Microstructure Evaluation of Solid-Solution in Fe-Cu Immiscible Alloy System

2008 ◽  
Vol 273-276 ◽  
pp. 622-625
Author(s):  
S.H. Mir Shah Ghassemi ◽  
Ali Shokuhfar ◽  
Mohammad Reza Vaezi
Keyword(s):  
Solid Solution ◽  
Mechanical Alloying ◽  
Impact Force ◽  
Research Work ◽  
Alloy System ◽  
Model System ◽  
Automatic Design ◽  
Pipe Diffusion ◽  
Microstructure Evaluation ◽  
Heats Of Mixing

The study of mechanical alloying on the Fe–Cu system, as a model system for those with positive heats of mixing, are investigated. In this research work the effects of impact force, such as increasing in the surface temperature of powders, the number of vacancies and pipe diffusion, on the strain and grain size of final powders have been studied. The aim of this research is to find the optimum condition for mechanical alloying of Cu-Fe system by the help of automatic design and analysis of TAGUCHI experiments.

An atomic resolution study of a carbide phase in platinum

1992 ◽  
Vol 50 (1) ◽  
pp. 20-21
Author(s):  
M.J. Witcomb ◽  
M.A. O'Keefe ◽  
CJ. Echer ◽  
C. Nelson ◽  
J.H. Turner ◽  
...  
Keyword(s):  
Solid Solution ◽  
Carbon Atom ◽  
Carbide Phase ◽  
Structural Changes ◽  
Critical Role ◽  
Alloy System ◽  
Atomic Resolution ◽  
Excess Carbon ◽  
Interstitial Carbon ◽  
Resolution Study

Under normal circumstances, Pt dissolves only a very small amount of interstitial carbon in solid solution. Even so, an appropriate quench/age treatment leads to the formation of stable Pt2C {100} plate precipitates. Excess (quenched-in) vacancies play a critical role in the process by accommodating the volume and structural changes that accompany the transformation. This alloy system exhibits other interesting properties. Due to a large vacancy/carbon atom binding energy, Pt can absorb excess carbon at high temperatures in a carburizing atmosphere. In regions rich in carbon and vacancies, another carbide phase, Pt7C which undergoes an order-disorder reaction was formed. The present study of Pt carburized at 1160°C and aged at 515°C shows that other carbides in the PtxC series can be produced.

scholarly journals Strength, Hardness, and Ductility Evidence of Solid Solution Strengthening and Limited Hydrogen Embrittlement in the Alloy System Palladium-Copper (Cu wt. % 5–25)

Hydrogen ◽  
2021 ◽  
Vol 2 (3) ◽  
pp. 262-272
Author(s):  
Sebastian DiMauro ◽  
Gabrielle Legall ◽  
Coleman Lubinsky ◽  
Monica Nadeau ◽  
Renee Tait ◽  
...  
Keyword(s):  
Solid Solution ◽  
Hydrogen Embrittlement ◽  
Copper Content ◽  
Vickers Microhardness ◽  
Copper Alloys ◽  
Alloy System ◽  
Weight Percent ◽  
Solid Solution Strengthening ◽  
Solution Strengthening ◽  
Palladium Copper Alloys

Strength, hardness, and ductility characteristics were determined for a series of palladium-copper alloys that compositionally vary from 5 to 25 weight percent copper. Alloy specimens subjected to vacuum annealing showed clear evidence of solid solution strengthening. These specimens showed, as a function of increasing copper content, increased yield strength, ultimate strength, and Vickers microhardness, while their ductility was little affected by compositional differences. Annealed alloy specimens subsequently subjected to exposure to hydrogen at 323 K and PH2 = 1 atm showed evidence of hydrogen embrittlement up to a composition of ~15 wt. % Cu. The magnitude of the hydrogen embrittlement decreased with increasing copper content in the alloy.

