Studies on Diamond Brazing Process (Part one)

Through scientific experiments, we studied the binder, diamond, solder, uniform distribution and heating curves in brazing. We selected DH temporary binder, compared two kinds of diamond, selected the diamond with fine thermal stability. The experiments adopted diamond with uniform templates, experimenting 13 kinds of solder of which 9 were mixed with diamond for comparison of brazing effects and thermal damage. We optimized solder and brazing process and comprehensive analyzed experimental results. The analysis showed a small amount of DH temporary binder residue in brazing, fine effect in case of low alloy solder brazing temperature, better adhesion of solder and diamond achieved by elements formed by Cr and other strong carbides, sufficient volatilization of temporary binder and other impurities achieved by insulation before 500°C, heating rate of 1°C/min when the temperature it is higher than 20°C-50°C, the solder melting point, and that cooling should be carried out under high vacuum, brazing diamond should have fine thermal stability.

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Optimization of Cross Sectioning for Solder Joint using Broad Ar Ion Beam Milling with Temperature Control

ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2020p0280 ◽

2020 ◽

Author(s):

Natsuko Asano ◽

Tamae Omoto ◽

Jinfeng Lu ◽

Hirobumi Morita ◽

Natasha Erdman ◽

...

Keyword(s):

Melting Point ◽

Solder Joint ◽

Sample Preparation ◽

Semiconductor Manufacturing ◽

Thermal Damage ◽

Ion Beam ◽

The Other ◽

Ion Milling ◽

Milling Method ◽

Liquid Nitrogen Cooling

Abstract Understanding solder joints is very important for failure analysis in semiconductor manufacturing because it is commonly used for mounting semiconductor devices on boards. However, regarding sample preparation for analysis, solder poses challenges in crosssection preparation due to the differences in melting point and hardness of its constituents. Therefore, precision cutting methods such as ion milling are required. On the other hand, ion milling method usually causes thermal damage during cutting. In this paper, we tried to optimize the sample temperature during Ar ion milling using liquid nitrogen cooling [1].

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Thermochromism of Highly Luminescent Photopolymer Flexible Films Based On Eu (III) Salts Confined in Polysulfone

Materials ◽

10.3390/ma13235394 ◽

2020 ◽

Vol 13 (23) ◽

pp. 5394

Author(s):

Mani Outis ◽

João Paulo Leal ◽

Maria Helena Casimiro ◽

Bernardo Monteiro ◽

Cláudia Cristina Lage Pereira

Keyword(s):

Thermal Stability ◽

Ionic Liquid ◽

Melting Point ◽

Quantum Yield ◽

Thermal Behavior ◽

Temperature Dependence ◽

Strong Temperature Dependence ◽

Host Matrix ◽

Flexible Films ◽

First Time

Here we discuss the influence of two different cations on the emissive properties of the highly emissive [Eu(fod)4]− anion. The studied Eu(III) salts were [C16Pyr][Eu(fod)4] (1), and the previously reported [Chol][Eu(fod)4]. C16Pyr stands for N-cetylpyridinium, Chol for cholinium and fod for 1,1,1,2,2,3,3-heptafluoro-7,7-dimethyloctane-4,6-dionate. 1 is classified as ionic liquid, with melting point close to 60 °C, and presented a luminescence quantum yield of (ϕ) 100%. Ultrabright emissive photopolymers were obtained for the first time using polysulfone as the host matrix. The films were prepared with incorporation of 10% (w/w) of 1 and [Chol][Eu(fod)4] in the polymeric matrix, which improved its thermal stability. Additionally, the luminescence of CholEu(fod)4/PSU presented a strong temperature dependence with a ratiometric thermal behavior.

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Thermal Stability of Immobilized Glucoamylase Entrapped in Polyacrylamide Gels and Bound to SP-Sephadex C–50

Agricultural and Biological Chemistry ◽

10.1080/00021369.1980.10864285 ◽

1980 ◽

Vol 44 (9) ◽

pp. 2047-2054

Author(s):

Shigeru Moriyama ◽

Atsufumi Noda ◽

Kazuhiro Nakanishi ◽

Ryuichi Matsuno ◽

Tadashi Kamikubo

Keyword(s):

Thermal Stability ◽

Polyacrylamide Gels ◽

C 50 ◽

Thermal Stability Of

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Syntheses and Spectral Properties of Tetra-(4,4-Dimethyl-Phenyl) Dithiolene Nickel Complex

Applied Mechanics and Materials ◽

10.4028/www.scientific.net/amm.469.81 ◽

2013 ◽

Vol 469 ◽

pp. 81-86

Author(s):

Xue Hua Cheng ◽

Xiu Lan Xin ◽

Li Hua Yin ◽

Yang Yu

Keyword(s):

Thermal Stability ◽

Melting Point ◽

Infrared Spectrum ◽

Spectral Properties ◽

Nickel Complex ◽

Near Infrared ◽

Nickel Complexes ◽

Raw Material ◽

Synthesis Time ◽

Photo Stability

Tetra-(4,4-dimethyl-phenyl) dithiolene nickel complex was synthesized by sulfuration with P2S5 and nickel complexs using bis-(4,4-dimethyl-phenyl) ethanedione as raw material. The structure of dithiolene nickel complexes was characterized by melting point, IR and 1HNMR. The maximum absorption spectra of this dithiolene nickel complexes in different solvent was measured by Ultraviolet-Visible-near Infrared Spectrum, and the photo stability and thermal stability were discussed. The results showed that this new method was used to synthesis bis-(4,4-dimethyl-phenyl) ethanedione, which greatly reduces the synthesis time compared to previous methods.

