scholarly journals Interactive Q-Learning Approach for Pick-and-Place Optimization of the Die Attach Process in the Semiconductor Industry

2019 ◽  
Vol 2019 ◽  
pp. 1-8 ◽  
Author(s):  
Gilseung Ahn ◽  
Myunghwan Park ◽  
You-Jin Park ◽  
Sun Hur
Keyword(s):  
High Performance ◽  
Semiconductor Industry ◽  
Search Time ◽  
Generalization Ability ◽  
Q Learning ◽  
Die Attach ◽  
Metaheuristic Methods ◽  
Pick And Place ◽  
Novel Method ◽  
And Performance

In semiconductor back-end production, the die attach process is one of the most critical steps affecting overall productivity. Optimization of this process can be modeled as a pick-and-place problem known to be NP-hard. Typical approaches are rule-based and metaheuristic methods. The two have high or low generalization ability, low or high performance, and short or long search time, respectively. The motivation of this paper is to develop a novel method involving only the strengths of these methods, i.e., high generalization ability and performance and short search time. We develop an interactive Q-learning in which two agents, a pick agent and a place agent, are trained and find a pick-and-place (PAP) path interactively. From experiments, we verified that the proposed approach finds a shorter path than the genetic algorithm given in previous research.

Towards Smart Service Networks

2015 ◽  
Vol 7 (1) ◽  
pp. 38-59 ◽  
Author(s):  
Yan Wang ◽  
Yehia Taher ◽  
Willem-Jan van den Heuvel
Keyword(s):  
High Performance ◽  
Open Systems ◽  
Peer Interactions ◽  
Interdisciplinary Collaboration ◽  
Service Provisioning ◽  
Service Networks ◽  
Root Cause ◽  
Novel Method ◽  
Smart Service ◽  
And Performance

Service Networks (SNs) are open systems accommodating the co-production of new knowledge and services through organic peer-to-peer interactions. Key to broad success of SNs in practice is their ability to foster and ensure a high performance. By performance we mean the joint effort of tremendous interdisciplinary collaboration, cooperation and coordination among the network participants. However, due to the heterogeneous background of such participants (i.e., business, technical, etc.), operational gaps are likely to appear in the end-to-end service provisioning process. Especially when there are performance anomalies, the SNs lack of traceability to find out the root cause, due to the confusions in the multi-disciplinary communication of SNs participants. To deal with such a problem, we propose a novel method of diagnosing SNs performance on the basis of a systems thinking mindset. By using our diagnostics, the SNs essence and performance are identified and modeled in both static and dynamic manners. The SNs performance can be tuned and optimized with improved traceability to the involved service operations.

Understanding Mold Compound Behavior on Flip Chip QFN Packages

2018 ◽  
Vol 2018 (1) ◽  
pp. 000125-000128
Author(s):  
Ruby Ann M. Camenforte ◽  
Jason Colte ◽  
Richard Sumalinog ◽  
Sylvester Sanchez ◽  
Jaimal Williamson
Keyword(s):  
Thermal Performance ◽  
High Performance ◽  
Flip Chip ◽  
Low Cost ◽  
Semiconductor Industry ◽  
Gelation Time ◽  
Molding Process ◽  
Design Quality ◽  
Low Resistance ◽  
Die Attach

Abstract Overmolded Flip Chip Quad Flat No-lead (FCQFN) is a low cost flip chip on leadframe package where there is no need for underfill, and is compatible with Pb free or high Pb metallurgy. A robust leadframe design, quality solder joint formation and an excellent molding process are three factors needed to assemble a high performance FCQFN. It combines the best of both wirebonded QFN and wafer chip scale devices. For example, wafer chip scale has low resistance, but inadequate thermal performance (due to absence of thermal pad), whereas wirebonded QFN has good thermal performance (i.e., heat dissipated through conductive die attach material, through the pad and to the board) but higher resistance. Flip chip QFN combines both positive aspects – that is: low resistance and good thermals. One of the common defects for molded packages across the semiconductor industry is the occurrence of mold voiding as this can potentially affect the performance of a device. This paper will discuss how mold voiding is mitigated by understanding the mold compound behavior on flip chip QFN packages. Taking for example the turbulent mold flow observed on flip chip QFN causing mold voids. Mold compound material itself has a great contribution to mold voids, hence defining the correct attributes of the mold compound is critical. Altering the mold compound property to decrease the mold compound rheology is a key factor. This dynamic interaction between mold compound and flip chip QFN package configuration is the basis for a series of design of experiments using a full factorial matrix. Key investigation points are establishing balance in mold compound chemistry allowing flow between bump pitch, as well as the mold compound rheology, where gelation time has to be properly computed to allow flow across the leadframe. Understanding the flow-ability of mold compound for FCQFN, the speed of flow was optimized to check on its impact on mold voids. Mold airflow optimization is also needed to help fill in tighter bump spacing but vacuum-on time needs to be optimized as well.

