Enabling Robust Copper Fill of High Aspect Ratio Through Silicon Vias

2010 ◽  
Vol 2010 (1) ◽  
pp. 000176-000179
Author(s):  
Mark Willey ◽  
Damo Srinivas ◽  
Sesha Varadarajan ◽  
David Porter ◽  
Easwar Srinivasan ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
High Speed ◽  
High Performance ◽  
Process Window ◽  
Seed Technology ◽  
Aspect Ratios ◽  
Reducing Costs ◽  
Electroplating Process ◽  
Silicon Vias

Today's Through Silicon Via (TSV) processes are limited to aspect ratios of 10:1. High performance logic devices drive the need for aspect ratios approaching 20:1 in order to achieve the desired performance while simultaneously reducing costs. The reduced via area required on the wafer enables the designer to utilize less real estate on the die to reduce cost or to potentially add redundant vias to improve yield. However, current conventional processes and techniques are not capable of achieving robust fill on aspect ratios greater than 12:1. This presentation will highlight the technical challenges in achieving robust copper fill on super high aspect ratio TSV structures. Additionally, a compelling, economic solution pathway will be presented that integrates a low temperature conformal high quality dielectric isolation layer, a high step coverage Cu barrier / seed technology and a void free high speed electroplating process with a wide process window that could accelerate the adoption of the high aspect ratio TSV design schemes.

scholarly journals Strength Analysis of Alternative Airframe Layouts of Regional Aircraft on the Basis of Automated Parametrical Models

Aerospace ◽  
2021 ◽  
Vol 8 (3) ◽  
pp. 80
Author(s):  
Dmitry V. Vedernikov ◽  
Alexander N. Shanygin ◽  
Yury S. Mirgorodsky ◽  
Mikhail D. Levchenkov
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
High Performance ◽  
Strength Analysis ◽  
Labor Input ◽  
Aerodynamic Loading ◽  
Aspect Ratios ◽  
Wide Range ◽  
Parametrical Design

This publication presents the results of complex parametrical strength investigations of typical wings for regional aircrafts obtained by means of the new version of the four-level algorithm (FLA) with the modified module responsible for the analysis of aerodynamic loading. This version of FLA, as well as a base one, is focused on significant decreasing time and labor input of a complex strength analysis of airframes by using simultaneously different principles of decomposition. The base version includes four-level decomposition of airframe and decomposition of strength tasks. The new one realizes additional decomposition of alternative variants of load cases during the process of determination of critical load cases. Such an algorithm is very suitable for strength analysis and designing airframes of regional aircrafts having a wide range of aerodynamic concepts. Results of validation of the new version of FLA for a high-aspect-ratio wing obtained in this work confirmed high performance of the algorithm in decreasing time and labor input of strength analysis of airframes at the preliminary stages of designing. During parametrical design investigation, some interesting results for strut-braced wings having high aspect ratios were obtained.

High-Aspect-Ratio Electroplated Structures With 2μm Beamwidth

1999 ◽  
Author(s):  
Xiaobin Li ◽  
Siddharth Kiyawat ◽  
Hector J. De Los Santos ◽  
Chang-Jin “CJ” Kim
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Stress Gradient ◽  
Optimization Method ◽  
Nickel Layer ◽  
Driving Voltage ◽  
Aspect Ratios ◽  
Nickel Electroplating ◽  
Electroplating Process ◽  
Micro Structures

Abstract Narrow beamwidth is highly desirable for many micromechanical elements moving parallel to the substrate. A good example is the electrostatically driven flexure structure, whose driving voltage is determined by the width of the beam. This paper presents the process flow and the result of a high-aspect-ratio electroplating process using photoresist (PR) molds. Following a systematic optimization method, PR molds with aspect ratios up to 4.0 were fabricated with a beamwidth of only 2.1μm. Higher aspect ratios, up to 6.8, were achieved using PR double coating technique, with a beamwidth of 2.6μm. Using a Cr/Cu seed layer, nickel electroplating was successfully carried out to translate the PR molds into nickel micro-structures. We observed bend-down of the fully released nickel cantilevers that are over 8μm thick. Further investigation suggested a combined effect of residual stress gradient in the electroplated nickel layer and in-use stiction of the cantilever beams.

scholarly journals Numerical Investigation into Flutter and Flutter-Buffet Phenomena for a Swept Wing and a Curved Planform Wing

2019 ◽  
Vol 2019 ◽  
pp. 1-19 ◽  
Author(s):  
Mario Rosario Chiarelli ◽  
Salvatore Bonomo
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
High Speed ◽  
Sensitivity Study ◽  
Fuel Saving ◽  
Swept Wing ◽  
Instability Condition ◽  
Aspect Ratios ◽  
Numerical Studies ◽  
Classical Flutter

The results of numerical studies carried out on high-aspect-ratio wings with different planforms are discussed: the transonic regime is analysed for a swept wing and a curved planform wing. The wings have similar aspect ratios and similar aerodynamic profiles. The analyses were carried out by CFD and FE techniques, and the reliability of the numerical aerodynamic results was proven by a sensitivity study. Analysing the performances of the two wings demonstrated that in transonic flight conditions, a noticeable drag reduction can be obtained by adopting a curved planform wing. In addition, for such a wing, the aeroelastic instability condition, consisting in a classical flutter, is postponed compared to a conventional swept wing, for which a flutter-buffet instability occurs. In a preliminary manner, the study shows that, for a curved planform wing, the high speed buffet is not an issue and at the same time notable fuel saving can be achieved.

