A Process Dependent Warpage and Stress Model for 3D Packages Considering Incoming Die/Substrate Warpage and Assembly Process Impacts

2013 ◽  
Vol 2013 (DPC) ◽  
pp. 001603-001621
Author(s):  
Wei Lin ◽  
Ahmer Syed ◽  
KiWook Lee ◽  
Karthikeyan Dhandapani
Keyword(s):  
Residual Stress ◽  
Process Condition ◽  
Element Model ◽  
Stress Effect ◽  
Assembly Process ◽  
Process Flow ◽  
Process Step ◽  
Die Stress ◽  
3D Packaging ◽  
Bare Substrate

Warpage control and die stress are critical for 3D package assembly. Currently most of the warpage studies, either measurements or simulations, are mainly evaluated at the end-of-line (EOL) for the finished package. However, for 3D packaging such as multiple die stacking or through-silicon-via (TSV), the interaction between warpage and assembly process steps becomes far more important because: (1) Warpage at each single process step will impact the yield of the next process step. (2) Process induced warpage will accumulated and affect the final end-of-line package warpage, and (3) Die stress in the end-of-line package is highly dependent on the incoming die alone residual stress and the assembly process flow. It is required to develop capability to evaluate warpage at each process step following the process flow. In this paper, we use a 2-die TSV package as a test vehicle to collect warpage data at each assembly step. A process dependent finite element model (FEM) method is developed which is capable of capturing the process induced warpage and stress at each process step based on the process condition. Shadow moire is used to measure warpage data at following check points: (1) Incoming bare dies and bare substrate warpage; (2) Die 1 warpage after underfilled on substrate; (3) Die 2 warpage after TCNCP on Die 1; (4) Completed package after molding (end-of-line). Element birth and kill approach is developed in the FEM model to simulate the assembly process flow. In each process step, only the presented components and materials in the model are active while the others are killed. When new parts or materials are added through the assembly flow, they are activated in the model and the related process condition is applied for each step. Using this process dependent modeling approach, excellent correlation of the model results with the actual measured warpage data is achieved at each process step. One factor often been ignored is the incoming bare die warpage and bare substrate warpage effect. They are often assumed flat and stress free. However, as die and substrate become thinner and thinner, their incoming initial warpage or residual stress plays an important role. In this paper, the measured incoming substrate and die warpage data are presented, their impacts to the warpage and stress evolution through the process flow are evaluated. A novel method is also developed in the simulation model which is able to study the incoming die/substrate warpage and residual stress effect.

Process-Induced Stress Effect on Reliability of ChipSeal® Passivation Technology

2002 ◽  
Author(s):  
Yeong K. Kim ◽  
Rudolf Krondorfer ◽  
Suresh K. Sitaraman
Keyword(s):  
Residual Stress ◽  
Metal Layer ◽  
Design Guidelines ◽  
Thickness Effect ◽  
Reliability Prediction ◽  
Stress Effect ◽  
Process Technology ◽  
Process Step ◽  
Stress Development ◽  
Induced Stress

It is important to take into consideration the process-induced residual stress into reliability prediction modeling. Lack of process-induced stress may lead to error in reliability prediction. Therefore, careful investigation of the stress development is critical. In this paper, the stress development induced by ChipSeal® passivation process technology has been analyzed. The ChipSeal® passivation technology has been developed to enhance the reliability of commercially-off-the-shelf plastic encaptulated microelectronics component by sealing integrated circuit at the wafer level. The analysis takes every process step into account to investigate the temperature effect on the final residual stress. The section of the fabricated structure has been modeled in two different configurations. The stress developments have been simulated by numerical method, and the results have been analyzed to identify the critical location. Three different lengths of metal layer have been considered to investigate the effect of metal layer length structure. Finally, a response surface method is employed to determine the thickness effect of individual layers and to develop design guidelines to enhance ChipSeal® reliability.

Simulation and Experiment on the Residual Stress in Super-High Speed Grinding

2010 ◽  
Vol 135 ◽  
pp. 238-242
Author(s):  
Yue Ming Liu ◽  
Ya Dong Gong ◽  
Wei Ding ◽  
Ting Chao Han
Keyword(s):  
Residual Stress ◽  
High Speed ◽  
Element Model ◽  
Residual Stress Distribution ◽  
X Ray Diffraction ◽  
Machined Surface ◽  
X Ray ◽  
High Speed Grinding ◽  
Simulation And Experiment ◽  
Cylindrical Workpiece

In this paper, effective finite element model have been developed to simulation the plastic deformation cutting in the process for a single particle via the software of ABAQUS, observing the residual stress distribution in the machined surface, the experiment of grinding cylindrical workpiece has been brought in the test of super-high speed grinding, researching the residual stress under the machined surface by the method of X-ray diffraction, which can explore the different stresses from different super-high speed in actual, and help to analyze the means of reducing the residual stresses in theory.

