Low cost fabrication of the large-area anti-reflection films from polymer by nanoimprint/hot-embossing technology

2008 ◽  
Vol 19 (20) ◽  
pp. 205301 ◽  
Author(s):  
Chia-Jen Ting ◽  
Meng-Chi Huang ◽  
Hung-Yin Tsai ◽  
Chang-Pin Chou ◽  
Chien-Chung Fu
Keyword(s):  
Low Cost ◽  
Hot Embossing ◽  
Large Area

Realization of Mass Production of Microlens Array by Hot Embossing on Silicon Substrate

2010 ◽  
Vol 139-141 ◽  
pp. 1562-1565
Author(s):  
Xi Qiu Fan
Keyword(s):  
High Resolution ◽  
High Throughput ◽  
Silicon Substrate ◽  
Mass Production ◽  
Low Cost ◽  
Microlens Array ◽  
Hot Embossing ◽  
High Fidelity ◽  
Optical Performance ◽  
Large Area

Tradition lithographic techniques to produce micrlens array are complicated and time consuming. Due to the capability to replicate nanostructures repeatedly in a large area with high resolution and uniformity, hot embossing has been recognized as one of the promising approaches to fabricate microlens array with high throughput and low cost. This paper introduces processes to realize fabricating microlens array in mass production by direct hot embossing on silicon substrate. The mold is fabricated by multi-photolithography and etching steps and polymethyl methacrylate (PMMA) is chosen as the resist. Processes include coating, heating, pressing, etc. Fidelity and optical performance of the embossed microlens array were measured. High fidelity and fine optical performance of the embossed microlens array demonstrate the possibility of hot embossing to fabricate microlens array in mass production.

Fabrication and Application of Nanostructures Using Gas-Assisted Hot Embossing and Self-Assembled Nanospheres

2015 ◽  
Vol 659 ◽  
pp. 399-403 ◽  
Author(s):  
Rong Hong Hong ◽  
Cheng Cih ◽  
To Chung Shu ◽  
Sen Yeu Yang
Keyword(s):  
Near Infrared ◽  
Low Cost ◽  
Hot Embossing ◽  
Large Area ◽  
Self Assembled Monolayer ◽  
Glass Substrates ◽  
Plasma Sputtering ◽  
Nanostructure Arrays ◽  
Self Assembled ◽  
Better Than

We develop a simple and competitive fabrication of antireflective (AR) films with high-ordered nanostructure arrays on polycarbonate (PC) substrate by using gas-assisted hot embossing and a self-assembled technique. In this method, a self-assembled monolayer of polystyrene (PS) nanospheres is well-patterned on glass substrates as the first template. Subsequently, we use the plasma sputtering to deposit a conductive layer onto the surface of nanosphere (NS) patterned substrates, and then, electroforming is applied to fabricate a nickel mold with an inverse shape of nanospheres. In the last step, a unique glass transition is utilized to duplicate nanostructures on PC films via gas-assisted hot embossing. Not only in visible light but in near infrared, the optical properties of this AR film are similar or better than for other methods. This fabrication process also has great potential in industry, with its simplicity, large-area but low-cost.

PLASMA ACTIVATED BONDING AND IMPRINTING OF POLYMER BY HOT EMBOSSING FOR PACKAGING APPLICATIONS

2005 ◽  
Vol 04 (04) ◽  
pp. 551-557
Author(s):  
RAINER PELZER ◽  
SHARON FARRENS ◽  
DENNIS LEE
Keyword(s):  
Data Storage ◽  
Low Cost ◽  
High Volume ◽  
Hot Embossing ◽  
Micro Electro Mechanical System ◽  
Polymer Materials ◽  
Large Area ◽  
Wide Range ◽  
High Volume Production ◽  
Volume Production

Hot embossing is a well-acknowledged low cost, high resolution, large area 3D patterning process for polymers. This technique allows rapid prototyping for high volume production of fully patterned substrates for a wide range of thermoplastic polymer materials. The advantages of using polymer substrates over common Micro-Electro-Mechanical System (MEMS) processing materials like glass, silicon or quartz are: bio-compatible surfaces, easy manufacturability, low cost for high volume production, suitable for use in micro- and nano-fabrication, low conductivity, wide range of optical properties just to name a few. The article will present experimental results on HE processes with PMMA, mr-I8030, mr-L6000 and NEB22 on full 8" wafer sizes. Packaging of the imprinted features is a key technology for a wide variety of optical and fluidic applications in the μm and nm-range: m-TAS, micro-mixers, micro-reactors, electrophoresis cells, switches, data storage, etc. Most packaging techniques employed today, use glue material or high temperature sintering methods to bond structured polymer wafers together. These techniques are influencing the appearance of the sub-micron structures. A promising low-temperature polymer-to-polymer direct bonding technique utilizing the cleaning and surface activating behavior of plasma should be established here.

Computer simulation study about the dependence of amorphous silicon photonic waveguides efficiency on the material quality

2020 ◽  
Vol 90 (3) ◽  
pp. 30502
Author(s):  
Alessandro Fantoni ◽  
João Costa ◽  
Paulo Lourenço ◽  
Manuela Vieira
Keyword(s):  
Amorphous Silicon ◽  
High Throughput Screening ◽  
Simulation Analysis ◽  
Low Cost ◽  
Deposition Process ◽  
Large Area ◽  
Sidewall Roughness ◽  
Sensing Applications ◽  
Fabrication Defects ◽  
The Impact

