Experimental Study on the Precision Lapping of Sapphire Substrate

2011 ◽  
Vol 215 ◽  
pp. 291-294 ◽  
Author(s):  
Xiao Wang ◽  
Cong Da Lu ◽  
Dong Hui Wen
Keyword(s):  
Experimental Study ◽  
Grain Size ◽  
Surface Quality ◽  
Sapphire Substrate ◽  
Removal Rate ◽  
Processing Parameters ◽  
Quality Parameters ◽  
Surface Shape ◽  
Sapphire Surface ◽  
Profile Tolerance

Experimental research on the surface quality parameters such as roughness and removal rate in the precision lapping of sapphire was promoted in this paper, effects of processing parameters as load, speed of rotation, grain size and density on sapphire surface quality was studied by experiments. Results showed that lapping load and rotate speed were the most important factors on the removal rate, grain size played a key role in the removal rate and roughness under the same conditions, profile tolerance of surface shape depends on the flatness.

Study on the Abrasive Effecting Factors of the Removal Rate during Dual-Lapping Sapphire Wafer

2009 ◽  
Vol 407-408 ◽  
pp. 550-554 ◽  
Author(s):  
Ke Hua Zhang ◽  
Dong Hui Wen ◽  
Ju Long Yuan
Keyword(s):  
Qualitative Analysis ◽  
Surface Quality ◽  
Material Removal ◽  
Removal Rate ◽  
Sapphire Wafer ◽  
Sapphire Surface ◽  
Removal Ratio ◽  
Set Up ◽  
Three Body ◽  
Material Removal Mode

Dual-lapping was a process to planarize the surface of the sapphire wafer, the nature of surface&subsurface damage and the surface uniformity was depended on the material removal mode and materials removal ratio. Material removal mode was studied in this paper, and the model of material removal was set up too. The SEM was used to scan the processed sapphire surface and the different removal style (two body and three body) were discovered. This research provided valuable insights into the material removal ratio and the dependence of lapping-induced damage on dual-lapping conditions, the asymmetry of abrasive granularity brought on the different materials removal mode and the surface asymmetry. The model was set up to qualitative analysis the material removal ratio in dual-lapping of sapphire, obtain the reasonable MMR and optimize the surface quality and the planarization result.

Appling Fuzzy Logic for Optimization Formulation of Sapphire Precision Grinding

2010 ◽  
Vol 129-131 ◽  
pp. 1217-1221
Author(s):  
Xiao Wang ◽  
Cong Da Lu
Keyword(s):  
Fuzzy Logic ◽  
Surface Quality ◽  
Fuzzy Theory ◽  
Engineering Application ◽  
Processing Parameters ◽  
Quality Parameters ◽  
Precision Grinding ◽  
Processing Efficiency ◽  
Optimization Parameters

Fuzzy logic is a mathematical theory of inexact reasoning that allows modeling of the reasoning process of humans in linguistic terms, and it is an effective method approved to deal with the fuzzy objects in many areas of engineering application. The purpose of this paper is to explore the relationship between grinding process parameters and surface quality parameters of sapphire wafer by using fuzzy theory and to obtain optimization parameters to enhance the processing efficiency and higher the surface quality of the sapphire in ultra-precision grinding. This paper sets up the triangular fuzzy logic model between processing parameters and surface quality parameters for precision lapping of sapphire, and 2 groups of optimization parameters are selected. Finally, the experimental results verified that the optimization parameters of sapphire lapping obtained by using fuzzy logic which can improve the grinding efficiency and the surface quality of sapphire.

scholarly journals Effects of Processing Parameters on the Surface Quality of Wrought Ni-based Superalloy by Ultrasonic Assisted Electrochemical Grinding

2021 ◽  
Author(s):  
Yucai Ma ◽  
Yingyue Yin ◽  
J H Zhang ◽  
Jinxing Huo
Keyword(s):  
Surface Quality ◽  
Current Density ◽  
Removal Rate ◽  
High Strength ◽  
Processing Parameters ◽  
Electrochemical Dissolution ◽  
Effective Removal ◽  
Ultrasonic Assisted ◽  
Electrochemical Grinding

Abstract Ni-based GH625 superalloy has been widely employed in the aerospace industry due to its high strength, outstanding corrosion resistance and high temperature resistance. A novel hybrid processing method of ultrasonic-assisted electrochemical grinding (UAECG) can achieve the high-effective removal rate for difficult-to-process materials and thereby avoids the stray corrosion during the process. This study systematically investigated the electrochemical dissolution behaviors of GH625 alloy at low current density and effects of processing parameters on its surface roughness. A qualitative model was proposed to further reveal its removal mechanism for GH625 alloy during UAECG process. Polarization curves depicted that an efficient and stable electrochemical dissolution was achieved at an appropriate temperature (20°C) and concentration (10 wt.%) of NaNO 3 electrolyte. The findings also revealed that selective corrosion preferentially occurred on the grain boundary or near the NbC carbides under different current density corrosion circumstance. Compared with ECG process, the excellent surface quality ( R a = 0.37 μm) and taper of the small holes (taper = 0.04 ±0.005°) are obtained at the optimized condition of pulse voltage of 5.8V, feed rate of 0.6mm /min, cathode speed of 12kr /min and ultrasonic drive amplitude of 60 % by UAECG technology.

