Experimental Study on Heat Dissipative Ability in Recycled Thermoplastic Vulcanizate and Reclaimed Rubber Composites

2020 ◽  
Vol 856 ◽  
pp. 276-285
Author(s):  
Rungsima Yeetsorn ◽  
Yaowaret Maiket ◽  
Thitinun Ungtrakul
Keyword(s):  
Thermal Conductivity ◽  
Heat Dissipation ◽  
Thermoplastic Elastomer ◽  
Elastic Behavior ◽  
Rubber Composites ◽  
Conductive Materials ◽  
Elastomeric Materials ◽  
Thermally Conductive ◽  
Device Applications ◽  
Elastomeric Composites

In our time with the growing cooling demand in electronics and energy industries, new thermally conductive materials are in high demand. Thermal gasket and thermal interface materials (TIM) are applications acquiring the characteristics of the thermally conductive materials. They are used to offer bonding strength and efficient heat dissipation for heat dissipating device applications. These materials are inserted between two components in order to increase the thermal coupling between them. Elastomeric materials are promising as the thermal gasket and TIM. They are, however, limited for thermal conductivity causing a thermal insulator behaviour. In this framework, the major challenge is to create suitable elastomeric composites for enhancing thermal conductivity, whereas remaining a good elastic behavior. This article presents the effects of thermally conductive fillers (aluminum nitrile and zinc oxide) on thermal properties and flexibility of recycled thermoplastic elastomer vulcanizate composites and reclaimed rubber composites, while the analysis of composite morphology is scrutinized. The objective of this research is to perceive the characteristics of recycled elastomeric composites in order to deduce a fundamental notion to develop the gaskets or TIMs from recycled materials. New flexible composites are capable to provide approximately 0.4 W/m-K of thermal conductivity. The result indicates that the composites are conceivable to be applied for thermally conductive tape or adhesive applications which required the thermal conductivity in the range of 0.4-0.5 W/m-K.

scholarly journals Development of Thermally Conductive Polyurethane Composite by Low Filler Loading of Spherical BN/PMMA Composite Powder

2019 ◽  
Vol 9 (1) ◽  
Author(s):  
Kai-Han Su ◽  
Cherng-Yuh Su ◽  
Cheng-Ta Cho ◽  
Chung-Hsuan Lin ◽  
Guan-Fu Jhou ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Heat Dissipation ◽  
Three Dimensional ◽  
Filler Loading ◽  
High Thermal Conductivity ◽  
Heat Diffusion ◽  
Composite Powders ◽  
Polyurethane Composite ◽  
Uniform Dispersion ◽  
Thermally Conductive

Abstract The issue of electronic heat dissipation has received much attention in recent times and has become one of the key factors in electronic components such as circuit boards. Therefore, designing of materials with good thermal conductivity is vital. In this work, a thermally conductive SBP/PU composite was prepared wherein the spherical h-BN@PMMA (SBP) composite powders were dispersed in the polyurethane (PU) matrix. The thermal conductivity of SBP was found to be significantly higher than that of the pure h-BN/PU composite at the same h-BN filler loading. The SBP/PU composite can reach a high thermal conductivity of 7.3 Wm−1 K−1 which is twice as high as that of pure h-BN/PU composite without surface treatment in the same condition. This enhancement in the property can be attributed to the uniform dispersion of SBP in the PU polymer matrix that leads to a three-dimensional continuous heat conduction thereby improving the heat diffusion of the entire composite. Hence, we provide a valuable method for preparing a 3-dimensional heat flow path in polyurethane composite, leading to a high thermal conductivity with a small amount of filler.

scholarly journals Nano liquid metal for the preparation of a thermally conductive and electrically insulating material with high stability

RSC Advances ◽  
2018 ◽  
Vol 8 (29) ◽  
pp. 16232-16242 ◽  
Author(s):  
P. Fan ◽  
Z. Sun ◽  
Y. Wang ◽  
H. Chang ◽  
P. Zhang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Liquid Metal ◽  
High Stability ◽  
Insulating Material ◽  
Conductive Materials ◽  
Thermally Conductive ◽  
Base Polymer

Compared to liquid metal (LM) microdroplets based thermally conductive materials (micro-LM-THEMs), nano LM-THEMs (nLM-THEMs) presents a more stable electric insulating property even upon stress, achieving ~50-fold thermal conductivity over base polymer.

