Graphene-Silicon Heterojunction Infrared Photodiode at 1.3/1.55 μm

2016 ◽  
Vol 858 ◽  
pp. 1153-1157
Author(s):  
Tzu Min Ou ◽  
Tomoko Borsa ◽  
Bart van Zeghbroeck

A novel infrared photodiode based on a graphene/n-type silicon heterojunction is explored. The heterojunction photodiode of interest has a large Schottky barrier that results in a low dark current. Graphene serves as the absorbing medium at a wavelength for which silicon is transparent. Under infrared illumination, photo-excited electrons in the graphene gain energy and thus have a greater probability to overcome the barrier and contribute to the photocurrent. We have demonstrated photodiode operation of a graphene/n-Si heterojunction at 1.3 and 1.55 μm wavelength, with 14% internal quantum efficiency and 1.5 pW/Hz1/2 noise-equivalent power, for potential use in silicon photonics.

2012 ◽  
Vol 2012 ◽  
pp. 1-5
Author(s):  
Sheng-Po Chang

We report the fabrication of GaN Schottky photodiodes (PDs) on Si(111) substrates coated with an AlN/AlGaN buffer multilayer. It was found that their dark current was much smaller than that of identical devices prepared on sapphire substrates. With an incident wavelength of 359 nm, the maximum responsivity of the n−-GaN Schottky photodetectors with TiW contact electrodes was 0.1544 A/W, corresponding to a quantum efficiency of 53.4%. For a given bandwidth of 1 kHz and bias of 5 V, the resultant noise equivalent power (NEP) of n−-GaN Schottky photodetectors with TiW electrodes was1.033×10-12 W, corresponding to a detectivity (D*) of1.079×1012 cm-Hz0.5 W−1.


Photonics ◽  
2021 ◽  
Vol 8 (6) ◽  
pp. 196
Author(s):  
Tsung-Chi Hsu ◽  
Yu-Tsai Teng ◽  
Yen-Wei Yeh ◽  
Xiaotong Fan ◽  
Kuo-Hsiung Chu ◽  
...  

High-quality epitaxial layers are directly related to internal quantum efficiency. The methods used to design such epitaxial layers are reviewed in this article. The ultraviolet C (UVC) light-emitting diode (LED) epitaxial layer structure exhibits electron leakage; therefore, many research groups have proposed the design of blocking layers and carrier transportation to generate high electron–hole recombination rates. This also aids in increasing the internal quantum efficiency. The cap layer, p-GaN, exhibits high absorption in deep UV radiation; thus, a small thickness is usually chosen. Flip chip design is more popular for such devices in the UV band, and the main factors for consideration are light extraction and heat transportation. However, the choice of encapsulation materials is important, because unsuitable encapsulation materials will be degraded by ultraviolet light irradiation. A suitable package design can account for light extraction and heat transportation. Finally, an atomic layer deposition Al2O3 film has been proposed as a mesa passivation layer. It can provide a low reverse current leakage. Moreover, it can help increase the quantum efficiency, enhance the moisture resistance, and improve reliability. UVC LED applications can be used in sterilization, water purification, air purification, and medical and military fields.


2021 ◽  
Vol 237 ◽  
pp. 118165
Author(s):  
Linyan Fu ◽  
Yunlong Yang ◽  
Yi Zhang ◽  
Xuefei Ren ◽  
Yingjie Zhu ◽  
...  

2021 ◽  
Vol 33 (14) ◽  
pp. 2006302
Author(s):  
Yarong He ◽  
Jiaxu Yan ◽  
Lei Xu ◽  
Bangmin Zhang ◽  
Qian Cheng ◽  
...  

2014 ◽  
Vol 50 (11) ◽  
pp. 911-920 ◽  
Author(s):  
Ilya E. Titkov ◽  
Sergey Yu. Karpov ◽  
Amit Yadav ◽  
Vera L. Zerova ◽  
Modestas Zulonas ◽  
...  

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