TCAD simulation for capture / emission of carriers by traps in SiN: trap-assisted tunneling model extended for capture of carriers injected via Fowler-Nordheim tunneling

We propose the novel trap-assisted tunneling (TAT) model that incorporates the ability to calculate dissipation of the kinetic energy of carriers propagating in the conduction or valence band. The proposed model allows us to evaluate capture efficiency (or the capture cross section) of carriers injected into the SiN charge trap layer via Fowler-Nordheim tunneling. By applying our TAT model to large planar Metal-Oxide-Nitride-Oxide-Semiconductor (MONOS) capacitors, experimental data showing that electron capture efficiency depends on the tunnel oxide thickness are physically interpreted. Furthermore, 3-dimensional technology computer-aided design (TCAD) simulation using SiN trap parameters roughly extracted from planar MONOS data shows that the calculated incremental step pulse programming characteristics of the charge trap memory (CTM) prototype device are comparable with measured data. We have found that additional time to calculate SiN trap charges is less than only 5 % of all remaining calculation time.

Improvement of the Charge Retention of a Non-Volatile Memory by a Bandgap-Engineered Charge Trap Layer

In recent years, research based on HfO2 as a charge trap memory has become increasingly popular. This material, with its advantages of moderate dielectric constant, good interface thermal stability and high charge trap density, is currently gaining in prominence in the next generation of nonvolatile memory devices. In this study, memory devices based on a-IGZO thin-film transistor (TFT) with HfO2/Al2O3/HfO2 charge trap layer (CTL) were fabricated using atomic layer deposition. The effect of the Al2O3 layer thickness (1, 2, and 3 nm) in the CTL on memory performance was studied. The results show that the device with a 2-nm Al2O3 layer in the CTL has a 2.47 V memory window for 12 V programming voltage. The use of the HfO2/Al2O3/HfO2 structure as a CTL lowered the concentration of electrons near the tunnel layer and the loss of trapped electrons. At room temperature, the memory window is expected to decrease by 0.61 V after 10 years. The large storage window (2.47 V) and good charge retention (75.6% in 10 years) of the device under low-voltage conditions are highly advantageous. The charge retention of the HfO2/Al2O3/HfO2 trap layer affords a feasible method for fabricating memory devices based on a-IGZO TFT.

Contribution of Polymers to Electronic Memory Devices and Applications

Electronic memory devices, such as memristors, charge trap memory, and floating-gate memory, have been developed over the last decade. The use of polymers in electronic memory devices enables new opportunities, including easy-to-fabricate processes, mechanical flexibility, and neuromorphic applications. This review revisits recent efforts on polymer-based electronic memory developments. The versatile contributions of polymers for emerging memory devices are classified, providing a timely overview of such unconventional functionalities with a strong emphasis on the merits of polymer utilization. Furthermore, this review discusses the opportunities and challenges of polymer-based memory devices with respect to their device performance and stability for practical applications.

Temperature Impacts on Endurance and Read Disturbs in Charge-Trap 3D NAND Flash Memories

Temperature effects should be well considered when designing flash-based memory systems, because they are a fundamental factor that affect both the performance and the reliability of NAND flash memories. In this work, aiming to comprehensively understanding the temperature effects on 3D NAND flash memory, triple-level-cell (TLC) mode charge-trap (CT) 3D NAND flash memory chips were characterized systematically in a wide temperature range (−30~70 °C), by focusing on the raw bit error rate (RBER) degradation during program/erase (P/E) cycling (endurance) and frequent reading (read disturb). It was observed that (1) the program time showed strong dependences on the temperature and P/E cycles, which could be well fitted by the proposed temperature-dependent cycling program time (TCPT) model; (2) RBER could be suppressed at higher temperatures, while its degradation weakly depended on the temperature, indicating that high-temperature operations would not accelerate the memory cells’ degradation; (3) read disturbs were much more serious at low temperatures, while it helped to recover a part of RBER at high temperatures.