CMOS Circuits on Silicon Carbide for High Temperature Operation

2014 ◽  
Vol 1693 ◽  
Author(s):  
David T. Clark ◽  
Robin F. Thompson ◽  
Aled E. Murphy ◽  
David A. Smith ◽  
Ewan P. Ramsay ◽  
...  
Keyword(s):  
Silicon Carbide ◽  
High Temperature ◽  
Wide Temperature Range ◽  
Integrated Circuit ◽  
Elevated Temperatures ◽  
Logic Circuits ◽  
Digital Logic ◽  
Cmos Integrated Circuit ◽  
Temperature Range ◽  
Simple Logic

ABSTRACTWe present the characteristics of a high temperature CMOS integrated circuit process based on 4H silicon carbide designed to operate at temperatures beyond 300°C. N-channel and P-channel transistor characteristics at room and elevated temperatures are presented. Both channel types show the expected low values of field effect mobility well known in SiC MOSFETS. However the performance achieved is easily capable of exploitation in CMOS digital logic circuits and certain analogue circuits, over a wide temperature range.Data is also presented for the performance of digital logic demonstrator circuits, in particular a 4 to 1 analogue multiplexer and a configurable timer operating over a wide temperature range. Devices are packaged in high temperature ceramic dual in line (DIL) packages, which are capable of greater than 300°C operation. A high temperature “micro-oven” system has been designed and built to enable testing and stressing of units assembled in these package types. This system heats a group of devices together to temperatures of up to 300°C while keeping the electrical connections at much lower temperatures. In addition, long term reliability data for some structures such as contact chains to n-type and p-type SiC and simple logic circuits is summarized.

scholarly journals High temperature, Smart Power Module for aircraft actuators

2013 ◽  
Vol 2013 (HITEN) ◽  
pp. 000069-000074
Author(s):  
Khalil El Falahi ◽  
Stanislas Hascoët ◽  
Cyril Buttay ◽  
Pascal Bevilacqua ◽  
Luong-Viet Phung ◽  
...  
Keyword(s):  
Silicon Carbide ◽  
High Temperature ◽  
Wide Temperature Range ◽  
Power Module ◽  
Smart Power ◽  
Temperature Range ◽  
Electric Aircraft ◽  
Gate Driver ◽  
Proper Operation ◽  
More Electric Aircraft

More electric aircraft require converters that can operate over a wide temperature range (−55 to more than 200°C). Silicon carbide JFETs can satisfy these requirements, but there is a need for suitable peripheral components (gate drivers, passives. . . ). In this paper, we present a “smart power module” based on SiC JFETs and dedicated integrated gate driver circuits. The design is detailed, and some electrical results are given, showing proper operation of the module up to 200°C.

Digital and Analogue Integrated Circuits in Silicon Carbide for High Temperature Operation

2012 ◽  
Vol 2012 (HITEC) ◽  
pp. 000373-000377 ◽  
Author(s):  
E.P Ramsay ◽  
D.T. Clark ◽  
J.D. Cormack ◽  
A.E. Murphy ◽  
D.A Smith ◽  
...  
Keyword(s):  
Silicon Carbide ◽  
High Temperature ◽  
Integrated Circuits ◽  
Integrated Circuit ◽  
Nand Gate ◽  
Cmos Process ◽  
Flip Flop ◽  
Aero Engines ◽  
Simple Logic ◽  
High Temperature Operation

A need for high temperature integrated circuits is emerging in a number of application areas. As Silicon Carbide power discrete devices become more widely available, there is a growing need for control ICs capable of operating at the same temperatures and mounted on the same modules. Also, the use of high temperature sensors, in, for example, aero engines and in deep hydrocarbon and geothermal drilling applications results in a demand for high temperature sensor interface ICs. This paper presents new results on a range of simple logic and analogue circuits fabricated on a developing Silicon Carbide CMOS process which is intended for mixed signal integrated circuit applications such as those above. A small family of logic circuits, pin compatible with the 74xx series TTL logic parts, has been designed, fabricated and tested and includes, for example, a Quad Nand gate and a Dual D-type flip-flop. These have been found to be functional from room temperature up to 400°C. Analogue blocks have been investigated with a view to using switched capacitor or autozero techniques to compensate for temperature and time induced drifts, allowing very high temperature operation.

Gate Stack Engineering for High Temperature Silicon Carbide CMOS ICs

2015 ◽  
Vol 2015 (HiTEN) ◽  
pp. 000033-000036 ◽  
Author(s):  
M.H. Weng ◽  
A.D. Murphy ◽  
D.T. Clark ◽  
D.A. Smith ◽  
R.F. Thompson ◽  
...  
Keyword(s):  
Silicon Carbide ◽  
High Temperature ◽  
Elevated Temperatures ◽  
Systematic Evaluation ◽  
Process Conditions ◽  
Operating Characteristics ◽  
Gate Stack ◽  
Metal Insulator ◽  
Semiconductor Interfaces

The potential to thermally grow SiO2 on silicon carbide has resulted in it becoming the technology of choice to realise high temperature CMOS circuits. The challenge to achieve a high quality gate stack relies on engineering the metal-insulator-semiconductor interfaces to enable reliable high temperature functionality. Here we describe the effect of different process conditions for the formation of the dielectric layer on the characteristics of the resulting devices. The operating characteristics at elevated temperatures depend critically on the quality of the gate stack. Therefore a systematic evaluation of the intrinsic properties of the gate stack and data from reliability tests are needed.