Multifunctional Liquid Crystal Polymeric Composites Embedded With Graphene Nano Platelets

2011 ◽  
Author(s):  
Muhammad Omer Khan ◽  
Ellen Chan ◽  
Siu N. Leung ◽  
Hani Naguib ◽  
Francis Dawson ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Liquid Crystal ◽  
Heat Dissipation ◽  
Three Dimensional ◽  
Cost Effective ◽  
Polymeric Composites ◽  
Potential Cost ◽  
Conductive Composites ◽  
The Matrix ◽  
Thermally Conductive

This paper studies the development of new multifunctional liquid crystal polymeric composites filled with graphene nano platelets (GNPs) for electronic packaging applications. A series of parametric studies were conducted to study the effect of GNP content on the thermal conductivity of LCP-based nanocomposites. Graphene, ranging from 10 wt. % to 50 wt. %, were melt-compounded with LCP using a twin-screw compounder. The extrudates were ground and compression molded into small disc-shaped specimens. The thermal conductivity of LCP matrix was observed to have increased by more than 1000% where as the electrical conductivity increased by 13 orders of magnitude with the presence of 50 wt% GNP fillers. The morphology of the composites was analyzed using SEM micrographs to observe the dispersion of filler within the matrix. These thermally conductive composites represent potential cost-effective materials to injection mold three-dimensional, net-shape microelectronic enclosures with superior heat dissipation performance.

scholarly journals Enhanced thermal conductivity of graphene nanoplatelets epoxy composites

2017 ◽  
Vol 35 (2) ◽  
pp. 382-389 ◽  
Author(s):  
Lukasz Jarosinski ◽  
Andrzej Rybak ◽  
Karolina Gaska ◽  
Grzegorz Kmita ◽  
Renata Porebska ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
Graphene Nanoplatelets ◽  
Electrical Insulation ◽  
Graphene Nanocomposites ◽  
Thermally Conductive ◽  
Conductive Particles ◽  
Proper Performance ◽  
Enhanced Thermal Conductivity

Abstract Efficient heat dissipation from modern electronic devices is a key issue for their proper performance. An important role in the assembly of electronic devices is played by polymers, due to their simple application and easiness of processing. The thermal conductivity of pure polymers is relatively low and addition of thermally conductive particles into polymer matrix is the method to enhance the overall thermal conductivity of the composite. The aim of the presented work is to examine a possibility of increasing the thermal conductivity of the filled epoxy resin systems, applicable for electrical insulation, by the use of composites filled with graphene nanoplatelets. It is remarkable that the addition of only 4 wt.% of graphene could lead to 132 % increase in thermal conductivity. In this study, several new aspects of graphene composites such as sedimentation effects or temperature dependence of thermal conductivity have been presented. The thermal conductivity results were also compared with the newest model. The obtained results show potential for application of the graphene nanocomposites for electrical insulation with enhanced thermal conductivity. This paper also presents and discusses the unique temperature dependencies of thermal conductivity in a wide temperature range, significant for full understanding thermal transport mechanisms.

scholarly journals High thermal conductivity in soft elastomers with elongated liquid metal inclusions

2017 ◽  
Vol 114 (9) ◽  
pp. 2143-2148 ◽  
Author(s):  
Michael D. Bartlett ◽  
Navid Kazem ◽  
Matthew J. Powell-Palm ◽  
Xiaonan Huang ◽  
Wenhuan Sun ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Liquid Metal ◽  
Heat Dissipation ◽  
Dielectric Materials ◽  
Phonon Transport ◽  
High Thermal Conductivity ◽  
Stretchable Electronics ◽  
Mechanical Stiffness ◽  
Mechanical Coupling ◽  
Thermally Conductive

Soft dielectric materials typically exhibit poor heat transfer properties due to the dynamics of phonon transport, which constrain thermal conductivity (k) to decrease monotonically with decreasing elastic modulus (E). This thermal−mechanical trade-off is limiting for wearable computing, soft robotics, and other emerging applications that require materials with both high thermal conductivity and low mechanical stiffness. Here, we overcome this constraint with an electrically insulating composite that exhibits an unprecedented combination of metal-like thermal conductivity, an elastic compliance similar to soft biological tissue (Young’s modulus < 100 kPa), and the capability to undergo extreme deformations (>600% strain). By incorporating liquid metal (LM) microdroplets into a soft elastomer, we achieve a ∼25× increase in thermal conductivity (4.7 ± 0.2 W⋅m−1⋅K−1) over the base polymer (0.20 ± 0.01 W⋅m−1·K−1) under stress-free conditions and a ∼50× increase (9.8 ± 0.8 W⋅m−1·K−1) when strained. This exceptional combination of thermal and mechanical properties is enabled by a unique thermal−mechanical coupling that exploits the deformability of the LM inclusions to create thermally conductive pathways in situ. Moreover, these materials offer possibilities for passive heat exchange in stretchable electronics and bioinspired robotics, which we demonstrate through the rapid heat dissipation of an elastomer-mounted extreme high-power LED lamp and a swimming soft robot.

scholarly journals Thermal Conductivity Characterization of Thermal Grease Containing Copper Nanopowder