Amorphous silicon PECVD photonic integrated devices are promising candidates for low cost sensing applications. This manuscript reports a simulation analysis about the impact on the overall efficiency caused by the lithography imperfections in the deposition process. The tolerance to the fabrication defects of a photonic sensor based on surface plasmonic resonance is analysed. The simulations are performed with FDTD and BPM algorithms. The device is a plasmonic interferometer composed by an a-Si:H waveguide covered by a thin gold layer. The sensing analysis is performed by equally splitting the input light into two arms, allowing the sensor to be calibrated by its reference arm. Two different 1 × 2 power splitter configurations are presented: a directional coupler and a multimode interference splitter. The waveguide sidewall roughness is considered as the major negative effect caused by deposition imperfections. The simulation results show that plasmonic effects can be excited in the interferometric waveguide structure, allowing a sensing device with enough sensitivity to support the functioning of a bio sensor for high throughput screening. In addition, the good tolerance to the waveguide wall roughness, points out the PECVD deposition technique as reliable method for the overall sensor system to be produced in a low-cost system. The large area deposition of photonics structures, allowed by the PECVD method, can be explored to design a multiplexed system for analysis of multiple biomarkers to further increase the tolerance to fabrication defects.

A novel low cost texturization method for large area commercial mono-crystalline silicon solar cells

2006 ◽  
Vol 90 (20) ◽  
pp. 3557-3567 ◽  
Author(s):  
U. Gangopadhyay ◽  
K.H. Kim ◽  
S.K. Dhungel ◽  
U. Manna ◽  
P.K. Basu ◽  
...  
Keyword(s):  
Solar Cells ◽  
Crystalline Silicon ◽  
Low Cost ◽  
Silicon Solar Cells ◽  
Large Area ◽  
Crystalline Silicon Solar Cells

scholarly journals Superhydrophobicity and Durability in Recyclable Polymers Coating

2021 ◽  
Vol 13 (15) ◽  
pp. 8244
Author(s):  
Francesca Cirisano ◽  
Michele Ferrari
Keyword(s):  
Thermal Treatment ◽  
Superhydrophobic Surface ◽  
Low Cost ◽  
Spray Coating ◽  
Large Area ◽  
Average Roughness ◽  
Water Contact ◽  
Alkaline Environments ◽  
Fine Control ◽  
Recycle And Reuse

Highly hydrophobic and superhydrophobic materials obtained from recycled polymers represent an interesting challenge to recycle and reuse advanced performance materials after their first life. In this article, we present a simple and low-cost method to fabricate a superhydrophobic surface by employing polytetrafluoroethylene (PTFE) powder in polystyrene (PS) dispersion. With respect to the literature, the superhydrophobic surface (SHS) was prepared by utilizing a spray- coating technique at room temperature, a glass substrate without any further modification or thermal treatment, and which can be applied onto a large area and on to any type of material with some degree of fine control over the wettability properties. The prepared surface showed superhydrophobic behavior with a water contact angle (CA) of 170°; furthermore, the coating was characterized with different techniques, such as a 3D confocal profilometer, to measure the average roughness of the coating, and scanning electron microscopy (SEM) to characterize the surface morphology. In addition, the durability of SH coating was investigated by a long-water impact test (raining test), thermal treatment at high temperature, an abrasion test, and in acidic and alkaline environments. The present study may suggest an easy and scalable method to produce SHS PS/PTFE films that may find implementation in various fields.

scholarly journals Interaction-tailored organization of large-area colloidal assemblies

2018 ◽  
Vol 9 ◽  
pp. 1582-1593 ◽  
Author(s):  
Silvia Rizzato ◽  
Elisabetta Primiceri ◽  
Anna Grazia Monteduro ◽  
Adriano Colombelli ◽  
Angelo Leo ◽  
...  
Keyword(s):  
Film Formation ◽  
Low Cost ◽  
Interparticle Distance ◽  
Particle Interactions ◽  
Polystyrene Spheres ◽  
Large Area ◽  
Nanoscale Patterning ◽  
Particle Solution ◽  
Number Of Particles ◽  
Deposition Conditions

Colloidal lithography is an innovative fabrication technique employing spherical, nanoscale crystals as a lithographic mask for the low cost realization of nanoscale patterning. The features of the resulting nanostructures are related to the particle size, deposition conditions and interactions involved. In this work, we studied the absorption of polystyrene spheres onto a substrate and discuss the effect of particle–substrate and particle–particle interactions on their organization. Depending on the nature and the strength of the interactions acting in the colloidal film formation, two different strategies were developed in order to control the number of particles on the surface and the interparticle distance, namely changing the salt concentration and absorption time in the particle solution. These approaches enabled the realization of large area (≈cm2) patterning of nanoscale holes (nanoholes) and nanoscale disks (nanodisks) of different sizes and materials.

Patterning Organic Fluorescent Molecules with SAM Patterns

2011 ◽  
Vol 1335 ◽  
Author(s):  
Qiong Wu ◽  
Juanyuan Hao ◽  
Shoulei Shi ◽  
Weifeng Wang ◽  
Nan Lu
Keyword(s):  
Organic Molecules ◽  
Low Cost ◽  
Substrate Surface ◽  
Large Area ◽  
Self Assembled Monolayer ◽  
Storage Duration ◽  
Light Emitting ◽  
High Throughput Method ◽  
Self Assembled ◽  
Fluorescent Molecules

ABSTRACTWe report a low-cost and high-throughput method to fabricate large-area light emitting pattern via thermal evaporation of organic molecules on the patterned self-assembled monolayer of homogenous 3-aminopropyltrimethoxysilane. This method is based on the selective deposition of the organic light emitting molecules on the template of self-assembled monolayer (SAM), which is patterned with nanoimprinting lithography. The selectivity can be controlled by adjusting the design of the pattern, the storage duration and the substrate temperature. The deposition selectivity of the molecules may be caused by the different binding energy of the molecules with the SAM and the substrate surface.

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