Optimization of Cutting Parameters for High Speed End Milling of Single Crystal Silicon by Diamond Coated Tools with Compressed Air Blowing Using RSM

2012 ◽  
Vol 576 ◽  
pp. 46-50 ◽  
Author(s):  
M.A. Mahmud ◽  
A.K.M. Nurul Amin ◽  
M.D. Arif
Keyword(s):  
Single Crystal ◽  
High Speed ◽  
End Milling ◽  
Single Crystal Silicon ◽  
Depth Of Cut ◽  
Machining Parameters ◽  
Crystal Silicon ◽  
Design Expert ◽  
Coated Tools ◽  
Optimization Of Cutting Parameters

This paper presents the thorough experimental analysis on high speed end milling of single crystal silicon using diamond coated tools. Experiments were conducted on CNC milling machine. The design of the experiments was based on the central composite design (CCD) technique of Design Expert software. Response Surface Methodology (RSM) was used to develop mathematical imperial model to establish a correlation between machining parameters (cutting speed, feed and depth of cut) and machined surface roughness in high speed end milling of single crystal silicon using 2mm diameter diamond coated tools. The optimum machining parameters were determined using the optimization tool of Design Expert software based on the desirability function. Finally, confirmation tests were performed to validate the developed model.

Statistical Approach to Modeling & Optimization of Surface Roughness in High Speed End Milling of Silicon with Diamond Coated Tools

2012 ◽  
Vol 576 ◽  
pp. 28-31 ◽  
Author(s):  
A.K.M. Nurul Amin ◽  
Noor Syairah Khalid ◽  
Siti Nurshahida Mohd Nasir ◽  
Muammer D. Arif
Keyword(s):  
Surface Roughness ◽  
Response Surface ◽  
High Speed ◽  
End Milling ◽  
Desirability Function ◽  
Depth Of Cut ◽  
Machining Parameters ◽  
Coated Tools ◽  
Milling Machines ◽  
Air Blowing

This research demonstrated the use of conventional milling machines with diamond coated tools, high speed attachments, and air blowing mechanisms for ductile mode machining of silicon and subsequently modeling and optimizing the resultant surface roughness. Spindle speed, depth of cut, and feed rate, ranges: 60,000 to 80,000 rpm, 10 to 20 µm, and 5 to 15 mm/min respectively, were considered as the independent machining parameters for the modeling process. Compressed air at 0.35 MPa was also provided to prevent chip deposition on the finished surfaces. The resultant surfaces were analysed using Optical and Scanning Electron (SEM) Microscopes as well as Wyko NT 1100 and SurfTest SV-500 profilometers. The response, surface roughness, was then modeled using a small Central Composite Design (CCD) in Response Surface Methodology (RSM). The quadratic relation was found to be most suitable following Fit and Summary and ANOVA analyses. The relation was then optimized using Desirability Function (DF) in Design of Expert (DOE) software. The optimum attainable surface roughness, which was validated using experimental runs, was found to be 0.11 µm which may be considered quite satisfactory.

Optimization of Cutting Parameters in High Speed End Milling of Soda Lime Glass with Coated Carbide Tools Using Directional Compressed Air Blowing

2012 ◽  
Vol 576 ◽  
pp. 111-114
Author(s):  
M.A. Mahmud ◽  
A.K.M. Nurul Amin ◽  
Muammer Din Arif
Keyword(s):  
Surface Roughness ◽  
High Speed ◽  
End Milling ◽  
Soda Lime ◽  
Compressed Air ◽  
Soda Lime Glass ◽  
Machining Parameters ◽  
Design Expert ◽  
Air Blowing ◽  
Optimization Of Cutting Parameters

An experimental study of high speed machining of soda lime glass using directional compressed air blowing for removal of the ductile chips from the machined surface, is presented. High speed end milling of soda lime glass is performed on a vertical CNC milling machine to observe the effects of machining parameters i.e. spindle speed, depth of cut and feed rate on the resultant surface roughness. The design of the experiments was performed following the Central Composite Design (CCD) of the Response Surface methodology (RSM) using the Design Expert Software. Optimization of machining parameters was conducted using desirability function of the Design Expert software based on minimum surface roughness criterion. Finally, experimental verification tests were conducted to validate the predicted optimized value.

High-speed strained-single-crystal-silicon thin-film transistors on flexible polymers

2006 ◽  
Vol 100 (1) ◽  
pp. 013708 ◽  
Author(s):  
Hao-Chih Yuan ◽  
Zhenqiang Ma ◽  
Michelle M. Roberts ◽  
Donald E. Savage ◽  
Max G. Lagally
Keyword(s):  
Thin Film ◽  
Single Crystal ◽  
Thin Film Transistors ◽  
High Speed ◽  
Single Crystal Silicon ◽  
Flexible Polymers ◽  
Silicon Thin Film ◽  
Crystal Silicon

Experimental Investigation of the Machinability of Single Crystal Silicon in Laser-Assisted Diamond Cutting

2020 ◽  
Author(s):  
Jinyang Ke ◽  
Xiao Chen ◽  
Jianguo Zhang ◽  
Changlin Liu ◽  
Guoqing Xu ◽  
...  
Keyword(s):  
Single Crystal ◽  
Surface Quality ◽  
Laser Power ◽  
Single Crystal Silicon ◽  
Depth Of Cut ◽  
Maximum Height ◽  
Critical Depth ◽  
Diamond Cutting ◽  
Crystal Silicon ◽  
Critical Depth Of Cut

