An Alignment Method for Lift-Off on Shallow Grooves in Transparent Substrates for Integrated Dual Grating Structures

2012 ◽  
Vol 503 ◽  
pp. 447-450
Author(s):  
Jin Yang Feng ◽  
Feng Chen ◽  
Yuan Fang Shang ◽  
Xiong Ying Ye
Keyword(s):  
Glass Substrate ◽  
Metal Layer ◽  
Image Contrast ◽  
Glass Wafer ◽  
Alignment Method ◽  
Lift Off ◽  
Chromium Films ◽  
Different Thickness ◽  
Device Property ◽  
Alignment Marks

In this Paper, we Propose an Alignment Method for Lift-Off on Shallow Grooves in Transparent Substrates without an Extra Mask. An Assistant Metal Layer Was Deposited on the Glass Substrate with Grooves to Increase the Reflectance, and then a Layer of Photoresist for Lift-Off Process Was Coated and Patterned Aligning with the Shallow Grooves. We Compared the Effect of Aluminum and Chromium Films with Different Thickness as Reflecting Layers. an Aluminum or Chromium Film with the Thickness Larger than 10nm Provides High Enough Image Contrast of Profile of the Alignment Marks Beneath the Photoresist. the Image Contrast of Contour Profile of the Marks Was Enhanced as the Thickness Increased. Lift-Off Process Was then Implemented on the Assistant Reflecting Layer. With a 20nm Cr Layer, we Successfully Did Lithography and Finished the Lift-Off Process to Pattern a Cr/Au Layer on Shallow Grooves in a Glass Wafer. Finally, the Assistant Cr Layer Was Removed Using Dry Etching. the Assistant Metal Layer Has No Undesirable Influence on the Following Process and the Device Property.

Passive Die Alignment in Glass Embedded Fan-Out Packaging

2019 ◽  
Vol 2019 (1) ◽  
pp. 000152-000156 ◽  
Author(s):  
Roman Ostholt ◽  
Rafael Santos ◽  
Norbert Ambrosius ◽  
Daniel Dunker ◽  
Jean-Pol Delrue
Keyword(s):  
Glass Substrate ◽  
Process Step ◽  
Glass Substrates ◽  
Minimal Dimension ◽  
Open Cavities ◽  
Accuracy Study ◽  
Study Test ◽  
Passive Alignment ◽  
State Of Art ◽  
Alignment Marks

Abstract The objective of this paper is to demonstrate the feasibility of glass mounting substrates made by Laser Induced Deept Etching (LIDE) technology, which include newly developed passive die alignment structures. The aim of these structures is to compensate for potential die misalignments and die shift issues which become severe when moving to panel level fan-out packaging. The passive alignment structures are located at two adjacent edges of the rectangular cavity and are created in the same process step as the open cavities. The filigree spring-like alignment structures benefit from being processed in a crack- and stress-free manner. Although the spring elements have a minimal dimension of less than 100 μm, these structures show an outstanding break strength while deformed when active dies are placed in the mounting cavity. Depending on the design, the spring elements can have a stroke of several tenths of micrometer which enable the compensation of rather large die displacements. Here, we present examples for LIDE-processed mounting glass substrates with the described features. The performance of the proposed design and method was evaluated with a die accuracy study. Test dies with alignment marks were placed in the cavities and measured relatively to alignments marks on the mounting glass substrate. The Fan-Out packaging concept based on the research shown here combines several advantages: due to the relatively high Young's modulus of the glass, the reconstituted wafer shows less warpage than in the state-of-art; while the passive alignment structures reduce the die shift to a minimum (depending on dicing accuracies and through package vias for package-on-package or antenna-in-package application), and can be readily integrated.

Calculation of Self-Healing Contract Resistance of Metallized Film

2014 ◽  
Vol 615 ◽  
pp. 236-239
Author(s):  
Zhong Hua Kong ◽  
Li Gang Wu ◽  
Chun Ya Tong ◽  
Zai Fei Luo
Keyword(s):  
Metal Layer ◽  
Interesting Property ◽  
Self Healing ◽  
Different Diameters ◽  
Different Thickness

Abstract. Self-healing is an interesting property of metallized capacitors. contract resistance is importance to self healing. In the paper contract resistance is calculated with different diameters of hole and different thickness of metal layer. The larger is radius of hole, the less is contract resistance. The thicker is metal layer, the less is contract resistance.

