The Mechanisms Analysis of the ACF Bonding Strengths after the High Temperature/ Humidity Environment Test
2007 ◽
Vol 353-358
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pp. 2875-2878
Keyword(s):
The environmental experiments of the thermal cycling (-40~125°C) and the high temperature/humidity (85°C, 85%RH) aging were used to evaluate the reliability of the specimens bonded with ACFs. It was found that the high temperature/humidity was the harshest condition to the ACFs bonding. The DSC testing and interfacial stresses analysis has been done under the high temperature/humidity condition. The mechanisms of the bonding strength decrease were investigated.
High Temperature Bonding Effect of the Room-Temperature-Curing Phosphate Adhesive for C/C Composites
2016 ◽
Vol 680
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pp. 179-183
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Keyword(s):
2011 ◽
Vol 71-78
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pp. 1057-1061
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2017 ◽
Vol 110
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pp. 01084
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Keyword(s):
Study on Bonding Properties of Copper and Aluminum in Nano Scale Using Molecular Dynamics Simulation
2012 ◽
Vol 152-154
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pp. 183-187
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Keyword(s):
2013 ◽
Vol 791-793
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pp. 362-365
Keyword(s):