scholarly journals Pick and Place Process Defect Mitigation on Semiconductor BGA Device

2020 ◽  
pp. 1-5
Author(s):  
Antonio R. Sumagpang Jr. ◽  
Frederick Ray I. Gomez ◽  
Edwin M. Graycochea Jr.
Keyword(s):  
Product Development ◽  
Radio Frequency ◽  
New Technologies ◽  
Semiconductor Industry ◽  
Ball Grid Array ◽  
Development Phase ◽  
Die Attach ◽  
Pick And Place ◽  
Rf Applications ◽  
Foreign Materials

With the new devices and new technologies in semiconductor industry are getting more challenging to process because of new processes and process bricks. One of the most challenging assembly processes is the pick and place or the die attach process. Issues were encountered during product development phase of a semiconductor ball grid array (BGA) device of radio frequency (RF) applications and one of which is the “thrown” dies during die picking. This paper is focused on addressing the thrown dies issue at pick and place process. Installation of blower ionizer on the machine is an extensive improvement done to eliminate the foreign materials resulting to thrown dies during picking. With this improvement, a reduction of around 80 percent of thrown dies was achieved. For future works, the improvement and learnings could be used for devices with similar requirement.

Trace nanoanalysis

1994 ◽  
Vol 52 ◽  
pp. 940-941
Author(s):  
D. E. Newbury ◽  
R. D. Leapman
Keyword(s):  
High Performance ◽  
Secondary Ion Mass Spectrometry ◽  
Detection Efficiency ◽  
Volume Element ◽  
And Performance ◽  
Trace Constituents ◽  
Secondary Ion ◽  
Concentration Levels ◽  
Structure Properties

Trace constituents, which can be very loosely defined as those present at concentration levels below 1 percent, often exert influence on structure, properties, and performance far greater than what might be estimated from their proportion alone. Defining the role of trace constituents in the microstructure, or indeed even determining their location, makes great demands on the available array of microanalytical tools. These demands become increasingly more challenging as the dimensions of the volume element to be probed become smaller. For example, a cubic volume element of silicon with an edge dimension of 1 micrometer contains approximately 5×1010 atoms. High performance secondary ion mass spectrometry (SIMS) can be used to measure trace constituents to levels of hundreds of parts per billion from such a volume element (e. g., detection of at least 100 atoms to give 10% reproducibility with an overall detection efficiency of 1%, considering ionization, transmission, and counting).

https://imsciences.edu.pk/files/journals/vol12_2/New%201%20MA.864.pdf

2020 ◽  
Vol 12 (2) ◽  
pp. 19-50 ◽  
Author(s):  
Muhammad Siddique ◽  
Shandana Shoaib ◽  
Zahoor Jan
Keyword(s):  
Organizational Performance ◽  
Structural Equation ◽  
High Performance ◽  
Service Sector ◽  
Performance Outcomes ◽  
Theory And Practice ◽  
Relational Coordination ◽  
Multiple Sources ◽  
And Performance ◽  
High Level

A key aspect of work processes in service sector firms is the interconnection between tasks and performance. Relational coordination can play an important role in addressing the issues of coordinating organizational activities due to high level of interdependence complexity in service sector firms. Research has primarily supported the aspect that well devised high performance work systems (HPWS) can intensify organizational performance. There is a growing debate, however, with regard to understanding the “mechanism” linking HPWS and performance outcomes. Using relational coordination theory, this study examines a model that examine the effects of subsets of HPWS, such as motivation, skills and opportunity enhancing HR practices on relational coordination among employees working in reciprocal interdependent job settings. Data were gathered from multiple sources including managers and employees at individual, functional and unit levels to know their understanding in relation to HPWS and relational coordination (RC) in 218 bank branches in Pakistan. Data analysis via structural equation modelling, results suggest that HPWS predicted RC among officers at the unit level. The findings of the study have contributions to both, theory and practice.

scholarly journals Study on strong spinning preparation method and mechanism of the industrial pure titanium ultrafine crystallization

2019 ◽  
Vol 14 ◽  
pp. 155892501989525
Author(s):  
Yu Yang ◽  
Yanyan Jia
Keyword(s):  
Heat Treatment ◽  
High Performance ◽  
Pure Titanium ◽  
Grain Structure ◽  
Theoretical Research ◽  
Ultrafine Grain ◽  
Forming Process ◽  
Spinning Process ◽  
And Performance ◽  
Material Utilization

Ultrafine crystallization of industrial pure titanium allowed for higher tensile strength, corrosion resistance, and thermal stability and is therefore widely used in medical instrumentation, aerospace, and passenger vehicle manufacturing. However, the ultrafine crystallizing batch preparation of tubular industrial pure titanium is limited by the development of the spinning process and has remained at the theoretical research stage. In this article, the tubular TA2 industrial pure titanium was taken as the research object, and the ultrafine crystal forming process based on “5-pass strong spin-heat treatment-3 pass-spreading-heat treatment” was proposed. Based on the spinning process test, the ultimate thinning rate of the method is explored and the evolution of the surface microstructure was analyzed by metallographic microscope. The research suggests that the multi-pass, medium–small, and thinning amount of spinning causes the grain structure to be elongated in the axial and tangential directions, and then refined, and the axial fiber uniformity is improved. The research results have certain scientific significance for reducing the consumption of high-performance metals improving material utilization and performance, which also promote the development of ultrafine-grain metals’ preparation technology.