Vanadium Dioxide Thin Films for Thermo-Optical Switching Applications

2003 ◽  
Vol 785 ◽  
Author(s):  
Lijun Jiang ◽  
William N. Carr
Keyword(s):  
Thin Films ◽  
Phase Transition ◽  
Vanadium Dioxide ◽  
Optical Switching ◽  
Abrupt Change ◽  
Metal Layer ◽  
Heating And Cooling ◽  
Optical Switching Devices ◽  
Lift Off ◽  
Vanadium Dioxide Thin Films

ABSTRACTVanadium dioxide (VO2) thin films were fabricated by e-beam evaporation of vanadium thin films followed by thermal oxidation in oxygen ambient. The properties of the VO2 films were investigated for thermo-optical switching applications. Synthesized VO2 film displays a phase transition at 65 – 68 °C. It exhibits an abrupt change in optical reflectivity over the phase transition temperature range. Results for VO2 on a highly reflective metal layer are strongly dependent on the VO2 thickness. The optical switching has a major hysteresis of about 15 °C between the heating and cooling branches. The evolution of the surface morphology with the oxidation time was studied with a SEM. The VO2 film was patterned on microplatforms by metal lift-off technique. We conclude that the evaporation followed by oxidation is an effective method to produce active VO2 film for thermo-optical switching devices.

Tri-Metal Layered Semitransparent Electrode for Red Phosphorescent Organic Light-Emitting Diodes

2015 ◽  
Vol 15 (10) ◽  
pp. 8144-8148 ◽  
Author(s):  
Jae Woo Lee ◽  
Ho Won Lee ◽  
Song Eun Lee ◽  
Hyung Jin Yang ◽  
Sung Kyu Lee ◽  
...  
Keyword(s):  
Indium Tin Oxide ◽  
Glass Substrate ◽  
Light Emitting Diode ◽  
Metal Layer ◽  
Flexible Substrate ◽  
Flexible Display ◽  
Light Emitting ◽  
Light Emitting Devices ◽  
Organic Light Emitting Diode ◽  
Organic Light

In this paper, we fabricated tri-metal layered thin film semitransparent electrodes consisting of a thin conductive metal layer, sandwiched between two nickel layers. An equal red phosphorescent organic light-emitting diode (PHOLED) structure was deposited on the anodes of indium tin oxide (ITO) and three types of tri-metal layers (Ni/Al/Ni, Ni/Cu/Ni, and Ni/Ag/Ni, thickness of 3/7/3 nm in common) on a glass substrate. The optical and electrical performances of the device using Ni/Ag/Ni were improved more than the performances of the other devices due to the micro-cavity effect in accordance with the various electrode characteristics. Moreover, we fabricated the same red PHOLED structures on a flexible substrate, as a consequence, showed competitive emission characteristics compared to the devices fabricated on a glass substrate. Therefore, this study could succeed to additional research on flexible display panel and light-emitting devices with ITO-free electrodes.

FABRICATION OF MICRO PROBE-TYPE ELECTRODES FOR MICROELECTRO-CHEMICAL MACHINING USING MICROFABRICATION

2010 ◽  
Vol 24 (15n16) ◽  
pp. 2639-2644 ◽  
Author(s):  
W. B. PARK ◽  
J. H. CHOI ◽  
C. W. PARK ◽  
G. M. KIM ◽  
H. S. SHIN ◽  
...  
Keyword(s):  
Metal Layer ◽  
Electrical Contacts ◽  
Wet Etching ◽  
Probe Type ◽  
Test Results ◽  
Steel Mold ◽  
Lift Off

In this study, the mass fabrication of microelectrode tools for microelectrochemical machining (MECM) was studied using microfabrication processes. The cantilever type geometry of microelectrodes was defined by photolithography processes, and metal patterns were made for electrical contacts. Various fabrication processes were studied for the fabrication of microelectrode tools, such as wet etching, lift-off, and electroforming for metal layer patterning. MECM test results showed feasibility of the fabricated electrode tools. The microfabricated electrodes can be used as micromachining tools for various electrical micromachining of steel mold and parts of microdevices.

