Silicon carbide in a silicon world: introducing wide band gap semiconductor production into a silicon fab

Author(s):  
J. Shovlin ◽  
R. Woodin ◽  
T. Witt
2011 ◽  
Vol 679-680 ◽  
pp. 726-729 ◽  
Author(s):  
David T. Clark ◽  
Ewan P. Ramsay ◽  
A.E. Murphy ◽  
Dave A. Smith ◽  
Robin. F. Thompson ◽  
...  

The wide band-gap of Silicon Carbide (SiC) makes it a material suitable for high temperature integrated circuits [1], potentially operating up to and beyond 450°C. This paper describes the development of a 15V SiC CMOS technology developed to operate at high temperatures, n and p-channel transistor and preliminary circuit performance over temperature achieved in this technology.


2016 ◽  
Vol 144 ◽  
pp. 551-558 ◽  
Author(s):  
J. López-Vidrier ◽  
P. Löper ◽  
M. Schnabel ◽  
S. Hernández ◽  
M. Canino ◽  
...  

Author(s):  
Gregg Davis ◽  
Leo Casey ◽  
Mark Prestero ◽  
Kirby Keller ◽  
Jim Sheahan ◽  
...  

2010 ◽  
Vol 645-648 ◽  
pp. 753-758 ◽  
Author(s):  
Marcin Zielinski ◽  
Catherine Moisson ◽  
Sylvain Monnoye ◽  
Hugues Mank ◽  
Thierry Chassagne ◽  
...  

In this contribution we recapitulate the state of the art of silicon carbide and related materials polishing. Since the demonstration (by Vicente et al) of an ultimate preparation of Si-face -SiC wafers some important progresses were made in the field of surface preparation of silicon carbide and related materials. This concerns the industrial, high output treatments of substrates of increasing size, as well as the research studies of the feasibility of new preparation approaches for wide band gap materials. We also discuss the problems related to the polishing of the polycrystalline material and to the planarization of epilayers.


2006 ◽  
Vol 16 (03) ◽  
pp. 825-854 ◽  
Author(s):  
DIETRICH STEPHANI ◽  
PETER FRIEDRICHS

The chapter will give an overview about the theory of JFETs with special attention to the wide band gap issues related to SiC. After a comprehensive discussion of relevant structures and topologies experimental results are presented and discussed. Especially vertical structures are in the focus of this chapter. Characteristic I-V data will be shown as well as application specific solutions regarding the temperature behavior or the ruggedness of the devices. The status of the JFETs technology will be judged and compared to alternative solutions like MOSFEts or lateral JFETs. Finally, an outlook will be given regarding targeted applications for SiC VJFETs and the resulting requirements as targets for future improvements.


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