  
Keyword(s):  
Surface Quality ◽  
Taguchi Approach ◽  
Surface Response ◽  
Optimization Parameters ◽  
Tooling Design

An efficient 5-axis toolpath optimization algorithm for machining parts with abrupt curvature

2015 ◽  
Vol 231 (9) ◽  
pp. 1609-1621 ◽  
Author(s):  
Ji-Yun Qin ◽  
Zhen-Yuan Jia ◽  
Jian-Wei Ma ◽  
Zong-Jin Ren ◽  
De-Ning Song
Keyword(s):  
Global Optimization ◽  
Coordinate System ◽  
Surface Quality ◽  
Turbine Blade ◽  
Optimization Algorithm ◽  
Tool Orientation ◽  
Processing Efficiency ◽  
Rotary Axes ◽  
Toolpath Optimization

The kinematical behavior of 5-axis machine tool introduced by toolpath calculation has a close relation with processing efficiency and quality of parts. For the category of sculptured surface parts with abrupt curvature, such as turbine blade and fixed guide vane, the most commonly utilized spiral contouring toolpath modes usually encounter some trouble during actual machining, the reason lies in the difficult tool orientation control near the edge of such parts. However, the global optimization for the spiral toolpath means increased computation burden, and so it is time consuming. In this paper, an efficient 5-axis toolpath optimization algorithm is presented, and the objective is to smooth the rotary axes’ motion caused by drastically changed tool orientation on spiral toolpath for abrupt curvature parts machining. To reduce the computation burden, only path segments on the spiral trajectory-owned weak kinematic performance are selected for further optimizing. To obtain smoother motion for rotary axes, the specific optimization computation for the selected path segments is conducted in the Machine Coordinate System (MCS) instead of the Part Coordinate System (PCS). The optimization model is constructed and a related solution method is presented to ensure the high-performance optimization. The complete optimization algorithm is demonstrated on a spiral 5-axis toolpath for the turbine blade finish machining, and the result shows that only 25.9% optimization computation is needed compared with global optimization algorithm. And then, the actual machining experiments are carried out by using paraffin as cut material, and the machining time with optimized toolpath is decreased by 19.7% compared with initial toolpath. In addition, the surface quality of parts is significantly improved after conducting the optimization. This study proves that the proposed algorithm can significantly improve the processing efficiency and surface quality of parts with abrupt curvature and provides an efficient method to optimize the spiral 5-axis toolpath used for finish machining parts with abrupt curvature.

The Key Technology in Extrusion Tapping of Internal Thread

2011 ◽  
Vol 295-297 ◽  
pp. 2636-2641 ◽  
Author(s):  
Yong Yi Li ◽  
Sheng Dun Zhao
Keyword(s):  
Surface Quality ◽  
Automotive Industry ◽  
Hole Diameter ◽  
Internal Thread ◽  
Processing Efficiency ◽  
Forming Quality ◽  
Key Technology ◽  
Modern Manufacturing ◽  
Traditional Process

Internal thread processing is an indispensable procedure in manufacture, its processing efficiency and quality become more and more important in modern manufacturing, especially in aerospace and automotive industry. Compared with the traditional process of cut tapping of internal thread, the process of extrusion tapping of internal thread possesses the following advantages: without chip, higher precision, better surface quality, better continuity of metallic, greater efficient, greater strength, longer tool life. This paper firstly introduces the current research status of extrusion tapping of internal thread, elaborates the principle and characteristic of extrusion tapping, analyzes the matal plastic flow law and thread forming characteristic during tapping, then generalizes the influencing law of the key technology on thread forming quality, such as extrusion tap type, lead hole diameter, tapping speed and friction. Furthermore, puts forward some improvement approach to reduce tapping torque and enhance forming quality of internal thread.

Applying TRIZ for Optimization Formulation of Sapphire Precision Lapping

2010 ◽  
Vol 102-104 ◽  
pp. 564-567 ◽  
Author(s):  
Xiao Wang ◽  
Cong Da Lu ◽  
Tao Hong
Keyword(s):  
Experimental Data ◽  
High Efficiency ◽  
Processing Parameters ◽  
Parameters Optimization ◽  
Processing Theory ◽  
Optimization Formulation ◽  
The Face ◽  
Optimization Parameters ◽  
Set Up

This paper presents the parameters optimization by TRIZ theory in the precision lapping of sapphire in order to realize the high efficiency and low damaged lapping. The TRIZ theory was used to optimize processing parameters of sapphire precision lapping based on much experimental data of lapping, then the conflict matrix of internal contradictions was set up and the optimization parameters was obtained. The result of experiment indicated that the face quality of sapphire was improved greatly after optimized by TRIZ. There was a conclusion that TRIZ theory can be used to optimize the processing parameters of sapphire precision lapping which is important to enrich the processing theory of sapphire.

SIMULATION ON THE GROUND WAFER SHAPE IN WAFER ROTATIONAL GRINDING

2011 ◽  
Vol 10 (01) ◽  
pp. 175-182
Author(s):  
KEYAN TANG ◽  
RENKE KANG
Keyword(s):  
Surface Quality ◽  
Silicon Wafer ◽  
Pitch Angle ◽  
Porous Ceramic ◽  
Processing Parameters ◽  
Simulation System ◽  
Mathematics Model ◽  
Simulation Results ◽  
The Relationship

During the wafer rotational grinding, the wafer is located on a porous ceramic vacuum chuck, so there are many factors that can affect the wafer shape in the process of the wafer grinding. The wafer shape has an important influence on the surface quality of the silicon wafer and it will be greatly different if the processing parameters are different. So in this paper, based on a mathematics model of the ground wafer shape which has been developed, a simulation system of the wafer shape was made out by using Visual C++ and OpenGL. The relationship between the parameters and the wafer shape was researched and analyzed. The simulation results showed that the roll angle and the pitch angle had the greatest impact on the wafer shape. And the simulation results with different parameters have been compared with each other for the final conclusions. So the results demonstrate the mathematics model is reasonable and the simulation system is of high simulating accuracy, and the ground wafer shape can be predicted very well by it. The research results are significant to logically choose the wafer grinding parameters and effectively control the ground wafer shape.

Experimental Study on the Precision Lapping of Sapphire Substrate

2011 ◽  
Vol 215 ◽  
pp. 291-294 ◽  
Author(s):  
Xiao Wang ◽  
Cong Da Lu ◽  
Dong Hui Wen
Keyword(s):  
Experimental Study ◽  
Grain Size ◽  
Surface Quality ◽  
Sapphire Substrate ◽  
Removal Rate ◽  
Processing Parameters ◽  
Quality Parameters ◽  
Surface Shape ◽  
Sapphire Surface ◽  
Profile Tolerance

Experimental research on the surface quality parameters such as roughness and removal rate in the precision lapping of sapphire was promoted in this paper, effects of processing parameters as load, speed of rotation, grain size and density on sapphire surface quality was studied by experiments. Results showed that lapping load and rotate speed were the most important factors on the removal rate, grain size played a key role in the removal rate and roughness under the same conditions, profile tolerance of surface shape depends on the flatness.

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