Electron Transport Features in Heterostructures 3C-SiC(n)/Si(p) at the Elevated Temperatures

2013 ◽  
Vol 740-742 ◽  
pp. 498-501
Author(s):  
A.V. Afanasyev ◽  
V.A. Ilyin ◽  
V.V. Luchinin ◽  
A.S. Petrov
Keyword(s):  
Electron Transport ◽  
Charge Transport ◽  
Wide Temperature Range ◽  
Silicon Substrate ◽  
Elevated Temperatures ◽  
Reverse Current ◽  
Current Generation ◽  
Temperature Range ◽  
Working Temperature ◽  
Transport Diffusion

3C-SiC (n) / Si (p) heterostructures were obtained and investigated in a wide temperature range. It was shown, the main mechanisms of charge transport diffusion and recombination. The properties of silicon substrate were determining the working temperature range of investigated diodes. Therefore the rectifying properties of 3С-SiC(n)/Si(p) diodes were stable only up to 473 K. Two sites with different activation energies were observed on the Jrev(1/T) curves at fixed voltage: 0,32 eV which, characterized states on the SiC/Si interface, Е2 ≈ 0,55 eV which corresponds to the middle of silicon bandgap and defines existence of reverse current generation component.

scholarly journals Silicon Carbide Integrated Circuits With Stable Operation Over a Wide Temperature Range

2014 ◽  
Vol 35 (12) ◽  
pp. 1206-1208 ◽  
Author(s):  
Reza Ghandi ◽  
Cheng-Po Chen ◽  
Liang Yin ◽  
Xingguang Zhu ◽  
Liangchun Yu ◽  
...  
Keyword(s):  
Silicon Carbide ◽  
Integrated Circuits ◽  
Wide Temperature Range ◽  
Stable Operation ◽  
Temperature Range

Rheology and Microstructure of Polymer/Asphalt Blends

1991 ◽  
Vol 64 (4) ◽  
pp. 577-600 ◽  
Author(s):  
M. G. Bouldin ◽  
J. H. Collins ◽  
A. Berker
Keyword(s):  
High Temperature ◽  
Low Temperatures ◽  
Elevated Temperatures ◽  
Polymer Concentration ◽  
Deformation Energy ◽  
Plateau Modulus ◽  
Temperature Range ◽  
Low Viscosity ◽  
Mechanical Measurements ◽  
Polymer Type

Abstract This work demonstrates the effectiveness of polymers in improving, especially, the high temperature properties of asphalt. The appropriate choice of asphalt, asphalt-grade, polymer type, polymer concentration, and the method of mixing determine if a network-like structure is formed. This morphology significantly improves the creep performance of the binder at elevated temperatures, i.e., the binder has the ability to store deformation energy with subsequent recoil. This is contrary to Newtonian fluids which transform the energy into viscous flow (no recoil). Within the context of dynamic mechanical measurements, the presence of a polymeric network is manifested through the appearance of a plateau modulus. In the case of binders containing block copolymers, we have repeatedly observed that such property improvement in the high-temperature range is generally accompanied by a reduction of the glassy modulus at the low-temperature range as well. It should be noted that by modifying low-viscosity asphalts (i.e., low AC-grades) with polymers, binders can be obtained which exhibit significantly lower moduli at low temperatures and higher moduli at elevated temperatures. This suggests that although using a high AC-grade asphalt may yield satisfactory results at a particular temperature (high temperature), one may instead optimize binders over the entire temperature range (high and low) by starting with a low AC-grade and adding polymer. These results indicate that careful Theological measurements can be a powerful tool in the characterization and design of viscoelastic blends.

scholarly journals High Temperature Silicon Integrated Circuits and Passive Components for Commercial and Military Applications

1998 ◽  
Author(s):  
Richard R. Grzybowski ◽  
Ben Gingrich
Keyword(s):  
High Temperature ◽  
Integrated Circuits ◽  
Integrated Circuit ◽  
Elevated Temperatures ◽  
Silicon On Insulator ◽  
Passive Component ◽  
Oil Well ◽  
Automotive Electronics ◽  
Passive Components ◽  
Silicon Integrated Circuits

Advances in silicon-on-insulator (SOI) integrated circuit technology and the steady development of wider band gap semiconductors like silicon carbide are enabling the practical deployment of high temperature electronics. High temperature civilian and military electronics applications include distributed controls for aircraft, automotive electronics, electric vehicles and instrumentation for geothermal wells, oil well logging and nuclear reactors. While integrated circuits are key to the realization of complete high temperature electronic systems, passive components including resistors, capacitors, magnetics and crystals are also required. This paper will present characterization data obtained from a number of silicon high temperature integrated evaluated over a range of elevated temperatures and aged at a selected high temperature. This paper will also present a representative cross section of high temperature passive component characterization data for device types needed by many applications. Device types represented will include both small signal and power resistors and capacitors. Specific problems encountered with the employment of these devices in harsh environments will be discussed for each family of components. The goal in presenting this information is to demonstrate the viability of a significant number of commercially available silicon integrated circuits and passive components that operate at elevated temperatures as well as to encourage component suppliers to continue to optimize a selection of their product offerings for operation at higher temperatures. In addition, systems designers will be encouraged to view this information with an eye toward the conception and implementation of reliable and affordable high temperature systems.

