Pick and Place Process Defect Mitigation on Semiconductor BGA Device

With the new devices and new technologies in semiconductor industry are getting more challenging to process because of new processes and process bricks. One of the most challenging assembly processes is the pick and place or the die attach process. Issues were encountered during product development phase of a semiconductor ball grid array (BGA) device of radio frequency (RF) applications and one of which is the “thrown” dies during die picking. This paper is focused on addressing the thrown dies issue at pick and place process. Installation of blower ionizer on the machine is an extensive improvement done to eliminate the foreign materials resulting to thrown dies during picking. With this improvement, a reduction of around 80 percent of thrown dies was achieved. For future works, the improvement and learnings could be used for devices with similar requirement.

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Die Crack Resolution through Pick-up Process Optimization for BGA Package

Journal of Engineering Research and Reports ◽

10.9734/jerr/2021/v20i317277 ◽

2021 ◽

pp. 32-36

Author(s):

R. Rodriguez ◽

E. Graycochea Jr. ◽

F. R. Gomez ◽

E. Manalo

Keyword(s):

Process Optimization ◽

Process Improvement ◽

Parameter Optimization ◽

New Technologies ◽

Semiconductor Industry ◽

Ball Grid Array ◽

Main Root ◽

Root Cause ◽

Die Attach ◽

Bga Package

With the new devices and new technologies in the semiconductor industry are getting more challenging to process because issues are unavoidable especially on thin dies. The paper is focused on the improvement done on a ball grid array (BGA) substrate package assembly to address the quantity of rejection of die crack during die picking at the die attach process station. High pick force and high needle top height found out during the pick-up process is the main root cause of die crack. Parameter optimization particularly for die picking with the combination of pick force and needle top height parameter was done to eliminate this type of issue after the die attaches process. With the die attach process improvement, a reduction of 100 percent of die crack occurrence was successfully achieved. For future works, the improvement and learnings could be used for devices with similar constraints.

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Interactive Q-Learning Approach for Pick-and-Place Optimization of the Die Attach Process in the Semiconductor Industry

Mathematical Problems in Engineering ◽

10.1155/2019/4602052 ◽

2019 ◽

Vol 2019 ◽

pp. 1-8 ◽

Cited By ~ 1

Author(s):

Gilseung Ahn ◽

Myunghwan Park ◽

You-Jin Park ◽

Sun Hur

Keyword(s):

High Performance ◽

Semiconductor Industry ◽

Search Time ◽

Generalization Ability ◽

Q Learning ◽

Die Attach ◽

Metaheuristic Methods ◽

Pick And Place ◽

Novel Method ◽

And Performance

In semiconductor back-end production, the die attach process is one of the most critical steps affecting overall productivity. Optimization of this process can be modeled as a pick-and-place problem known to be NP-hard. Typical approaches are rule-based and metaheuristic methods. The two have high or low generalization ability, low or high performance, and short or long search time, respectively. The motivation of this paper is to develop a novel method involving only the strengths of these methods, i.e., high generalization ability and performance and short search time. We develop an interactive Q-learning in which two agents, a pick agent and a place agent, are trained and find a pick-and-place (PAP) path interactively. From experiments, we verified that the proposed approach finds a shorter path than the genetic algorithm given in previous research.

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Pick and Place Process Optimization for Thin Semiconductor Packages

Journal of Engineering Research and Reports ◽

10.9734/jerr/2019/v4i216897 ◽

2019 ◽

pp. 1-9

Author(s):

Rennier S. Rodriguez ◽

Frederick Ray I. Gomez

Keyword(s):

Process Optimization ◽

Ball Grid Array ◽

Innovative Approach ◽

Die Attach ◽

Bga Packages ◽

Pick And Place ◽

Thin Semiconductor ◽

Early Production ◽

Semiconductor Packages ◽

Related Process

Nowadays, electronic manufacturers trend are to become thinner and thinner especially those electronic gadgets that is very handy and convenient on our daily necessity. Challenge with the leading manufacturers is the production and development of less size gadget yet with richness of available application and uses that we can work on with what can please its consumer for their convenience and satisfaction. As with the semiconductor company, correlation between becoming thinner versus manufacturing capability become significantly opposite, as the package become thinner the more complex its related process can be. This study covers innovative approach in die attach station on critical handling of thin die packages. Lessons and learning were documented from Ball Grid Array (BGA) packages as first to be evaluated with thin package requirements. Also discussed herewith are documented defects and related issues during trials and die attach builds that has been a show stopper on its early production.