scholarly journals Effects of Steel Fiber Percentage and Aspect Ratios on Fresh and Harden Properties of Ultra-High Performance Fiber

2021 ◽  
Vol 2 (3) ◽  
pp. 501-515
Author(s):  
Rajib Kumar Biswas ◽  
Farabi Bin Ahmed ◽  
Md. Ehsanul Haque ◽  
Afra Anam Provasha ◽  
Zahid Hasan ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Aspect Ratio ◽  
High Performance ◽  
Steel Fiber ◽  
Setting Time ◽  
Fiber Reinforced Concrete ◽  
Future Research ◽  
Manufacturing Cost ◽  
Aspect Ratios ◽  
High Performance Fiber

Steel fibers and their aspect ratios are important parameters that have significant influence on the mechanical properties of ultrahigh-performance fiber-reinforced concrete (UHPFRC). Steel fiber dosage also significantly contributes to the initial manufacturing cost of UHPFRC. This study presents a comprehensive literature review of the effects of steel fiber percentages and aspect ratios on the setting time, workability, and mechanical properties of UHPFRC. It was evident that (1) an increase in steel fiber dosage and aspect ratio negatively impacted workability, owing to the interlocking between fibers; (2) compressive strength was positively influenced by the steel fiber dosage and aspect ratio; and (3) a faster loading rate significantly improved the mechanical properties. There were also some shortcomings in the measurement method for setting time. Lastly, this research highlights current issues for future research. The findings of the study are useful for practicing engineers to understand the distinctive characteristics of UHPFRC.

Accelerating ion diffusion with unique three-dimensionally interconnected nanopores for self-membrane high-performance pseudocapacitors

Nanoscale ◽  
2017 ◽  
Vol 9 (46) ◽  
pp. 18311-18317 ◽  
Author(s):  
Yuan Gao ◽  
Yuanjing Lin ◽  
Zehua Peng ◽  
Qingfeng Zhou ◽  
Zhiyong Fan
Keyword(s):  
Aspect Ratio ◽  
Surface Area ◽  
Structural Stability ◽  
High Aspect Ratio ◽  
High Performance ◽  
Three Dimensional ◽  
Rate Capability ◽  
Large Surface Area ◽  
Nanoporous Structure ◽  
Ion Diffusion

Three-dimensional interconnected nanoporous structure (3-D INPOS) possesses high aspect ratio, large surface area, as well as good structural stability. Profiting from its unique interconnected architecture, the 3-D INPOS pseudocapacitor achieves a largely enhanced capacitance and rate capability.

Fabrication and electrical characterization of high aspect ratio poly-silicon filled through-silicon vias

2012 ◽  
Vol 22 (5) ◽  
pp. 055021 ◽  
Author(s):  
Pradeep Dixit ◽  
Tapani Vehmas ◽  
Sami Vähänen ◽  
Philippe Monnoyer ◽  
Kimmo Henttinen
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Electrical Characterization ◽  
Through Silicon Vias ◽  
Poly Silicon ◽  
Silicon Vias

scholarly journals A novel fabrication technique for high-aspect-ratio nanopillar arrays for SERS application

RSC Advances ◽  
2020 ◽  
Vol 10 (73) ◽  
pp. 45037-45041
Author(s):  
Tianli Duan ◽  
Chenjie Gu ◽  
Diing Shenp Ang ◽  
Kang Xu ◽  
Zhihong Liu
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Fabrication Technique ◽  
Novel Technique ◽  
Aspect Ratios ◽  
Nanopillar Arrays

A novel technique is demonstrated for the fabrication of silicon nanopillar arrays with high aspect ratios.

Highly ordered nanoscale phosphomolybdate-grafted polyaniline/metal hybrid layered structures prepared via secondary sputtering phenomenon as high-performance pseudocapacitor electrodes

2021 ◽  
Author(s):  
Eun Seop Yoon ◽  
Bong Gill Choi ◽  
Hwan-Jin Jeon
Keyword(s):  
Electron Transfer ◽  
Aspect Ratio ◽  
Electrochemical Performance ◽  
High Aspect Ratio ◽  
High Performance ◽  
Electrode Materials ◽  
Rate Capability ◽  
High Specific Capacitance ◽  
High Rate ◽  
Large Area

Abstract The development of energy storage electrode materials is important for enhancing the electrochemical performance of supercapacitors. Despite extensive research on improving electrochemical performance with polymer-based materials, electrode materials with micro/nanostructures are needed for fast and efficient ion and electron transfer. In this work, highly ordered phosphomolybdate (PMoO)-grafted polyaniline (PMoO-PAI) deposited onto Au hole-cylinder nanopillar arrays is developed for high-performance pseudocapacitors. The three-dimensional nanostructured arrays are easily fabricated by secondary sputtering lithography, which has recently gained attention and features a high resolution of 10 nm, a high aspect ratio greater than 20, excellent uniformity/accuracy/precision, and compatibility with large area substrates. These 10nm scale Au nanostructures with a high aspect ratio of ~30 on Au substrates facilitate efficient ion and electron transfer. The resultant PMoO-PAI electrode exhibits outstanding electrochemical performance, including a high specific capacitance of 114 mF/cm2, a high-rate capability of 88%, and excellent long-term stability.

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