Determination of Residual Stress of Hard Film/Soft Substrate Specimens via Unloading Results of Nanoindentation Tests
2011 ◽
Vol 328-330
◽
pp. 843-848
Keyword(s):
A method used to determine the residual stress in a hard film deposited on a soft substrate via the unloading load-depth curves was proposed. The unloading curves with transitional behaviors were used to determine the film deflection stiffness, and then the residual stresses were obtained. Significant extra stresses were induced by a cube corner indenter at large depth. In contrast, the indentation-induced stresses could be neglected in cases of Berkovich indentation at relatively small depths.