High-Performance Image Filters via Sparse Approximations

2020 ◽  
Vol 3 (2) ◽  
pp. 1-19
Author(s):  
Kersten Schuster ◽  
Philip Trettner ◽  
Leif Kobbelt
Keyword(s):  
High Performance ◽  
Hardware Acceleration ◽  
Optimization Method ◽  
Translation Invariant ◽  
Approximation Quality ◽  
Trade Offs ◽  
Sparse Approximations ◽  
Image Filters ◽  
Good Trade ◽  
And Performance

We present a numerical optimization method to find highly efficient (sparse) approximations for convolutional image filters. Using a modified parallel tempering approach, we solve a constrained optimization that maximizes approximation quality while strictly staying within a user-prescribed performance budget. The results are multi-pass filters where each pass computes a weighted sum of bilinearly interpolated sparse image samples, exploiting hardware acceleration on the GPU. We systematically decompose the target filter into a series of sparse convolutions, trying to find good trade-offs between approximation quality and performance. Since our sparse filters are linear and translation-invariant, they do not exhibit the aliasing and temporal coherence issues that often appear in filters working on image pyramids. We show several applications, ranging from simple Gaussian or box blurs to the emulation of sophisticated Bokeh effects with user-provided masks. Our filters achieve high performance as well as high quality, often providing significant speed-up at acceptable quality even for separable filters. The optimized filters can be baked into shaders and used as a drop-in replacement for filtering tasks in image processing or rendering pipelines.

scholarly journals Low-Process–Voltage–Temperature-Sensitivity Multi-Stage Timing Monitor for System-on-Chip Applications

Electronics ◽  
2021 ◽  
Vol 10 (13) ◽  
pp. 1587
Author(s):  
Duo Sheng ◽  
Hsueh-Ru Lin ◽  
Li Tai
Keyword(s):  
High Performance ◽  
Power Reduction ◽  
System On Chip ◽  
Timing Information ◽  
Multi Stage ◽  
Dynamic Voltage ◽  
And Performance ◽  
On Chip ◽  
Maximum Measurement ◽  
Maximum Measurement Error

High performance and complex system-on-chip (SoC) design require a throughput and stable timing monitor to reduce the impacts of uncertain timing and implement the dynamic voltage and frequency scaling (DVFS) scheme for overall power reduction. This paper presents a multi-stage timing monitor, combining three timing-monitoring stages to achieve a high timing-monitoring resolution and a wide timing-monitoring range simultaneously. Additionally, because the proposed timing monitor has high immunity to the process–voltage–temperature (PVT) variation, it provides a more stable time-monitoring results. The time-monitoring resolution and range of the proposed timing monitor are 47 ps and 2.2 µs, respectively, and the maximum measurement error is 0.06%. Therefore, the proposed multi-stage timing monitor provides not only the timing information of the specified signals to maintain the functionality and performance of the SoC, but also makes the operation of the DVFS scheme more efficient and accurate in SoC design.

scholarly journals Ship Handling in Unprotected Waters: A Review of New Technologies in Escort Tugs to Improve Safety

2021 ◽  
Vol 2 (1) ◽  
pp. 46-62
Author(s):  
Santiago Iglesias-Baniela ◽  
Juan Vinagre-Ríos ◽  
José M. Pérez-Canosa
Keyword(s):  
High Performance ◽  
New Technologies ◽  
Weather Conditions ◽  
Hull Form ◽  
Best Available Technologies ◽  
Adverse Weather Conditions ◽  
Adverse Weather ◽  
New Type ◽  
Technological Challenge ◽  
And Performance

It is a well-known fact that the 1989 Exxon Valdez disaster caused the escort towing of laden tankers in many coastal areas of the world to become compulsory. In order to implement a new type of escort towing, specially designed to be employed in very adverse weather conditions, considerable changes in the hull form of escort tugs had to be made to improve their stability and performance. Since traditional winch and ropes technologies were only effective in calm waters, tugs had to be fitted with new devices. These improvements allowed the remodeled tugs to counterbalance the strong forces generated by the maneuvers in open waters. The aim of this paper is to perform a comprehensive literature review of the new high-performance automatic dynamic winches. Furthermore, a thorough analysis of the best available technologies regarding towline, essential to properly exploit the new winches, will be carried out. Through this review, the way in which the escort towing industry has faced this technological challenge is shown.

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