Surface Modification and its Influence on the Microstructure and Creep Resistance of Nickel Based Superalloy René 77 / Modyfikacja Powierzchniowa Oraz Jej Wpływ Na Mikrostrukture I Wytrzymałosc Na Pełzanie Odlewów Z Nadstopu Niklu Ren´E 77

2013 ◽  
Vol 58 (1) ◽  
pp. 95-98 ◽  
Author(s):  
M. Zielinska ◽  
J. Sieniawski
Keyword(s):  
Mechanical Properties ◽  
Grain Size ◽  
Surface Modification ◽  
Turbine Blades ◽  
Processing Parameters ◽  
Grain Structure ◽  
Creep Tests ◽  
Cobalt Aluminate ◽  
Nickel Based Superalloy ◽  
Average Grain Size

Superalloy René 77 is very wide used for turbine blades, turbine disks of aircraft engines which work up to 1050°C. These elements are generally produced by the investment casting method. Turbine blades produced by conventional precision casting methods have coarse and inhomogeneous grain structure. Such a material often does not fulfil basic requirements, which concern mechanical properties for the stuff used in aeronautical engineering. The incorporation of controlled grain size improved mechanical properties. This control of grain size in the casting operation was accomplished by the control of processing parameters such as casting temperature, mould preheating temperature, and the use of grain nucleates in the face of the mould. For nickel and cobalt based superalloys, it was found that cobalt aluminate (CoAl2O4) has the best nucleating effect. The objective of this work was to determine the influence of the inoculant’s content (cobalt aluminate) in the surface layer of the ceramic mould on the microstructure and mechanical properties at high temperature of nickel based superalloy René 77. For this purpose, the ceramic moulds were made with different concentration of cobalt aluminate in the primary slurry was from 0 to 10% mass. in zirconium flour. Stepped and cylindrical samples were casted for microstructure and mechanical examinations. The average grain size of the matrix ( phase), was determined on the stepped samples. The influence of surface modification on the grain size of up to section thickness was considered. The microstructure investigations with the use of light microscopy and scanning electron microscopy (SEM) enable to examine the influence of the surface modification on the morphology of ’ phase and carbides precipitations. Verification of the influence of CoAl2O4 on the mechanical properties of castings were investigated on the basis of results obtained form creep tests.

scholarly journals Relevance of processing parameters for grain growth of metal halide perovskites with nanoimprint

2021 ◽  
Vol 127 (9) ◽  
Author(s):  
Andre Mayer ◽  
Tobias Haeger ◽  
Manuel Runkel ◽  
Johannes Rond ◽  
Johannes Staabs ◽  
...  
Keyword(s):  
Grain Size ◽  
Grain Growth ◽  
Secondary Growth ◽  
Processing Parameters ◽  
Post Processing ◽  
Perovskite Layer ◽  
Processing Step ◽  
Similar Preparation ◽  
Materials Used ◽  
Log Normal

AbstractThe quality and the stability of devices prepared from polycrystalline layers of organic–inorganic perovskites highly depend on the grain sizes prevailing. Tuning of the grain size is either done during layer preparation or in a post-processing step. Our investigation refers to thermal imprint as the post-processing step to induce grain growth in perovskite layers, offering the additional benefit of providing a flat surface for multi-layer devices. The material studied is MAPbBr3; we investigate grain growth at a pressure of 100 bar and temperatures of up to 150 °C, a temperature range where the pressurized stamp is beneficial to avoid thermal degradation. Grain coarsening develops in a self-similar way, featuring a log-normal grain size distribution; categories like ‘normal’ or ‘secondary’ growth are less applicable as the layers feature a preferential orientation already before imprint-induced grain growth. The experiments are simulated with a capillary-based growth law; the respective parameters are determined experimentally, with an activation energy of Q ≈ 0.3 eV. It turns out that with imprint as well the main parameter relevant to grain growth is temperature; to induce grain growth in MAPbBr3 within a reasonable processing time a temperature of 120 °C and beyond is advised. An analysis of the mechanical situation during imprint indicates a dominance of thermal stress. The minimization of elastic energy and surface energy together favours the development of grains with (100)-orientation in MaPbBr3 layers. Furthermore, the experiments indicate that the purity of the materials used for layer preparation is a major factor to achieve large grains; however, a diligent and always similar preparation of the layer is equally important as it defines the pureness of the resulting perovskite layer, intimately connected with its capability to grow. The results are not only of interest to assess the potential of a layer with respect to grain growth when specific temperatures and times are chosen; they also help to rate the long-term stability of a layer under temperature loading, e.g. during the operation of a device.