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Laser DAF Cut Augmentation for Thin Wafers

Journal of Engineering Research and Reports ◽

10.9734/jerr/2020/v10i117029 ◽

2020 ◽

pp. 24-31

Author(s):

Bryan Christian Bacquian ◽

Frederick Ray Gomez

Keyword(s):

Integrated Circuit ◽

New Technologies ◽

Process Development ◽

Semiconductor Industry ◽

Die Attach ◽

Critical Characteristics ◽

Wafer Processing ◽

Material Solution ◽

Different Characteristics ◽

Sawing Process

The semiconductor industry is becoming more inclined to thinner integrated circuit (IC) packages. Thinner packages with thin wafer or die prefer the die attach film (DAF) technology as the die adhesive material solution. As the wafer goes thinner, it becomes more of a challenge in process development, especially during its assembly preparatory stages. As the dies become smaller and thinner, wafer sawing process should have minimum effect on the mechanical integrity of the silicon so as not to alter its quality. New technologies were developed and introduced in the industry and one of this is the laser die attach film (DAF) cutting. The method was developed together with dies before grinding (DBG) as a cutting medium to address potential processability problems that may occur on the conventional mechanical blade saw. This paper discusses the laser DAF cut development covering the design of experiments (DOE) to understand the different characteristics of laser DAF solution. Validations are made through actual simulation and wafer processing. The paper also covers the interaction of different DAF thicknesses and parameters in order to define the critical characteristics in achieving optimal DAF cutting process responses.

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Guidelines for the measurement method of power durability for surface acoustic wave (SAW) and bulk acoustic wave (BAW) devices in radio frequency (RF) applications

10.3403/30366384u ◽

2020 ◽

Keyword(s):

Acoustic Wave ◽

Radio Frequency ◽

Surface Acoustic Wave ◽

Measurement Method ◽

Bulk Acoustic Wave ◽

Rf Applications

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Fueling Spin-offs: Case Studies of University-based Technology Start-up Funding

Technology & Innovation ◽

10.21300/21.4.2021.4 ◽

2021 ◽

Vol 22 (1) ◽

pp. 29-40

Author(s):

Julie Lenzer ◽

Piotr Kulczakowicz

Keyword(s):

Product Development ◽

New Technologies ◽

Early Stage ◽

New Products ◽

Academic Research ◽

Real Life ◽

Private Investment ◽

Building Relationships ◽

Start Up ◽

Single Path

The new technologies born from academic research can be very promising, yet they are often very early stage. University spin-off companies are uniquely positioned to tackle the risks associated with new technologies emerging from academia by developing proofs of concept, functioning prototypes, and new products. While these enterprises start from a solid research and development foundation, they face their own unique set of challenges—they are strongly anchored in the scientific and technological expertise that is typically backed by intellectual property but often lack the business experience needed to develop and market products demanded by customers. University spin-offs have access to substantial non-dilutive funding that can be utilized for advancing product development. While the relentless pursuit of these funds builds a company's credibility and improves its position for negotiating future private investment, university spin-offs would greatly benefit from an early focus on complementing their technology teams with their business teams. These new enterprises should consider pursuing private investment in parallel to utilizing sources of non-dilutive funding. Timing of private investment is extremely important to maximize the value of the opportunity, and, therefore, building relationships with investors early on and getting ready for executing an investment round can greatly increase odds for success. While there is no single path to formulate, pursue, and adapt successful financing strategies, lessons can be learned from real-life cases of university spin-offs that continue their journeys towards ultimate success.

