High Temperature Silicon Carbide CMOS Integrated Circuits

2011 ◽  
Vol 679-680 ◽  
pp. 726-729 ◽  
Author(s):  
David T. Clark ◽  
Ewan P. Ramsay ◽  
A.E. Murphy ◽  
Dave A. Smith ◽  
Robin. F. Thompson ◽  
...  

The wide band-gap of Silicon Carbide (SiC) makes it a material suitable for high temperature integrated circuits [1], potentially operating up to and beyond 450°C. This paper describes the development of a 15V SiC CMOS technology developed to operate at high temperatures, n and p-channel transistor and preliminary circuit performance over temperature achieved in this technology.

2011 ◽  
Vol 2011 (HITEN) ◽  
pp. 000115-000119 ◽  
Author(s):  
R.F. Thompson ◽  
D.T. Clark ◽  
A.E. Murphy ◽  
E.P Ramsay ◽  
D.A Smith ◽  
...  

The wide band-gap of Silicon Carbide makes it a material suitable for IC's [1] operating up to 450°C. The maximum operating temperature achieved will depend on the transistor technology selected, interconnect metallisation and device packaging. This paper describes transistor and circuit results achieved in SiC CMOS technology, where the major issue addressed is the gate dielectric performance. N and p-channel MOSFET structures have been demonstrated operating at temperatures up to 400°C Test circuits including simple logic cells, ring oscillators, operational amplifiers and gate drive circuits have been fabricated and the characteristics of ring oscillators are presented here. Floating capacitor structures have also been fabricated for use in future analogue and mixed signal circuits. This technology will be initially applied in applications including signal conditioning for sensors and control of SiC based power switching devices, where the high temperature capability will match that of the SiC power devices which are now becoming commercially available.


2015 ◽  
Vol 69 (11) ◽  
pp. 49-55 ◽  
Author(s):  
H. Takahashi ◽  
T. Anzai ◽  
F. Kato ◽  
S. Sato ◽  
H. Tanisawa ◽  
...  

2016 ◽  
Vol 144 ◽  
pp. 551-558 ◽  
Author(s):  
J. López-Vidrier ◽  
P. Löper ◽  
M. Schnabel ◽  
S. Hernández ◽  
M. Canino ◽  
...  

1995 ◽  
Vol 06 (01) ◽  
pp. 211-236 ◽  
Author(s):  
R.J. TREW ◽  
M.W. SHIN

Electronic and optical devices fabricated from wide band gap semiconductors have many properties ideal for high temperature, high frequency, high power, and radiation hard applications. Progress in wide band gap semiconductor materials growth has been impressive and high quality epitaxial layers are becoming available. Useful devices, particularly those fabricated from SiC, are rapidly approaching the commercialization stage. In particular, MESFETs (MEtal Semiconductor Field-Effect Transistors) fabricated from wide band gap semiconductors have the potential to be useful in microwave power amplifier and oscillator applications. In this work the microwave performance of MESFETs fabricated from SiC, GaN and semiconducting diamond is investigated with a theoretical simulator and the results compared to experimental measurements. Excellent agreement between the simulated and measured data is obtained. It is demonstrated that microwave power amplifiers fabricated from these semiconductors offer superior performance, particularly at elevated temperatures compared to similar components fabricated from the commonly employed GaAs MESFETs.


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