Ultrasonic Vibration Assisted Grinding of Microstructures on Binderless Tungsten Carbide (WC)

Microstructured optical elements made of glass are generally replicated by hot pressing with super-hard materials, such as binderless tungsten carbide (WC) and precision ceramic. However, in grinding of microstructures, problems frequently occur in terms of rough ground surface, chipping and rounding of micro-structures edges when compared to conventional grinding. In order to overcome these technological constraints, a promising precision grinding method for microstructured surfaces that applies ultrasonic vibration to improve the surface quality, and protect the edges and tips of microstructured surfaces is presented. The experimental investigation of ultrasonic vibration assisted grinding of microstructures on binderless WC is researched. The effects of ultrasonic vibration on surface roughness, form accuracy and edge radius were analyzed. The morphology of surface and array edges was examined with a scanning electron microscope (SEM), while the surface roughness was measured by a laser interferometer. And a contact probe profilometer was used to assess the form of array and radius of microstructured edges. Experimental results showed that the application of ultrasonic vibration leads to significant improvements of the surface roughness and edges of microstructures compared with traditional precision grinding processes. A micro cylinder lens array of binderless WC with surface roughness of 78nm and edge radius of less than 1μm was obtained. The novel grinding method is feasible and applicable in machining higher form accuracy microstructures.