Investigation into Chemo-Mechanical Fixed Abrasive Polishing of Fused Silica with the Assistance of Ultrasonic Vibration

2012 ◽  
Vol 523-524 ◽  
pp. 155-160 ◽  
Author(s):  
Ya Guo Li ◽  
Yong Bo Wu ◽  
Li Bo Zhou ◽  
Hui Ru Guo ◽  
Jian Guo Cao ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Ultrasonic Vibration ◽  
Material Removal Rate ◽  
Material Removal ◽  
Optical Glass ◽  
Removal Rate ◽  
Fused Silica ◽  
Processing Efficiency ◽  
Machined Surface ◽  
Fixed Abrasive

Ultrasonic vibration assisted processing is well known for the improvement in machined surface quality and processing efficiency due to the reduced forces and tribology-generated heating when grinding hard-brittle materials. We transplanted this philosophy to chemo-mechanical fixed abrasive polishing of optical glass, namely fused silica, in an attempt to improve surface roughness and/or material removal rate. Experiments were conducted to elucidate the fundamental characteristics of chemo-mechanical fixed abrasive polishing of fused silica in the presence and absence of ultrasonic vibration on a setup with an in-house built gadget. The experimental results show that ultrasonic vibration assisted chemo-mechanical fixed abrasive polishing can yield increased material removal rate while maintaining the surface roughness of manufactured optics compared to conventional fixed abrasive polishing without ultrasonic vibration. The mechanism of material removal in fixed abrasive polishing was also delved. We found that the glass material is removed through the synergic effects of chemical and mechanical actions between abrasives and glass and the resultant grinding swarf contains ample Si element as well as Ce element, standing in stark contrast to the polisher that contains abundant Ce element and minor Si element.

Preparation and Evaluation of Hydrophilic Fixed Abrasive Pad

2010 ◽  
Vol 431-432 ◽  
pp. 17-20 ◽  
Author(s):  
Yong Wei Zhu ◽  
Jun Li ◽  
Jun Wang ◽  
Kui Lin
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Urethane Acrylate ◽  
Swelling Ratio ◽  
Pencil Hardness ◽  
Fixed Abrasive Pad ◽  
Preparation And Evaluation ◽  
Fixed Abrasive

The swelling ratio and the pencil hardness of pad were introduced to evaluate the properties of hydrophilic fixed abrasive (FA) pad. The effect of pad composition on its swelling ratio and pencil hardness was studied. Results show that the swelling ratio increases with the rise of content of Trimethylopropane Triacrylate (TMPTA) and Urethane Acrylate (PUA) and the pad gets harder while there is more TMPTA and less PUA. Results also show that a low swelling ratio corresponds to a high material removal rate (MRR), and a low wet pencil hardness to a low surface roughness in each group.

scholarly journals Effect to the Surface Composition in Ultrasonic Vibration-Assisted Grinding of BK7 Optical Glass

2020 ◽  
Vol 10 (2) ◽  
pp. 516 ◽  
Author(s):  
Pei Yi Zhao ◽  
Ming Zhou ◽  
Xian Li Liu ◽  
Bin Jiang
Keyword(s):  
Surface Roughness ◽  
Ultrasonic Vibration ◽  
Material Removal ◽  
Surface Composition ◽  
Rotation Speed ◽  
Optical Glass ◽  
Machined Surface ◽  
Spindle Rotation ◽  
Ultrasonic Vibration Assisted Grinding ◽  
Ductile Removal

Because of the changes in cutting conditions and ultrasonic vibration status, the proportion of multiple material removal modes are of uncertainty and complexity in ultrasonic vibration-assisted grinding of optical glass. Knowledge of the effect of machined surface composition is the basis for better understanding the influence mechanisms of surface roughness, and also is the key to control the surface composition and surface quality. In the present work, 32 sets of experiments of ultrasonic vibration-assisted grinding of BK7 optical glass were carried out, the machined surface morphologies were observed, and the influence law of machining parameters on the proportion of different material removal was investigated. Based on the above research, the effect of surface composition was briefly summarized. The results indicated that the increasing of spindle rotation speed, the decreasing of feed rate and grinding depth can improve the proportion of ductile removal. The introduction of ultrasonic vibration can highly restrain the powdering removal, and increase the proportion of ductile removal. Grinding depth has a dominant positive effect on the surface roughness, whereas the spindle rotation speed and ultrasonic amplitude both have negative effect, which was caused by the reduction of brittle fracture removal.

scholarly journals An Experimental Study on the Precision Abrasive Machining Process of Hard and Brittle Materials with Ultraviolet-Resin Bond Diamond Abrasive Tools