scholarly journals Oxide composition and period variation of thermochemical LIPSS on chromium films with different thickness

2018 ◽  
Vol 26 (6) ◽  
pp. 7712 ◽  
Author(s):  
A. V. Dostovalov ◽  
V. P. Korolkov ◽  
K. A. Okotrub ◽  
K. A. Bronnikov ◽  
S. A. Babin
Keyword(s):  
Period Variation ◽  
Oxide Composition ◽  
Chromium Films ◽  
Different Thickness

scholarly journals Double metal layer lift-off process for the robust fabrication of plasmonic nano-antenna arrays on dielectric substrates using e-beam lithography

2019 ◽  
Vol 9 (5) ◽  
pp. 2046 ◽  
Author(s):  
P. Muñoz ◽  
Y. S. Yong ◽  
M. Dijkstra ◽  
F. B. Segerink ◽  
S. M. García-Blanco
Keyword(s):  
Antenna Arrays ◽  
Metal Layer ◽  
Dielectric Substrates ◽  
Lift Off

scholarly journals Application of electrical pulsed discharge to metal layer exfoliation from glass substrate of hard-disk platter

2021 ◽  
pp. 100306
Author(s):  
Masataka Kondo ◽  
Soowon Lim ◽  
Taketoshi Koita ◽  
Takao Namihira ◽  
Chiharu Tokoro
Keyword(s):  
Glass Substrate ◽  
Metal Layer ◽  
Hard Disk ◽  
Pulsed Discharge

Preparation, Coating and Patterning of Cu-Based Catalyst for Methanol Steam Reforming by Micro Fuel Reformer

2005 ◽  
Author(s):  
Taegyu Kim ◽  
Dae Hoon Lee ◽  
Cheonho Yoon ◽  
Dae-Eun Park ◽  
Sejin Kwon ◽  
...  
Keyword(s):  
Steam Reforming ◽  
Conversion Rate ◽  
Sacrificial Layer ◽  
Catalyst Layer ◽  
Precipitation Method ◽  
Poly Vinyl Alcohol ◽  
Methanol Steam Reforming ◽  
Glass Wafer ◽  
Fast Kinetics ◽  
Lift Off

Recent increase in need for a portable power source drives research on micro fuel cell and micro fuel reformer as a key component of micro power generation system. Various concept of reforming system is proposed and has been studied. As an attempt to develop wafer based micro reforming system, preparation, coating, and patterning of Cu-based catalysts for methanol steam reforming for micro fuel reformer are presented. Preliminary step to develop MEMS based micro fuel reformer is carried. As a first step, Cu-based catalysts are prepared by co-precipitation method. The effect of precipitation condition on physical characteristics and catalytic activity of the catalyst such as particle size, conversion rate and quality of coating on substrate are reported. And then coating processes of prepared catalysts on glass and silicon wafer are developed. A uniform and robust catalyst layer is obtained. The amount of coated catalyst on unit area of wafer is measured to be 5∼8 mg/cm2, and the thickness of catalyst layer is about 50μm. By multiple coating processes, catalyst thickness can be controlled and up to 15mg/cm2 is obtained that has good reactivity. After then, patterning of coated catalyst layer is reported. Deposited catalyst layer is patterned by way of lift-off process of PVA (Poly-Vinyl Alcohol), organic sacrificial layer, by heating the substrate instead of etching a sacrificial layer. With the results aforementioned on catalyst preparation, coating, and patterning, a prototype micro catalytic reactor for micro fuel reformer is fabricated with MEMS technology. The fabrication process includes wet anisotropic etching of photosensitive glass wafer, coating/patterning of catalyst and bonding of layers. Next step that is challenging part of development of micro reformer is to find a way to overcome the effect of heat loss that lowers the conversion rate of reforming process and to achieve fast kinetics for reduction of the device scale. We are pursuing further optimization of structural design to improve conversion efficiency and to obtain fast kinetics.

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