Study on the Behavior of the Cast-Iron Bonded Grinding Wheel to Machining Properties of Hard and Brittle Materials

2007 ◽  
Vol 24-25 ◽  
pp. 229-232
Author(s):  
S.L. Ma ◽  
Wei Li ◽  
Cong Rong Zhu ◽  
J. Zhang ◽  
H.C. Ye
Keyword(s):  
Grain Size ◽  
Cast Iron ◽  
Tungsten Carbide ◽  
Surface Quality ◽  
Ground Surface ◽  
Grinding Wheel ◽  
Different Grain Size ◽  
Grinding Efficiency ◽  
Machining Properties

Tungsten carbide which is a hard and brittle material was ground by cast-iron bonded diamond wheel with ELID (Electrolytic In-Process Dressing) technique, for the purpose of getting high efficiency, super-precision machining. Three kinds of cast-iron bonded diamond wheels with different grain size were adopted to get different grinding efficiency and surface quality of workpieces. The grinding properties of cast-iron bonded grinding wheels with different grain size and the ground surface quality of tungsten carbide are discussed in this paper. The experiment results indicate that, under the same feeding amount, the grinding efficiency of the wheel with bigger grain size is higher, and it could make the dimension accuracy of the workpiece controllable, but the wheel with smaller grain size could get better ground surface quality. The two grinding phases are decided by the ratio between the size of abrasive grain and the thickness of the oxide layer on the grinding wheel.

Observation in the Surface Roughness of Silicon Wafer during Semi-Fixed Abrasive Machining with Large Grains

2009 ◽  
Vol 69-70 ◽  
pp. 253-257
Author(s):  
Ping Zhao ◽  
Jia Jie Chen ◽  
Fan Yang ◽  
K.F. Tang ◽  
Ju Long Yuan ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Surface Quality ◽  
Silicon Wafer ◽  
Processing Parameters ◽  
Wafer Surface ◽  
Abrasive Machining ◽  
Fixed Abrasive ◽  
Is Failure ◽  
Better Than

Semi-fixed abrasive is a novel abrasive. It has a ‘trap’ effect on the hard large grains that can prevent defect effectively on the surface of the workpiece which is caused by large grains. In this paper, some relevant experiments towards silicon wafers are carried out under the different processing parameters on the semi-fixed abrasive plates, and 180# SiC is used as large grains. The processed workpieces’ surface roughness Rv are measured. The experimental results show that the surface quality of wafer will be worse because of higher load and faster rotating velocity. And it can make a conclusion that the higher proportion of bond of the plate, the weaker of the ‘trap’ effect it has. Furthermore the wet environment is better than dry for the wafer surface in machining. The practice shows that the ‘trap’ effect is failure when the workpiece is machined by abrasive plate which is 4.5wt% proportion of bond in dry lapping.

Research on Grinding Force of Zirconia Internal Grinding with Resin Bond Diamond Wheel

2016 ◽  
Vol 1136 ◽  
pp. 30-35
Author(s):  
He Wang ◽  
Ke Zhang ◽  
Yu Hou Wu ◽  
Hong Song
Keyword(s):  
Grain Size ◽  
Surface Quality ◽  
Diamond Wheel ◽  
Grinding Force ◽  
Wheel Speed ◽  
Zirconia Ceramic ◽  
Machined Surface ◽  
Research Results ◽  
Internal Grinding ◽  
Machined Surface Quality

The zirconia parts are limited by machined surface quality. The grinding force is one of the most important parameters of grinding and has effects on surface quality. The MK2710 grinder and resin bond diamond wheels were used in zirconia grinding. The grinding force was obtained by Kistler dynamometer. The paper focused on wheel speed and grain size on grinding force, and examined the surface by SEM. The research results indicated that decreasing the grain size, the grinding force increased and the surface quality improved, and increasing wheel speed could decrease grinding force to improve grinding surface quality. The results can improve zirconia ceramic parts surface quality and promote application.

Research on Nanocrystalline Silicon Film Solar Cells

2011 ◽  
Vol 347-353 ◽  
pp. 870-873
Author(s):  
Chun Rong Xue
Keyword(s):  
Grain Size ◽  
Solar Cells ◽  
Band Gap ◽  
Optical Band Gap ◽  
Volume Fraction ◽  
Silicon Film ◽  
Nanocrystalline Silicon ◽  
Processing Parameters ◽  
Crystalline Volume Fraction ◽  
Hydrogen Dilution

Nanocrystalline silicon film has become the research hit of today’ s P-V solar technology. It’s optical band gap was controlled through changing the grain size and crystalline volume fraction for the quanta dimension effect. The crystalline volume fraction in nc-Si:H is modulated by varying the hydrogen concentration in the silane plasma. Also, the crystallinity of the material increases with increasing hydrogen dilution ratio, the band tail energy width of the nc-Si:H concurrently decreases. Two sets of nc-Si:H solar cells were made with different layer thicknesss, their electronic and photonic bandgap, absorption coefficient, optical band gap, nanocrystalline grain size(D), and etc have been stuied. In addition, we discussed the relationship between the stress of nc-Si thin films and H2 ratio. At last nc-Si:H solar cells have been designed and prepared successfully in the optimized processing parameters.

Sign in / Sign up

Export Citation Format

Share Document