Applications of polyimide coatings: a review

Polyimides, high-performance polymers with superior properties such as high temperature stability, resistance to solvents and high strength, can be used in high-tech applications of the aerospace and aviation, medical or electronics industry in different forms (film, fiber, nanofiber, membrane, foam, adhesive or coating). Among these applications, coating has a special place and is used to develop advanced structures having high temperature resistance, flame retardancy and etc. for high tech industries via an economical and feasible way. Therefore, in this review, we aimed to report the broad application status of polyimide coatings by reviewing publications, patents and commercial products. Thus, this study can assist in selecting suitable polyimide types and production methods for polyimide coating applications and in understanding their applicability for future products.

Hollow IF-MoS2/r-GO Nanocomposite Filled Polyimide Coating with Improved Mechanical, Thermal and Tribological Properties

Polyimide (PI) is one of the most excellent polymers for coating. However, the high friction coefficient and the high wear rate of pure PI limit its further applications. In this work, the hollow inorganic fullerene-like MoS2/reduced graphene oxide (HIF-MoS2/r-GO) nanocomposite filled PI coating is prepared by in situ polymerization. Reinforcement in mechanical strength and thermal stability is realized on the PI composite coating with incorporation of HIF-MoS2/r-GO, which performs better than carbon nanofiber (CNF). Reduced elastic modulus and hardness of HIF-MoS2/r-GO/PI coating is increased by 8.3% and 4.8%, respectively. The addition of HIF-MoS2/r-GO also results in 24% higher residual mass at 800 °C than CNF. Tribological study indicates that, HIF-MoS2/r-GO/PI achieves a wear rate reduction of 79% compared with pure PI under dry sliding condition, which is much more effective than other nanofillers including CNF, r-GO nanosheets and MoS2 nanoparticles. Under ionic liquid-lubricated condition, the presence of HIF-MoS2/r-GO in PI results in a 30% reduction in wear rate and 10% reduction in friction coefficient as compared to pure PI. It is thought that the HIF-MoS2/r-GO in PI can be slowly released to the frictional interface and form a protective film during sliding, in this way the aggregation problem is successfully solved.

Wirebond Process Improvement through Silicon Die Polyimide Removal

This study aims to develop polyimide etching process on the silicon die after decapsulation to resolve the wire shear issue during ball shear data gatherings. The shear strength of the ball is affected by the presence of polyimide insulator during ball shearing process, due to the polyimide layer of the silicon die being coplanar with the ball height of the wire. Experimentation and statistical analysis were done on units with and without polyimide coating, with Sodium Hydroxide (NaOH) used to remove the excess polyimide. Results revealed that silicon dice without polyimide coating resulted to better reading in terms of ball shear.