Materials ◽  
2019 ◽  
Vol 12 (1) ◽  
pp. 125 ◽  
Author(s):  
Lei Guo ◽  
Xinrong Zhang ◽  
Shibin Chen ◽  
Jizhuang Hui
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Manufacturing Process ◽  
Material Removal ◽  
Removal Rate ◽  
Machining Process ◽  
Abrasive Machining ◽  
Machining Performance ◽  
Machined Surface ◽  
Ultraviolet Curable

Ultraviolet-curable resin was introduced as a bonding agent into the fabrication process of precision abrasive machining tools in this study, aiming to deliver a rapid, flexible, economical, and environment-friendly additive manufacturing process to replace the hot press and sintering process with thermal-curable resin. A laboratory manufacturing process was established to develop an ultraviolet-curable resin bond diamond lapping plate, the machining performance of which on the ceramic workpiece was examined through a series of comparative experiments with slurry-based iron plate lapping. The machined surface roughness and weight loss of the workpieces were periodically recorded to evaluate the surface finish quality and the material removal rate. The promising results in terms of a 12% improvement in surface roughness and 25% reduction in material removal rate were obtained from the ultraviolet-curable resin plate-involved lapping process. A summarized hypothesis was drawn to describe the dynamically-balanced state of the hybrid precision abrasive machining process integrated both the two-body and three-body abrasion mode.

Influences of Properties of Fixed Abrasive Tool on the Lapping Process of Stainless Steel Substrate

2010 ◽  
Vol 135 ◽  
pp. 365-369
Author(s):  
Cong Rong Zhu ◽  
Bing Hai Lv ◽  
Ju Long Yuan
Keyword(s):  
Surface Roughness ◽  
Stainless Steel ◽  
Material Removal Rate ◽  
Material Removal ◽  
Stainless Steel Substrate ◽  
Removal Rate ◽  
Steel Substrate ◽  
Abrasive Tool ◽  
Bonding Material ◽  
Fixed Abrasive

To improve the machining efficiency as well as surface roughness, a series of experiments employed fixed abrasive tools are carried out for stainless steel substrate, and influences of properties of fixed abrasive tool on the lapping process are studied. It is found that the resin is the best bonding material in this study. The surface roughness under different concentration of bonding material is similar, and the material removal rate (MRR) increases as the concentration of bonding material decreases from 50% to 20%. But too little of bonding material results into low bond strength that causing low material removal rate. It is also found that higher shear strength, lower wear rate, and the shear strength of the tool with 35% bonding material is the highest. It is obvious that the surface roughness and material removal rate decline as the grit size decreases. The roughness of surface lapped with resin bonded 4000# SiC abrasive tool comes to 18nm, and the material removal rate is 0.63μm/min.

scholarly journals Optimal design and experimental study of fixed abrasive pads based on coupling of damping regulation and pellet arrangement

2021 ◽  
Vol 12 (1) ◽  
pp. 97-108
Author(s):  
Chaoqun Xu ◽  
Congfu Fang ◽  
Yuan Li ◽  
Chong Liu
Keyword(s):  
Surface Roughness ◽  
Pressure Distribution ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Wafer Surface ◽  
Test Results ◽  
Workpiece Material ◽  
Fixed Abrasive

Abstract. Lapping and polishing technology is an efficient processing method for wafer planarization processing. The structure of the fixed abrasive pad (FAP) is one of the most concerning issues in the research. The FAP structure affects the pressure distribution on the wafer surface, and the pressure distribution during processing has a significant influence on the wafer surface. Therefore, in this paper, a better pressure distribution is obtained by adjusting the angle of the spiral arrangement and the damping distribution of the damping layer of the FAP, thereby obtaining better processing quality. Based on the above theory, a new type of FAP, with coupling between the arrangement of the pellets and the damping regulation of the damping layer, was designed and optimized. The machining effects of different FAPs on the workpiece surface are compared in terms of material removal rate, material removal thickness, and surface roughness. The test results show that the workpiece material removal rate is higher than that of the traditional FAP when using the optimized FAP. The non-uniformity of the optimized FAP for that of material removal was 4.034 µm, which was lower than the traditional FAPs by 24.4 % and 17.6 %, respectively. The average surface roughness, Ra, of the optimized FAP is 0.21 µm, which is lower than 19.1 % and 12.5 % of the two traditional FAPs, respectively. Therefore, workpiece material removal and distribution are more uniform, and the surface quality of the workpiece is better when the optimized FAP processing is used. The test results prove that the optimized pellet arrangement and damping can achieve a better surface quality of the workpiece, which can meet the precision lapping process requirements for high-quality surfaces and large-scale production of brittle and hard materials such as sapphire.

scholarly journals Modeling and Analysis of the Material Removal Rate for Ultrasonic Vibration-assisted Polishing of Optical Glass BK7

