Effect of Free Abrasive Particle in Gasbag Polishing Technique

2009 ◽  
Vol 69-70 ◽  
pp. 83-87
Author(s):  
Ming Sheng Jin ◽  
Shi Ming Ji ◽  
Li Zhang ◽  
Xian Zhang ◽  
Ya Qi Shen

Free abrasive particle plays a crucial role in material removal and quality improvement of curved surface mould. In order to observe and investigate the general distribution state, fractal dimension and movement characteristic of abrasive particle in gasbag polishing process better, an abrasive particle stroboscopic photography system is established and polishing experiment is carried out. The abrasive particle contacts with not only the rubber gasbag enwrapped by polishing cloth full of mesh-like structures, but also the mould surface. Contact analysis of abrasive particle including the discussions of contact state, material removal mechanism and advantage of precession polishing is helpful to hold the optimal polishing process parameters combination and establish ideal abrasive particle field for higher polishing efficiency and more well-proportioned surface quality.

2010 ◽  
Vol 129-131 ◽  
pp. 118-123
Author(s):  
Guang Chao Han ◽  
Ming Sun ◽  
Jing Dong Li

The quality and the efficiency of the polishing process are important to the lead time of the rapid tooling. Robotic polishing process with free abrasive is adapted to the finishing of complex mould surface, in which the soft polishing tool is widely used. But the stability and the efficiency of the process should be improved further. According to the moving and grinding characters of the free abrasive, the mixed magnetic abrasive and the minitype electromagnetic field are combined to the robotic polishing process. The mixed magnetic abrasive are made up of magnetic grain and hard abrasive, which can enhance the effective cutting and grinding process of the three-body abrasion under the effect of magnetic field. The robotic compound polishing process with mixed magnetic abrasive is presented in this paper. The experiments are tested to study the distribution of the minitye magnetic field and the polishing efficiency of the complex polishing process. The results show that the polishing efficiency of the process can be improved obviously where the effective working intensity of the electromagnetic field reaches 400Gs.


2013 ◽  
Vol 631-632 ◽  
pp. 550-555
Author(s):  
Wen Qiang Peng ◽  
Sheng Yi Li ◽  
Chao Liang Guan ◽  
Xin Min Shen

Material removed by mechanical process inevitably causes surface or subsurface damage containing cracks, plastic scratch, residual stress or dislocations. In nano-abrasive jet polishing (NAJP) the material is removed by chemical impact reaction. The chemical impact reaction is validated by contrast experiment with traditional lap polishing process in which the material is mainly removed through mechanical process. Experiment results show the dependence of the abrasive particles on the choice of materials. Even if the abrasive particle and the workpiece are composed of similar components, the machining properties are remarkably different due to slight differences in their physical properties or crystallography etc. Plastic scratches on the sample which was polished by the traditional mechanical process are completely removed by NAJP process, and the surface root-square-mean roughness has decreased from 1.403nm to 0.611nm. The NAJP process will become a promising method for ultra precision machining method for ultrasmooth optical surface.


Materials ◽  
2020 ◽  
Vol 13 (8) ◽  
pp. 1918
Author(s):  
Dongpo Wang ◽  
Shouxiang Lu ◽  
Dong Xu ◽  
Yuanlin Zhang

C/SiC composites are the preferred materials for hot-end structures and other important components of aerospace vehicles. It is important to reveal the material removal mechanism of ultrasound vibration-assisted grinding for realizing low damage and high efficiency processing of C/SiC composites. In this paper, a single abrasive particle ultrasound vibration cutting test was carried out. The failure modes of SiC matrix and carbon fiber under ordinary cutting and ultrasound cutting conditions were observed and analyzed. With the help of ultrasonic energy, compared with ordinary cutting, under the conditions of ultrasonic vibration-assisted grinding, the grinding force is reduced to varying degrees, and the maximum reduction ratio reaches about 60%, which means that ultrasonic vibration is beneficial to reduce the grinding force. With the observation of cutting debris, it is found that the size of debris is not much affected by the a p with ultrasound vibration. Thus, the ultrasound vibration-assisted grinding method is an effective method to achieve low damage and high efficiency processing of C/SiC composites.


2019 ◽  
Vol 215 ◽  
pp. 05003
Author(s):  
Rui Almeida ◽  
Timon Ebert ◽  
Rainer Börret ◽  
Mario Pohl

In order to improve the quality of injection-moulded polymer optic parts, it is necessary to improve the quality of the respective steel moulds. For this reason, it is not only necessary to improve the surface roughness of the mould, but also its geometrical shape. The material removal obtained from robot pad polishing is too low. This makes a shape correction after the milling step a very prolonged process. The aim of this work is to use a polishing chain to improve the surface quality of steel samples in terms of shape deviation and surface roughness. This correction polishing chain uses the robot fluid jet polishing for the geometrical shape correction and afterwards the robot pad polishing for the improvement of the surface roughness. Due to the high material removal rates of the fluid jet polishing, it is possible to correct the geometrical shape of steel moulds very fast up to a certain deviation. The pad polishing process improves the surface roughness of the steel samples. A correction of the shape deviation of more than 80% with a RMS of approximately 8 nm was obtained.


2013 ◽  
Vol 797 ◽  
pp. 135-139 ◽  
Author(s):  
Lei Sun ◽  
Wei Gang Guo ◽  
Ju Long Yuan ◽  
Qian Fa Deng ◽  
Ming Feng ◽  
...  

The Quartz substrates are widely used in various fields, and the requirement for the surface quality of quartz substrate is higher than ever before. This paper focuses on the ultra-precision polishing technology for the quartz substrates, and the material removal mechanism in the process of ultra-precision polishing is discussed. The results showed that an extremely smooth surface of quartz substrate was obtained in the ultra-precision polishing process, and the best surface roughness reached Ra 0.82nm. Meanwhile, the thickness can be controlled very well.


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