A Robust SOI Gain-Boosted Operational Amplifier Targeting High Temperature Precision Applications up to 300°C

2011 ◽  
Vol 2011 (HITEN) ◽  
pp. 000238-000242
Author(s):  
Alexander Schmidt ◽  
Abdel Moneim Marzouk ◽  
Holger Kappert ◽  
Rainer Kokozinski
Keyword(s):  
High Temperature ◽  
Circuit Design ◽  
Robust Design ◽  
Wide Temperature Range ◽  
Operational Amplifier ◽  
Operating Temperature ◽  
High Gain ◽  
Temperature Range ◽  
Op Amp ◽  
Operating Temperature Range

Data acquisition and signal processing at elevated temperatures are facing various problems due to a wide temperature range operation, affecting the accuracy of the circuits' references and elementary building blocks. As the most commonly used analog building block, the operational amplifier (op-amp) with its various limitations has to be enhanced for wide temperature range operation. Thereby major effort is put into maximizing signal gain and simultaneously reaching high gain-bandwidth also for high temperatures. Future robust design approaches have to consider a growing operating temperature range and increasing device parameter mismatch due to the downsizing of integrated circuits. Addressing one of the major problems in circuit design for the next decades, compensating these effects through new design approaches will have a lasting impact on circuit design. In this paper we present a high gain operational amplifier with a folded-cascode and gain-boosted input stage, fabricated in a 1.0 μm SOI CMOS process. The operational amplifier was designed for an operating temperature range of −40…300°C. Major effort was put into a robust design approach with reduced sensitivity to temperature variations, targeting high precision applications in a high temperature environment. With a supply voltage of 5 V, the maximum simulated current consumption of the op-amp is 210 μA which leads to overall maximum power consumption of 1.05 mW. The open loop DC gain of the amplifier is expected to reach a minimum of 108 dB and a unity-gain-frequency of 1.02 MHz at a temperature of 300°C. For all temperatures the phase margin varies from 55…70 degrees for a 3 pF load.

Package design and development of a low cost high temperature (250°C), high current (50+A), low inductance discrete power package for advanced Silicon Carbide (SiC) and Gallium Nitride (GaN) devices

2013 ◽  
Vol 2013 (1) ◽  
pp. 000592-000597
Author(s):  
B. McPherson ◽  
B. Passmore ◽  
P. Killeen ◽  
D. Martin ◽  
A. Barkley ◽  
...  
Keyword(s):  
Silicon Carbide ◽  
Gallium Nitride ◽  
High Temperature ◽  
Power Density ◽  
High Performance ◽  
Elevated Temperatures ◽  
Power Converter ◽  
System Level ◽  
High Current ◽  
Package Design

The demands for high-performance power electronics systems are rapidly surpassing the power density, efficiency, and reliability limitations defined by the intrinsic properties of silicon-based semiconductors. The advantages of post silicon materials, including Silicon Carbide (SiC) and Gallium Nitride (GaN), are numerous, including: high temperature operation, high voltage blocking capability, extremely fast switching, and superior energy efficiency. These advantages, however, are severely limited by conventional power packages, particularly at temperatures higher than 175°C and >100 kHz switching speeds. In this discussion, APEI, Inc. presents the design of a newly developed discrete package specifically intended for high performance, high current (>50A), rapid switching, and extended temperature (>250°C) wide band gap devices which are now readily available on the commercial market at voltages exceeding 1200V. Finite element analysis (FEA) results will be presented to illustrate the modeling process, design tradeoffs, and critical decisions fundamental to a high performance package design. A low profile design focuses on reducing parasitic impedances which hinder high speed switching. A notable increase in the switching speed and frequency reduces the size and volume of associated filtering components in a power converter. Operating at elevated temperatures reduces the requirements of the heat removal system, ultimately allowing for a substantial increase in the power density. Highlights of these packages include the flexibility to house a variety of device sizes and types, co-packaged antiparallel diodes, a terminal layout designed to allow rapid system configuration (for paralleling or creating half- and full-bridge topologies), and a novel wire bondless backside cooled construction for lateral GaN HEMT devices. Specific focus was placed on minimizing the cost of the materials and fabrication processes of the package components. The design of the package is discussed in detail. High temperature testing of a SiC assembly and electrical test results of a high frequency GaN based boost converter will be presented to demonstrate system level performance advantages.

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