Electrical Performance of Through-Silicon Vias (TSVs) for High-Frequency 3D IC Integration Applications

2012 ◽  
Vol 2012 (1) ◽  
pp. 001221-001228 ◽  
Author(s):  
Jui-Feng Hung ◽  
John H. Lau ◽  
Peng-Shu Chen ◽  
Shih-Hsien Wu ◽  
Sheng-Che Hung ◽  
...  
Keyword(s):  
Finite Element ◽  
Analytical Model ◽  
High Frequency ◽  
Electrical Performance ◽  
Finite Element Analyses ◽  
Design Guideline ◽  
3D Ic ◽  
Through Silicon Vias ◽  
Time Domains ◽  
Silicon Vias

In this study, the electrical performance of a general TSV structure for high-frequency 3D IC integration applications is investigated. Emphasis is placed on the proposal of an analytical model and the analytical equations of a TSV with all its key parameters. Also, the model and equations are verified, both in the frequency and time domains, by more detailed finite element analyses. Finally, a TSV electrical design guideline is proposed.

High Frequency Signal Propagation in Through Silicon Vias

2012 ◽  
Vol 2012 (1) ◽  
pp. 000239-000243
Author(s):  
Srinidhi Raghavan Narasimhan ◽  
A. Ege Engin
Keyword(s):  
Wave Propagation ◽  
High Frequency ◽  
High Speed ◽  
Signal Propagation ◽  
Successful Implementation ◽  
High Frequency Signal ◽  
3D Ic ◽  
Through Silicon Vias ◽  
Integration Technology ◽  
Silicon Vias

The 3D IC integration technology and silicon interposers rely on through silicon vias (TSVs) for vertical interconnections. Hence, the medium carrying high frequency signals is lossy silicon (Si). Fundamental understanding of wave propagation through TSVs is essential for successful implementation of 3D IC integration technology as well as for the development of Si interposers at RF/microwave frequencies. The focus of this paper is characterization and modelling of TSVs and Si to explore high speed signal propagation through the lossy Si medium. To understand better the physical significance of the TSV, we will establish a framework for wave propagation through TSVs based on dielectric quasi-TEM, skin effect, and slow-wave modes similar to MIS micro-strip lines. For validation of the existence of these modes, full wave simulation results will be compared with simpler two dimensional transmission line simulators.

Oxide Liner, Barrier and Seed Layers, and Cu-Plating of Blind Through Silicon Vias (TSVs) on 300mm Wafers for 3D IC Integration

2011 ◽  
Vol 2011 (1) ◽  
pp. 000001-000007
Author(s):  
Chien-Ying Wu ◽  
Shang-Chun Chen ◽  
Pei-Jer Tzeng ◽  
John H. Lau ◽  
Yi-Feng Hsu ◽  
...  
Keyword(s):  
Cross Sections ◽  
3D Integration ◽  
Leakage Currents ◽  
3D Ic ◽  
Through Silicon Vias ◽  
Enabling Technologies ◽  
Key Enabling Technologies ◽  
Silicon Vias ◽  
Seed Layers

In this study, key enabling technologies such as the oxide liner by the PECVD, the barrier and seed layers by the PVD, and Cu-plating of blind TSVs on 300mm wafers for 3D integration are investigated. Emphases are placed on the determination and optimization of the important parameters for each of the key enabling technologies. Also, leakage currents of the fabricated Cu-filled TSVs are measured. Furthermore cross sections and SEM of the fabricated TSVs are provided and examined.

Sound Barrier Applications of Recycled Plastics

1998 ◽  
Vol 1626 (1) ◽  
pp. 85-92 ◽  
Author(s):  
M. Ala Saadeghvaziri ◽  
Keith Macbain
Keyword(s):  
Finite Element ◽  
Analytical Model ◽  
Transmission Loss ◽  
Sound Transmission ◽  
Finite Element Analyses ◽  
Sound Barrier ◽  
Recycled Plastics ◽  
Material Tests

An innovative noise wall design that uses recycled plastic and takes advantage of multilayering to increase stiffness and sound effectiveness is proposed and analyzed. Prototypes of the proposed design were constructed and tested for sound transmission to determine their effectiveness and show the desirability of a multilayered approach. The results show that, acoustically, the transmission loss of the proposed design is as effective as traditional designs. Furthermore, finite element analyses as well as an analytical model developed specifically for recycled plastics indicate that, structurally, the proposed design can increase spans between posts resulting in a design that is potentially more economical than current designs. Results of material tests conducted in support of the analytical model and noise wall development are also discussed.

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