Experimental Reliability Studies and SPICE Simulation for EEPROM at Temperatures up to 450°C
2016 ◽
Vol 13
(1)
◽
pp. 33-37
Keyword(s):
This article presents reliability studies of single polysilicon electrically erasable programmable read-only memory (EEPROM) cells at temperatures from 50°C to 450°C. The technically challenging measurements at elevated temperatures >250°C have been carried out for accelerated reliability studies. Furthermore, a SPICE macro model has been extended to the wide temperature range to describe the retention and endurance performance of the memory cell and to enable a better insight into the physics involved.
2015 ◽
Vol 2015
(HiTEN)
◽
pp. 000005-000009
Keyword(s):
2013 ◽
Vol 740-742
◽
pp. 498-501
Keyword(s):
Keyword(s):
1987 ◽
Vol 134
(5)
◽
pp. 291
◽
2018 ◽
Vol 10
(6)
◽
pp. 06046-1-06046-4
◽
Keyword(s):