Effect of moderately-high temperature stress on photosynthesis and carbohydrate metabolism in tomato (Lycopersico esculentum L.) leaves

2012 ◽  
Vol 7 (3) ◽  
Author(s):  
Zhang Jie
Keyword(s):  
High Temperature ◽  
Carbohydrate Metabolism ◽  
Temperature Stress ◽  
High Temperature Stress ◽  
Moderately High Temperature

Response of Nostoc flagelliforme cell to Hyperthermia Stress

2012 ◽  
Vol 518-523 ◽  
pp. 614-618
Author(s):  
Jin Ying Guo ◽  
Ming Ke Shi ◽  
Guo Yan Ren ◽  
Yong Yin ◽  
Shi Ru Jia
Keyword(s):  
High Temperature ◽  
Temperature Stress ◽  
Electrolyte Leakage ◽  
Soluble Protein ◽  
High Temperature Stress ◽  
Control Group ◽  
Nostoc Flagelliforme ◽  
Sod Activity ◽  
Drought Tolerant ◽  
Moderately High Temperature

The effects of hyperthermia stress was studied in a terrestrial, drought-tolerant alga, Nostoc flagelliforme. The BG11 culture medium were used to culture Nostoc flagelliforme cell at different temperature conditions: 25°C, 35°C,45°Cand 55°C. The physiological and biochemical character of Nostoc flagelliforme cell, such as electrolyte leakage, the activities of superoxide dismutase(SOD), the content of malondialdehyde(MDA), proline(Pro), soluble protein and trehalose were tested after 8h, 12h, 16h and 24h treatment under 40μmol/m2/s. The results showed that: electrolyte leakage and malondialdehyde contents in Nostoc flagelliforme cell were higher under high temperature stress than those in the control group during high temperature stress. In the meanwhile SOD activity increased slightly under the high temperature stress, but were lower afterwards. The contents of Pro, soluble protein and trehalose increased under the moderately high-temperature stress, while declined under extremely high-temperature(55°C) stress.Therefore, it is proposed that the Nostoc flagelliforme cell had a certain extent resistance ability to the high-temperature, the osmotic adjustment function was stimulated, and the SOD activity was improved under certain high-temperature stress, but the Nostoc flagelliforme cell were damaged badly under extremely high-temperature(55°C) stress.

Assessment of wheat (Triticum aestivum L.) genotypes for high temperature stress tolerance using physico-chemical analysis

2020 ◽  
Vol 53 (2) ◽  
Author(s):  
Khalil Ahmed Laghari ◽  
Abdul Jabbar Pirzada ◽  
Mahboob Ali Sial ◽  
Muhammad Athar Khan ◽  
Jamal Uddin Mangi
Keyword(s):  
Triticum Aestivum ◽  
High Temperature ◽  
Chemical Analysis ◽  
Stress Tolerance ◽  
Temperature Stress ◽  
Triticum Aestivum L ◽  
High Temperature Stress ◽  
Physico Chemical

Genome-wide identification and analysis of maize PAL gene family and its expression profile in response to high-temperature stress

2020 ◽  
Vol 52 (5) ◽  
Author(s):  
De-Gong Wu ◽  
Qiu-Wen Zhan ◽  
Hai-Bing Yu ◽  
Bao-Hong Huang ◽  
Xin-Xin Cheng ◽  
...  
Keyword(s):  
High Temperature ◽  
Gene Family ◽  
Temperature Stress ◽  
Expression Profile ◽  
High Temperature Stress ◽  
Genome Wide

Impact of Metal Pad Etch-Induced Plasma Damage on Dynamic Retention Time Degradation during High Temperature Stress in High Density DRAM Technology

2005 ◽  
Author(s):  
D-J Kim ◽  
I-G Kim ◽  
J-Y Noh ◽  
H-J Lee ◽  
S-H Park ◽  
...  
Keyword(s):  
High Temperature ◽  
Temperature Stress ◽  
Retention Time ◽  
High Temperature Stress ◽  
High Density ◽  
Cell Junction ◽  
Antenna Effect ◽  
Plasma Damage ◽  
Root Cause ◽  
Wafer Processing

Abstract As DRAM technology extends into 12-inch diameter wafer processing, plasma-induced wafer charging is a serious problem in DRAM volume manufacture. There are currently no comprehensive reports on the potential impact of plasma damage on high density DRAM reliability. In this paper, the possible effects of floating potential at the source/drain junction of cell transistor during high-field charge injection are reported, and regarded as high-priority issues to further understand charging damage during the metal pad etching. The degradation of block edge dynamic retention time during high temperature stress, not consistent with typical reliability degradation model, is analyzed. Additionally, in order to meet the satisfactory reliability level in volume manufacture of high density DRAM technology, the paper provides the guidelines with respect to plasma damage. Unlike conventional model as gate antenna effect, the cell junction damage by the exposure of dummy BL pad to plasma, was revealed as root cause.

Effect of high temperature stress on seed filling and nutritional quality of rice (Oryza sativa L.)

2020 ◽  
Vol 16 (2) ◽  
pp. 18-23
Author(s):  
K. PRAVALLIKA ◽  
C. ARUNKUMAR ◽  
A. VIJAYKUMAR ◽  
R. BEENA ◽  
V. G. JAYALEKSHMI
Keyword(s):  
Oryza Sativa ◽  
High Temperature ◽  
Temperature Stress ◽  
Nutritional Quality ◽  
High Temperature Stress ◽  
Seed Filling

scholarly journals Wheat (Triticum aestivum L.) TaHMW1D Transcript Variants Are Highly Expressed in Response to Heat Stress and in Grains Located in Distal Part of the Spike

Plants ◽  
2021 ◽  
Vol 10 (4) ◽  
pp. 687
Author(s):  
Chan Seop Ko ◽  
Jin-Baek Kim ◽  
Min Jeong Hong ◽  
Yong Weon Seo
Keyword(s):  
Heat Stress ◽  
High Temperature ◽  
Temperature Stress ◽  
Storage Proteins ◽  
Seed Storage ◽  
Seed Storage Proteins ◽  
Grain Filling ◽  
High Temperature Stress ◽  
Two Dimensional Gel Electrophoresis ◽  
Transcript Variants

High-temperature stress during the grain filling stage has a deleterious effect on grain yield and end-use quality. Plants undergo various transcriptional events of protein complexity as defensive responses to various stressors. The “Keumgang” wheat cultivar was subjected to high-temperature stress for 6 and 10 days beginning 9 days after anthesis, then two-dimensional gel electrophoresis (2DE) and peptide analyses were performed. Spots showing decreased contents in stressed plants were shown to have strong similarities with a high-molecular glutenin gene, TraesCS1D02G317301 (TaHMW1D). QRT-PCR results confirmed that TaHMW1D was expressed in its full form and in the form of four different transcript variants. These events always occurred between repetitive regions at specific deletion sites (5′-CAA (Glutamine) GG/TG (Glycine) or (Valine)-3′, 5′-GGG (Glycine) CAA (Glutamine) -3′) in an exonic region. Heat stress led to a significant increase in the expression of the transcript variants. This was most evident in the distal parts of the spike. Considering the importance of high-molecular weight glutenin subunits of seed storage proteins, stressed plants might choose shorter polypeptides while retaining glutenin function, thus maintaining the expression of glutenin motifs and conserved sites.

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