The stages of formation of a solid solution during the mechanical alloying of Si and Ge

1993 ◽  
Vol 191 (2) ◽  
pp. 239-242 ◽  
Author(s):  
B.B. Bokhonov ◽  
I.G. Konstanchuk ◽  
V.V. Boldyrev
Keyword(s):  
Solid Solution ◽  
Mechanical Alloying

Elaboration, Structure and Mössbauer Spectroscopy of Nanostructured Fe100−xSix Powders Elaborated by Mechanical Alloying

SPIN ◽  
2017 ◽  
Vol 07 (02) ◽  
pp. 1750002 ◽  
Author(s):  
M. Hemmous ◽  
A. Guittoum
Keyword(s):  
Magnetic Field ◽  
Solid Solution ◽  
Mechanical Alloying ◽  
Hyperfine Magnetic Field ◽  
Lattice Parameter ◽  
X Ray Diffraction ◽  
X Ray ◽  
Grain Sizes ◽  
The Mean ◽  
Xrd Studies

We have studied the effect of the silicon concentration on the structural and hyperfine properties of nanostructured Fe[Formula: see text]Six powders ([Formula: see text], 20, 25 and 30[Formula: see text]at.%) prepared by mechanical alloying. The X-ray diffraction (XRD) studies indicated that after 72[Formula: see text]h of milling, the solid solution bcc-[Formula: see text]-Fe(Si) is formed. The grain sizes, [Formula: see text]D[Formula: see text] (nm), decreases with increasing Si concentration and reaches a minimum value of 11[Formula: see text]nm. We have found that the lattice parameter decreases with increasing Si concentration. The changes in values are attributed to the substitutional dissolution of Si in Fe matrix. From the adjustment of Mössbauer spectra, we have shown that the mean hyperfine magnetic field, [Formula: see text]H[Formula: see text] (T), decreases with increasing Si concentration. The substitutional dependence of [Formula: see text]H[Formula: see text] (T) can be attributed to the effect of p electrons Si influencing electrons d of Fe.

Dynamics of a Continuous System With Clearance and Motion Limiting Stops

1999 ◽  
Author(s):  
P. Metallidis ◽  
S. Natsiavas
Keyword(s):  
Piecewise Linear ◽  
Research Work ◽  
Continuous System ◽  
Continuous Model ◽  
Equation Of Motion ◽  
Model System ◽  
Periodic Motions ◽  
System Parameters ◽  
Rigid Rods ◽  
The Stability

Abstract The present study generalises previous research work on the dynamics of discrete oscillators with piecewise linear characteristics and investigates the response of a continuous model system with clearance and motion-limiting constraints. More specifically, in the first part of this work, an analysis is presented for determining exact periodic response of a periodically excited deformable rod, whose motion is constrained by a flexible obstacle. This methodology is based on the exact solution form obtained within response intervals where the system parameters remain constant and its behavior is governed by a linear equation of motion. The unknowns of the problem are subsequently determined by imposing an appropriate set of periodicity and matching conditions. The analytical part is complemented by a suitable method for determining the stability properties of the located periodic motions. In the second part of the study, the analysis is applied to several cases in order to investigate the effect of the system parameters on its dynamics. Special emphasis is placed on comparing these results with results obtained for similar but rigid rods. Finally, direct integration of the equation of motion in selected areas reveals the existence of motions, which are more complicated than the periodic motions determined analytically.

scholarly journals Mechanical Properties of Solder-Jointed Copper Rods with Electrodeposited Sn-Zn Alloy Films

Materials ◽  
2020 ◽  
Vol 13 (6) ◽  
pp. 1330 ◽  
Author(s):  
Tatsuya Tsurusaki ◽  
Takeshi Ohgai
Keyword(s):  
Solid Solution ◽  
Equilibrium Phase ◽  
Alloy System ◽  
Equilibrium Phase Diagram ◽  
Solid Solution Phase ◽  
Alloy Films ◽  
Cu Substrate ◽  
Soldering Process ◽  
Fracture Elongation ◽  
Zn Alloy

Enforced solid solution type Sn-Zn alloy films were electrochemically synthesized on Cu substrate from an aqueous solution containing citric acid complexes. The electrodeposition behavior of Sn-Zn alloys was classified to a normal co-deposition type, in which electrochemically nobler Sn deposits preferentially compared to Zn. Electrodeposited Sn-Zn alloy films were composed of a non-equilibrium phase, like an enforced solid solution, which was not observed in an equilibrium phase diagram of an Sn-Zn binary alloy system. By applying a thermal annealing process at 150 °C for 10 minutes, a pure Zn phase was precipitated from an electrodeposited Sn-based solid solution phase with excessively dissolved Zn atoms. During the soldering process, intermetallic phases such as Cu3Sn and Cu5Zn8 were formed at the interface between an Sn-Zn alloy and Cu substrate. Tensile strength and fracture elongation of solder-jointed Cu rods with Sn-8 at.%Zn alloy films reached ca. 40 MPa and 12%, respectively.

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