Abstract Laser-assisted diamond cutting is a promising process for machining hard and brittle materials. A deep knowledge of material removal mechanism and attainable surface integrity are crucial to the development of this new technique. This paper focuses on the application of laser-assisted diamond cutting to single crystal silicon to investigate key characteristics of this process. The influence of laser power on the ductile machinability of single crystal silicon, in terms of the critical depth of cut for ductile-brittle transition in laser-assisted diamond cutting, is investigated quantitatively using a plunge-cut method. The experimental results reveal that this process can enhance the silicon’s ductility and machinability. The critical depth of cut has been increased by up to 330% with laser assistance, and its degree generally increases with the increase of laser power. The cross-sectional transmission electron microscope observation results indicate that laser-assisted diamond cutting is able to realize the subsurface damage free processing of single crystal silicon. In order to verify the ability of the laser-assisted diamond cutting to improve the surface quality, the face turning tests are also carried out. A significant improvement of surface quality has been obtained by laser-assisted diamond cutting: Sz (maximum height) has been reduced by 85% and Sa (arithmetical mean height) has been reduced by 45%.

Study on Precision Slicing Process of Single-Crystal Silicon by Using Dicing Wire Saw

2016 ◽  
Vol 1136 ◽  
pp. 350-356 ◽  
Author(s):  
Takaaki Suzuki ◽  
Toshinori Otsuki ◽  
Ji Wang Yan
Keyword(s):  
Single Crystal ◽  
High Precision ◽  
High Speed ◽  
Single Crystal Silicon ◽  
Crystal Silicon ◽  
Wire Saw ◽  
Hard And Brittle Materials ◽  
Feeding Speed ◽  
Wire Feeding ◽  
Control Technologies

Precision slicing tests were performed for single-crystal silicon by using a newly developed dicing wire saw system and diamond wires. The developed dicing wire saw enables slicing thick workpiece of hard and brittle materials which could not be sliced by conventional dicing machines. To achieve high precision and efficiency, the dicing wire saw system adopted tension control and high speed control technologies which provides a maximum wire feeding speed of 2000m/min. In this study, the diamond wire was driven in a single direction at a speed of 750-1750m/min and the slicing force, wire wear and workpiece surface roughness after slicing were investigated experimentally. The results showed that as a new slicing system, the developed dicing wire saw was useable for high-precision slicing of thick workpiece.

The Use of the Taguchi-Grey Based to Optimize High Speed End Milling with Multiple Performance Characteristics

2006 ◽  
Vol 505-507 ◽  
pp. 835-840 ◽  
Author(s):  
Shen Jenn Hwang ◽  
Yunn Lin Hwang ◽  
B.Y. Lee
Keyword(s):  
High Speed ◽  
End Milling ◽  
Removal Rate ◽  
Cutting Speed ◽  
Performance Characteristics ◽  
Depth Of Cut ◽  
Machining Parameters ◽  
Machining Performance ◽  
Grey Relational Grade ◽  
Grey Relational

This paper presents a new approach for the optimization of the high speed machining (HSM) process with multiple performance characteristics based on the orthogonal array with the grey relational analysis has been studied. Optimal machining parameters can then be determined by the grey relational grade as the performance index. In this study, the machining parameters such as cutting speed, feed rate and axial depth of cut are optimized under the multiple performance characteristics including, tool life, surface roughness, and material removal rate(MMR). As shown experimental results, machining performance in the HSM process can be improved effectively through this approach.

High-speed mechanically flexible single-crystal silicon thin-film transistors on plastic substrates

2006 ◽  
Vol 27 (6) ◽  
pp. 460-462 ◽  
Author(s):  
Jong-Hyun Ahn ◽  
Hoon-Sik Kim ◽  
Keon Jae Lee ◽  
Zhengtao Zhu ◽  
E. Menard ◽  
...  
Keyword(s):  
Thin Film ◽  
Single Crystal ◽  
Thin Film Transistors ◽  
High Speed ◽  
Single Crystal Silicon ◽  
Silicon Thin Film ◽  
Crystal Silicon ◽  
Plastic Substrates

Experimental Investigation of Brittle to Ductile Transition of Single Crystal Silicon by Single Grain Grinding

2007 ◽  
Vol 329 ◽  
pp. 433-438 ◽  
Author(s):  
Feng Wei Huo ◽  
Zhu Ji Jin ◽  
Fu Ling Zhao ◽  
Ren Ke Kang ◽  
Dong Ming Guo
Keyword(s):  
Single Crystal ◽  
Transition Point ◽  
Single Crystal Silicon ◽  
Depth Of Cut ◽  
Surface Cracks ◽  
Crystal Silicon ◽  
Brittle To Ductile Transition ◽  
Ductile Mode ◽  
Single Grain ◽  
Brittle Mode

Grinding of single crystal silicon may be achieved by two modes of material removal: ductile mode and brittle mode. Knowing of the brittle to ductile transition point at which the grinding process changes from the brittle mode to ductile mode is critically important for the realization of ductile mode grinding. This paper uses a new single grain diamond grinding method developed recently by the authors to investigate the brittle to ductile transition during grinding of single crystal silicon in all around. The results indicate that there exist four stages of brittle to ductile transition as the depth of cut is reduced: firstly, the surface cracks outside the grinding groove disappeared, secondlycracks on the bottom of the groove disappeared, then the lateral cracks ceased in the subsurface region, and finally the median crack is suppressed beneath the grooves. It is not until the depth of cut reaches the last transition point that a crack-free groove can be produced, therefore, the last transition stage is decisive. The critical depth of cut delineating the brittle to ductile transition point derived based on this criterion is 40 nanometers, which is much lower than that based on surface cracks.

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