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Influence of number of laser shots on laser induced microstructures on Ag and Cu targets

Laser and Particle Beams ◽

10.1017/s0263034609000196 ◽

2009 ◽

Vol 27 (1) ◽

pp. 129-136 ◽

Cited By ~ 14

Author(s):

A. Latif ◽

M.S. Anwar ◽

M.A. Aleem ◽

M.S. Rafique ◽

M. Khaleeq-Ur-Rahman

Keyword(s):

Electron Microscopy ◽

Thermal Damage ◽

Damage Zone ◽

High Vacuum ◽

Careful Analysis ◽

Laser Wavelength ◽

Stress Waves ◽

Heat Energy ◽

Theoretical Investigations ◽

Scanning Electron

AbstractAnnealed and fine polished Ag and Cu samples are irradiated for 25, 50, 75, and 100 shots with a Q-Switched Nd:YAG laser in air and under high vacuum ~10−6 Torr. The irradiated samples are investigated under scanning electron microscopy, which reveals the formation of laser induced ripples structures with spacing 10 µm to 25 µm. Careful analysis revealed that the ripple spacing is not only dependent on laser wavelength, target properties, but also on the number of laser shots. It is also observed that ripples spacing varies from center to edge of the thermal damage zone. Two-fold spacing is measured near the edge compared to spacing at the center of the crater. Anisotropic stresses and stress waves (shock waves) are guiding the laser induced heat energy through particular channels. Splashing cones are developed with the increase in the laser shots. More theoretical investigations are needed to study the laser ripple periodicity in the context of laser shots effect.

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Specific Features of Interfaces in Cu-Nb Nanocomposites

Defect and Diffusion Forum ◽

10.4028/www.scientific.net/ddf.354.183 ◽

2014 ◽

Vol 354 ◽

pp. 183-188 ◽

Cited By ~ 4

Author(s):

Elena N. Popova ◽

I.L. Deryagina ◽

E.G. Valova-Zaharevskaya ◽

A.V. Stolbovsky ◽

N.E. Khlebova ◽

...

Keyword(s):

Thermal Stability ◽

Uniform Distribution ◽

Cross Sections ◽

True Strain ◽

Structure And Properties ◽

Temperature Range ◽

Thermal Stability Of

The structure and properties of multi-rod Cu-Nb composites with the true strain of 10.2 and 12.5 have been studied by TEM, SEM and microhardness measurements. The non-uniform distribution of Nb ribbons throughout the composite cross sections was revealed, at higher strain their structure being more dispersed. In both wires the Cu/Nb interfaces are partly coherent, and the Nb lattice is more distorted at interfaces than in the bulk. The behavior at heating was studied in the temperature range of 300-800оС. In the range of 600-800oC complete coagulation of Nb filaments accompanied with drastic microhardness drop is observed. The thermal stability of Cu-Nb nanocomposites is higher than that of Nb and Cu nanostructured by SPD.

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Influence of Silica Fume and Thermal Damage on Uniaxial Tension Performance of PVC-SHCC

Applied Mechanics and Materials ◽

10.4028/www.scientific.net/amm.357-360.977 ◽

2013 ◽

Vol 357-360 ◽

pp. 977-981

Author(s):

Rui Xue Wu ◽

Tie Jun Zhao ◽

Li Tian ◽

Wan Ma

Keyword(s):

Uniaxial Tension ◽

Ultimate Strength ◽

Silica Fume ◽

Tensile Strain ◽

Building Materials ◽

Thermal Damage ◽

Tension Test ◽

Different Temperatures ◽

New Type ◽

C 50

As a new type of building materials, performance of SHCC admixed with silica fume and that exposed to different temperatures are of concern. Uniaxial tension test is conducted on specimens that with and without silica fume admixture, after being exposed to 6 different temperatures (20°C, 50°C, 100°C, 150°C, 200°C and 300°C) for 2 hours. The results show that the ultimate tensile strain of SHCC decreases along with the increase of temperature. However, the ultimate tensile strain remains above 1.2% when the temperature is less than 200°C. Incorporating silica fume into SHCC design indicates that the use of silica fume does not have much effect on the ultimate tensile strain of SHCC, but significantly improves the first cracking strength and ultimate strength of the material.

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