Estimation of Residual Stress in Spiral Welded Pipe: Regression and Numerical Model

2012 ◽  
Author(s):  
Abul Fazal M. Arif ◽  
Ahmad S. Al-Omari ◽  
Anwar K. Sheikh ◽  
Yagoub Al-Nassar ◽  
M. Anis
Keyword(s):  
Residual Stress ◽  
Residual Stresses ◽  
Critical Role ◽  
Large Diameter ◽  
Element Model ◽  
Regression Equation ◽  
Field Analysis ◽  
Welding Parameters ◽  
Splitting Test ◽  
Welded Pipe

Double submerged spiral-welded pipe (SWP) is used extensively throughout the world for large-diameter pipelines. Fabrication-induced residual stresses in spiral welded pipe have received increasing attention in gas, oil and petrochemical industry. Several studies reported in the literature verify the critical role of residual stresses in the failure of these pipes. Therefore, it is important that such stresses are accounted for in safety assessment procedures such as the British R6 and BS7910. This can be done only when detailed information on the residual stress distribution in the component is known. In industry, residual stresses in spiral welded pipe are measured experimentally by means of destructive techniques known as Ring Splitting Test. In this study, statistical analysis and linear-regression modeling were used to study the effect of several structural, material and welding parameters on ring splitting test opening for spiral welded pipes. The experimental results were employed to develop an appropriate regression equation, and to predict the residual stress on the spiral welded pipes. It was found that the developed regression equation explains 36.48% of the variability in the ring opening. In the second part, a 3-D finite element model is presented to perform coupled-field analysis of the welding of spiral pipe. Using this model, temperature as well as stress fields in the region of the weld edges is predicted.

Numerical Simulation of the Effects of Preheating on Electron Beam Additive Manufactured Ti-6Al-4V Build Plate

2016 ◽  
Vol 879 ◽  
pp. 274-278 ◽  
Author(s):  
Jun Cao ◽  
Philip Nash
Keyword(s):  
Numerical Simulation ◽  
Residual Stress ◽  
Finite Element ◽  
Electron Beam ◽  
Cross Section ◽  
Element Model ◽  
Normal Direction ◽  
Thermal Residual Stresses ◽  
Longitudinal Residual Stress ◽  
Middle Cross Section

In an earlier study, a 3-D thermomechanical coupled finite element model was built and experimentally validated to investigate the evolution of the thermal residual stresses and distortions in electron beam additive manufactured Ti-6Al-4V build plates. In this study, an investigation using this robust and accurate model was focused on an efficient preheating method, in which the electron beam quickly scanned across the substrate to preheat the build plate prior to the deposition. Various preheat times, beam powers, scan rates, scanning paths and cooling times (between the end of current preheat scan/deposition layer and the beginning of the next preheat scan/deposition layer) were examined, and the maximum distortion along the centerline of the substrate and the maximum longitudinal residual stress along the normal direction on the middle cross-section of the build plate were quantitatively compared. The results show that increasing preheat times and beam powers could effectively reduce both distortion and residual stress for multiple layers/passes components.

Micromechanical Modeling of Viscoplastic Behavior of Laminated Polymer Composites With Thermal Residual Stress Effect

2016 ◽  
Vol 138 (3) ◽  
Author(s):  
Qiang Chen ◽  
Xuefeng Chen ◽  
Zhi Zhai ◽  
Xiaojun Zhu ◽  
Zhibo Yang
Keyword(s):  
Residual Stress ◽  
Polymer Matrix Composites ◽  
Micromechanical Model ◽  
Thermal Residual Stress ◽  
Micromechanical Modeling ◽  
Multiscale Approach ◽  
Stress Effect ◽  
Accurate Analysis ◽  
Rate Dependent ◽  
Residual Stress Effect

In this paper, a multiscale approach has been developed for investigating the rate-dependent viscoplastic behavior of polymer matrix composites (PMCs) with thermal residual stress effect. The finite-volume direct averaging micromechanics (FVDAM), which effectively predicts nonlinear response of unidirectional fiber reinforced composites, is incorporated with improved Bodner–Partom model to describe the viscoplastic behavior of PMCs. The new micromechanical model is then implemented into the classical laminate theory, enabling efficient and accurate analysis of multidirectional PMCs. The proposed multiscale theory not only predicts effective thermomechanical viscoplastic response of PMCs but also provides local fluctuations of fields within composite microstructures. The deformation behaviors of several unidirectional and multidirectional PMCs with various fiber configurations are extensively simulated at different strain rates, which show a good agreement with the experimental data found from the literature. Influence of thermal residual stress on the viscoplastic behavior of PMCs is closely related to fiber orientation. In addition, the thermal residual stress effect cannot be neglected in order to accurately describe the rate-dependent viscoplastic behavior of PMCs.