Materials ◽  
2020 ◽  
Vol 13 (8) ◽  
pp. 1893 ◽  
Author(s):  
Haneul Kang ◽  
Hyunji Kim ◽  
Jihye An ◽  
Siyeon Choi ◽  
Jinho Yang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
Internal Heat ◽  
Upward Trend ◽  
Heat Transfer Medium ◽  
Conductive Materials ◽  
Increasing Trend ◽  
Thermal Grease

As electronic devices and mainboards become smaller, the need for thermal conductive materials having excellent internal heat dissipation is increasing. In this study, nano thermal grease was prepared by mixing in copper nanopowder, which is used as a heat transfer medium in thermal grease, which is a kind of thermal conductive material, with silicon oil. In addition, copper powder was mixed with graphene and alumina, respectively, and the thermal conductivity performance was compared. As a result, the thermal conductivity improved by 4.5 W/m·k over the silicon base, and the upward trend of thermal conductivity increased steadily up to 15 vol. %, and the increasing trend decreased after 20 vol. %. In addition, the increased rate of thermal conductivity from 0 to 5 vol. % and 10 to 15 vol. % was the largest.

Flexible polyurethane/boron nitride composites with enhanced thermal conductivity

2019 ◽  
Vol 32 (3) ◽  
pp. 324-333 ◽  
Author(s):  
Ting Fei ◽  
Yanbao Li ◽  
Baocheng Liu ◽  
Chengbo Xia
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Thermal Management ◽  
High Stability ◽  
Heat Dissipation ◽  
Thermoplastic Polyurethane ◽  
Thermally Conductive ◽  
Mechanical Bending ◽  
Flexible Polyurethane ◽  
Enhanced Thermal Conductivity

Polymer-based composites with high thermal conductivity have great potential application as thermal management materials. This study was devoted to improving the thermal conductivity of the flexible thermoplastic polyurethane (TPU) by employing boron nitride (BN) as heat filler. We prepared flexible and thermally conductive TPU/BN composite via solution mixing and hot pressing. The thermal conductivity of the TPU/BN composite with 50 wt% BN (32.6 vol%) reaches 3.06 W/m·K, approximately 1290% enhancement compared to that of pure TPU (0.22 W/m·K). In addition, the thermal conductivity of our flexible TPU/BN composite with 30 wt% BN is almost not varied (a decrease of only 2.5%) after 100 cycles of mechanical bending, which indicates the high stability of heat conduction of our flexible TPU/BN composite under mechanical bending. The maximum tensile strength of the TPU/BN composite with 5 wt% BN is 48.9 MPa, 14% higher than that of pure TPU (43.2 MPa). Our flexible and highly thermally conductive TPU/BN composites show promise for heat dissipation in various applications in the electronics field.

Effect of exfoliated graphite nanoplatelets on thermal and heat deflection properties of kenaf polypropylene hybrid nanocomposites

2016 ◽  
Vol 36 (9) ◽  
pp. 877-889 ◽  
Author(s):  
Christopher Igwe Idumah ◽  
Azman Hassan
Keyword(s):  
Electron Microscopy ◽  
Thermal Conductivity ◽  
Thermal Stability ◽  
Heat Dissipation ◽  
Hybrid Nanocomposites ◽  
Exfoliated Graphite ◽  
Graphite Nanoplatelets ◽  
Uniform Dispersion ◽  
Thermally Conductive ◽  
And Behavior

Abstract Exfoliated graphite nanoplatelet (GNP) polypropylene (PP)/kenaf fiber (KF) hybrid nanocomposites (PP/KF/MAPP/GNP collectively presented as PKMG) were developed through melt extrusion using a co-rotating screw speed extruder. The loadings of GNPs in nanocomposites were varied from 1–5 phr and characterized for thermal conductivity, stability and behavior, morphology, and heat deflection temperature (HDT). Results revealed increasing effective thermal conductivity with increasing inclusion of GNP. This behavior was attributed to the formation of thermally conductive, interconnected, sheets of GNP which enhanced heat dissipation. Thermal stability analysis revealed high thermal residue content at 3 phr loading attributed to uniform dispersion of GNP sheets in polymer matrix and the formation of enhanced oxygen-barrier due to effective char formation. Results also revealed enhanced HDT (0.46 MPa/1.8 MPa) with increasing incorporation of GNP ascribed to high modulus and thermal stability of GNP sheets. This implies capability of material to sustain loading at high temperatures without losing its rigidity. Thermal behavior revealed increased crystallization temperature and reduced degree of crystallization with slight increase in melting temperature in the range of 2–5°C. Morphological analysis using transmission electron microscopy (TEM) and field emission scanning electron microscopy (FESEM) revealed exfoliated and uniform dispersion of graphene in matrix polymer at 3 phr loading.

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