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Molding of Three-Dimensional Microcomponents

Manufacturing Science and Engineering, Parts A and B ◽

10.1115/msec2006-21123 ◽

2006 ◽

Cited By ~ 1

Author(s):

W. N. P. Hung ◽

M. M. Agnihotri ◽

M. Y. Ali ◽

S. Yuan

Keyword(s):

Focused Ion Beam ◽

New Technologies ◽

Electrical Discharge Machining ◽

Ion Beam ◽

Semiconductor Industry ◽

Three Dimensional ◽

Cost Effective ◽

Molecular Structures ◽

Minimum Size ◽

Ion Beam Sputtering

Traditional micromanufacturing has been developed for semiconductor industry. Selected micro electrical mechanical systems (MEMS) have been successfully developed and implemented in industry. Since current MEMS are designed for manufacture using microelectronics processes, they are limited to two-dimensional profiles and semiconductor based materials. Such shape and material constraints would exclude many applications that require biocompatibility, dynamic stress, and high ductility. New technologies are sought to fabricate three dimensional microcomponents using robust materials for demanding applications. To be cost effective, such microdevices must be economically mass producible. Molding is one of the promising replication techniques to mass produce components from polymers and polymer-based composites. This paper presents the development of a micromolding process to produce thermoplastic microcomponents. Mold design required precision fitting and was integrated with a vacuum pump to minimize air trap in mold cavities. Nickel and aluminum mold inserts were used for the study; their cavities were fabricated by combinations of available micromachining processes like laser micromachining, micromilling, micro electrical discharge machining, and focused ion beam sputtering. High and low density polyethylene, polystyrene polymers were used for this study. The effects of polymer molecular structures, molding temperature, time, and pressure on molding results were studied. Simulation of stress in the microcomponents, plastic flow in microchannels, and mold defects was performed and compare with experimental data. The research results showed that a microcomponent can be fabricated to the minimum size of 10 ± 1μm (0.0004 inch) with surface roughness <10 nm Rt. Molding of micro-size geartrains and orthopedic meso-size fasteners was completed to illustrate the capability of this process.

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Purwarupa Alat Kalibrasi Kerataan Bidang Kerja menggunakan Laser Sensor

ELKOMIKA Jurnal Teknik Energi Elektrik Teknik Telekomunikasi & Teknik Elektronika ◽

10.26760/elkomika.v6i2.274 ◽

2018 ◽

Vol 6 (2) ◽

pp. 274

Author(s):

BUDI SUGANDI ◽

SURADI WIYONO

Keyword(s):

Prototype System ◽

Laser Sensor ◽

Important Process ◽

Manual Measurement ◽

Industrial Manufacturing ◽

Die Attach ◽

Pick And Place ◽

Component Assembly ◽

Keywords Laser

ABSTRAKSalah satu elemen teknologi pendukung dari industri manufaktur elektronika adalah mesin Die Attach. Mesin ini digunakan pada proses assembly komponen dengan metode pick and place komponen pada material. Sebagai proses yang penting dalam industri manufaktur, mesin ini memerlukan kalibrasi secara reguler dan tepat yang akan menjadi kunci sukses dari kualitas suatu produksi. Penelitian ini bertujuan membuat suatu purwarupa alat yang digunakan sebagai pengontrol kalibrasi dengan menggunakan laser sensor. Proses kalibrasi dilakukan dengan cara mengukur kerataan titip sisi work holder menggunakan laser sensor. Kerataan didapatkan dengan membandingkan jarak yang terukur oleh laser sensor pada tiap titik uji. Jarak yang sama pada tiap titik uji menunjukkan kerataan dari work holder. Pergerakan laser sensor dikontrol oleh dua buah motor yang bergerak ke arah sumbu X dan Y. Alat ini telah diuji dengan mengkalibrasi pada empat sisi work holder. Hasil pengujian kemudian dibandingkan dengan pengukuran manual dan didapatkan error rata-rata pengukuran sekitar 4%.Kata kunci: Laser sensor, kerataan, kalibrasi, die attach machine ABSTRACTOne of the element technology supporting an industrial manufacturing is Die Attach machine. This machine is used at component assembly using component pick and place. As an important process, this machine requires regular and precise calibration to support quality of the product. This research aims to build a prototype system using laser sensor which can be used as calibration instrument. The callibration proses was done by measuring the flatness of each side of work holder using laser sensor. The flatness was obtained by comparing the distance of each testing point. The same distance on each testing point represented the flatness of the wrok holder. The movement of laser sensor was controlled by two motors which moved to X and Y axis. The system has been tested to calibrate each side of work holder. The experimental results were then compare with manual measurement and showed the measurement error about 4%.Keywords: Laser sensor, flatness, callibration, die attach machine.

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