Stress and Fatigue Life Modeling of Cannon Breech Closures Including Effects of Material Strength and Residual Stress

2000 ◽  
Vol 123 (1) ◽  
pp. 150-154
Author(s):  
John H. Underwood ◽  
Michael J. Glennon
Keyword(s):  
Residual Stress ◽  
Finite Element ◽  
Fatigue Life ◽  
Yield Strength ◽  
Residual Stresses ◽  
Solid Mechanics ◽  
Element Model ◽  
Pressure Vessels ◽  
Material Strength ◽  
Element Analysis

Laboratory fatigue life results are summarized from several test series of high-strength steel cannon breech closure assemblies pressurized by rapid application of hydraulic oil. The tests were performed to determine safe fatigue lives of high-pressure components at the breech end of the cannon and breech assembly. Careful reanalysis of the fatigue life tests provides data for stress and fatigue life models for breech components, over the following ranges of key parameters: 380–745 MPa cyclic internal pressure; 100–160 mm bore diameter cannon pressure vessels; 1040–1170 MPa yield strength A723 steel; no residual stress, shot peen residual stress, overload residual stress. Modeling of applied and residual stresses at the location of the fatigue failure site is performed by elastic-plastic finite element analysis using ABAQUS and by solid mechanics analysis. Shot peen and overload residual stresses are modeled by superposing typical or calculated residual stress distributions on the applied stresses. Overload residual stresses are obtained directly from the finite element model of the breech, with the breech overload applied to the model in the same way as with actual components. Modeling of the fatigue life of the components is based on the fatigue intensity factor concept of Underwood and Parker, a fracture mechanics description of life that accounts for residual stresses, material yield strength and initial defect size. The fatigue life model describes six test conditions in a stress versus life plot with an R2 correlation of 0.94, and shows significantly lower correlation when known variations in yield strength, stress concentration factor, or residual stress are not included in the model input, thus demonstrating the model sensitivity to these variables.

scholarly journals X-ray nanodiffraction analysis of stress oscillations in a W thin film on through-silicon via

2016 ◽  
Vol 49 (1) ◽  
pp. 182-187 ◽  
Author(s):  
J. Todt ◽  
H. Hammer ◽  
B. Sartory ◽  
M. Burghammer ◽  
J. Kraft ◽  
...  
Keyword(s):  
Thin Film ◽  
Residual Stress ◽  
Finite Element ◽  
Diffraction Data ◽  
Element Model ◽  
Stress Distributions ◽  
Through Silicon Via ◽  
X Ray ◽  
Tangential Stresses ◽  
Stress Components

Synchrotron X-ray nanodiffraction is used to analyse residual stress distributions in a 200 nm-thick W film deposited on the scalloped inner wall of a through-silicon via. The diffraction data are evaluated using a novel dedicated methodology which allows the quantification of axial and tangential stress components under the condition that radial stresses are negligible. The results reveal oscillatory axial stresses in the range of ∼445–885 MPa, with a distribution that correlates well with the scallop wavelength and morphology, as well as nearly constant tangential stresses of ∼800 MPa. The discrepancy with larger stress values obtained from a finite-element model, as well as from a blanket W film, is attributed to the morphology and microstructural nature of the W film in the via.

scholarly journals Superlayer Residual Stress Effect on the Indentation Adhesion Measurements

1999 ◽  
Vol 594 ◽  
Author(s):  
Alex A. Volinsky ◽  
Neville R. Moody ◽  
William W. Gerberich
Keyword(s):  
Residual Stress ◽  
Sputter Deposition ◽  
Work Of Adhesion ◽  
Stress Effect ◽  
Aluminum Films ◽  
Nanoindentation Testing ◽  
Deposition Parameters ◽  
Thin Aluminum ◽  
Residual Stress Effect ◽  
Sputter Deposited

AbstractThe practical work of adhesion has been measured in thin aluminum films as a function of film thickness and residual stress. These films were sputter deposited onto thermally oxidized silicon wafers followed by sputter deposition of a one micron thick W superlayer. The superlayer deposition parameters were controlled to produce either a compressive residual stress of 1 GPa or a tensile residual stress of 100 MPa. Nanoindentation testing was then used to induce delamination and a mechanics based model for circular blister formation was used to determine practical works of adhesion. The resulting measured works of adhesion for all films between 100 nm and 1 μm thick was 30 J/m2 regardless of superlayer stress. However, films with the compressively stressed superlayers produced larger blisters than films with tensile stressed superlayers. In addition, these films were susceptible to radial cracking producing a high variability in average adhesion values.

Sign in / Sign up

Export Citation Format

Share Document