A New Package Structure for High Speed eStorages

2014 ◽  
Vol 2014 (1) ◽  
pp. 000194-000198 ◽  
Author(s):  
Hyejin Kim ◽  
Sunghoon Chun ◽  
Jaeyeon Hwang ◽  
Ilmok Kang
Keyword(s):  
Optimal Design ◽  
High Speed ◽  
High Density ◽  
Mobile Systems ◽  
Storage Density ◽  
Packaging Space

Mobile storage density per chip (NAND, DRAM, etc) has increased as well with ever growing usage of high speed mobile systems. For these requirements, various eStoarge solutions (eMMC, eMCP, etc) have been developed. To optimize high speed and high density requirements in a tighter limited packaging space, we propose a new package structure using RDL(Re-Distribution Layer) on chips for optimal design with a high interface speed, smaller and cheaper package in this paper.

Crack divergence phenomena in tempered glass

2020 ◽  
Vol 13 (3) ◽  
pp. 115-129
Author(s):  
Shin’ichi Aratani
Keyword(s):  
Optimal Design ◽  
High Speed ◽  
Glass Plate ◽  
Acute Angle ◽  
Divergence Angle ◽  
High Speed Photography ◽  
Tempered Glass ◽  
Thick Glass

High speed photography using the Cranz-Schardin camera was performed to study the crack divergence and divergence angle in thermally tempered glass. A tempered 3.5 mm thick glass plate was used as a specimen. It was shown that two types of bifurcation and branching existed as the crack divergence. The divergence angle was smaller than the value calculated from the principle of optimal design and showed an acute angle.

Development of ATC for High Speed and High Density Commuter Line

2007 ◽  
Vol 127 (10) ◽  
pp. 1033-1042
Author(s):  
Tamio Okutani ◽  
Nobuyuki Nakamura ◽  
Hisato Araki ◽  
Shouji Irie ◽  
Hiroki Osa ◽  
...  
Keyword(s):  
High Speed ◽  
High Density

A flexible gate array for high speed and high density applications

2002 ◽  
Author(s):  
J. Gallia ◽  
R. Landers ◽  
Ching-Hao Shaw ◽  
T. Blake ◽  
W. Banzhaf
Keyword(s):  
High Speed ◽  
High Density ◽  
Gate Array

Silicon stacked tunnel transistor for high-speed and high-density random access memory gain cells

1999 ◽  
Vol 35 (10) ◽  
pp. 848 ◽  
Author(s):  
K. Nakazato ◽  
K. Itoh ◽  
H. Mizuta ◽  
H. Ahmed
Keyword(s):  
High Speed ◽  
Random Access ◽  
Random Access Memory ◽  
High Density ◽  
Access Memory ◽  
Tunnel Transistor

Development of High-Speed Response Electromagnetic Linear Actuator Using for Pneumatic Control Valve

2014 ◽  
Vol 532 ◽  
pp. 41-45 ◽  
Author(s):  
Myung Jin Chung
Keyword(s):  
Optimal Design ◽  
Dynamic Characteristics ◽  
High Speed ◽  
Design Method ◽  
Control Valve ◽  
Design Parameters ◽  
Linear Actuator ◽  
Analytic Model ◽  
Electromagnetic Linear Actuator ◽  
Quadratic Programming Method

Analytic model of electromagnetic linear actuator in the function of electric and geometric parameters is proposed and the effects of the design parameters on the dynamic characteristics are analyzed. To improve the dynamic characteristics, optimal design is conducted by applying sequential quadratic programming method to the analytic model. This optimal design method aims to minimize the response time and maximize force efficiency. By this procedure, electromagnetic linear actuator having high-speed characteristics is developed.

Thermal design for high-speed high-density multichip module

1993 ◽  
Vol 16 (4) ◽  
pp. 384-387 ◽  
Author(s):  
T. Handa ◽  
S. Iida ◽  
J. Utsunomiya
Keyword(s):  
High Speed ◽  
High Density ◽  
Thermal Design ◽  
Multichip Module
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