2021 ◽  
Author(s):  
Yingdong Liang ◽  
Chao Zhang ◽  
Xin Chen ◽  
Tianqi Zhang ◽  
Tianbiao Yu ◽  
...  
Keyword(s):  
Ultrasonic Vibration ◽  
Material Removal Rate ◽  
Material Removal ◽  
Optical Glass ◽  
Removal Rate ◽  
Machining Accuracy ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Abrasive Particles ◽  
Material Removal Model

Abstract The emergence of ultrasonic vibration-assisted polishing technology has effectively improved the machining accuracy and efficiency of hard and brittle materials in modern optical industry, however, the material removal mechanism of ultrasonic vibration-assisted polishing (UVAP) still needs to be further revealed. This paper focuses on the material removal mechanism of ultrasonic vibration-assisted polishing of optical glass (BK7), the application of ultrasonic vibration to axial vibration and the atomization of polishing slurry, the material removal model was established. Based on the analysis of the relationship between the nominal distance d of the polishing pad and the actual contact area distribution, the prediction of the material removal profile is realized. In addition, the effects of different parameters on the material removal rate (MRR) were analyzed, including polishing force, spindle speed, abrasive particle size, ultrasonic amplitude, feed rate, and flow-rate of polishing slurry. Based on the motion equation of abrasive particles, the trajectory of abrasive particles in the polishing slurry was simulated, and the simulation results show that the introduction of the ultrasonic vibration field changes the motion state and trajectory of embedded and free abrasive particles. The new model can not only qualitatively analyze the influence of different process parameters on MRR, but also predict the material removal depth and MRR, providing a possibility for deterministic material removal and a theoretical basis for subsequent polishing of complex curved surfaces of optical glass.

Influence of Abrasive on Planarization Polishing with the Tiny-Grinding Wheel Cluster Based on the Magnetorheological Effect

2009 ◽  
Vol 76-78 ◽  
pp. 229-234 ◽  
Author(s):  
Qiu Sheng Yan ◽  
Yong Yang ◽  
Jia Bin Lu ◽  
Wei Qiang Gao
Keyword(s):  
Surface Roughness ◽  
Particle Size ◽  
Material Removal Rate ◽  
Material Removal ◽  
Magnetic Particles ◽  
Optical Glass ◽  
Removal Rate ◽  
Grinding Wheel ◽  
Material Particle ◽  
Material Removal Model

Experiments were conducted to polish optical glass with the magnetorheological (MR) effect-based tiny-grinding wheel cluster, and the influences of abrasive material, particle size and content on the material removal rate and surface roughness are investigated. The experimental results indicate that: the higher the hardness of abrasives, the higher the material removal rate, but the abrasives with lower hardness can obtain lower surface roughness. The better polishing quality of the workpiece can be obtained when the particle size of abrasives is similar to the particle size of magnetic particles. Moreover, the content of abrasives has an optimum value, and the material removal rate and the surface quality can not be improved further when the content of abrasives exceeds the optimum value. On the basis of above, the material removal model of the new planarization polishing technique is presented.

Enhancement of machining and surface quality of quaternary alloyed NiTiCuZr shape memory alloy through ultrasonic vibration coupled WEDM

2021 ◽  
pp. 146442072110582
Author(s):  
C Balasubramaniyan ◽  
K Rajkumar ◽  
S Santosh
Keyword(s):  
Surface Roughness ◽  
Shape Memory ◽  
Ultrasonic Vibration ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Ultrasonic Frequency ◽  
Machining Parameters ◽  
Pulse On Time ◽  
Pulse Off Time

NiTiCuZr shape memory alloys (SMA) outperform ternary and binary SMA alloys in terms of functional fatigue and higher temperature performance due to their high cyclic stability and transformation temperatures. Owing to the impairment of the shape memory effect during processing, it is difficult to select a manufacturing process for obtaining design functionality with the required dimensions and surface roughness. In this work, a high-temperature NiTiCuZr SMA was machined using an ultrasonic vibration assisted wire electric discharge machine (USV-WEDM). The machining was conducted using various parameters with a constant ultrasonic vibration of 20 kHz provided on a wire-electrode to evaluate surface roughness (Ra) and material removal rate (MRR). Scanning Electron Microscope (SEM) and Energy Dispersive X-Ray analysis (EDX) were utilized to examine the surface integrity and chemical composition of the machined surfaces. MRR increased by 62% with a steady increase in pulse-on time ( Ton) and applied current ( I), whereas increasing levels of parameters such as pulse-off time ( Toff) and servo voltage (SV) reduced surface roughness ( Ra) by 69%. The results reveal that tool vibration at ultrasonic frequency reduces the surface roughness and improves the material removal rate of the machined NiTiCuZr SMA as compared to that of non-ultrasonic assisted machining conditions. SEM-EDX investigation reveals that the formation of re-solidification and oxide layers during NiTiCuZr machining at high machining parameters results in increased hardness and surface roughness. USV-WEDM is a suitable process for machining SMA alloy without adversely impacting SMA properties.

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