secondary bonding
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Polymers ◽  
2021 ◽  
Vol 13 (23) ◽  
pp. 4103
Author(s):  
Evanthia J. Pappa ◽  
James A. Quinn ◽  
James J. Murray ◽  
James R. Davidson ◽  
Conchúr M. Ó Brádaigh ◽  
...  

In this study, two types of single polymer films have been inserted in a composite laminate to examine their toughening effects on mechanical properties. The first is a thermoplastic polyurethane (PU) film, and the second is an adhesive epoxy film featuring a polyester net. The laminates were manufactured either using a co-curing (CC) process or a secondary bonding (SB) process used for the epoxy film. Mode I and mode II interlaminar fracture toughness were measured for laminates manufactured by both processes and compared with the corresponding reference laminate toughness. A significant increase in both mode I and mode II toughness resulted when introducing a single PU film, approximately 290% and 50%, respectively. Similarly, the epoxy film improved the interlaminar fracture properties; the CC process produced an increase of 175% for mode II toughness, while the SB adhesive film showed an increase of 75% for mode II toughness.


2021 ◽  
pp. 2104039
Author(s):  
Zhongli Hu ◽  
Xiaolin Zhao ◽  
Zhenzhu Li ◽  
Sha Li ◽  
Pengfei Sun ◽  
...  

2021 ◽  
Vol 5 (9) ◽  
pp. 225
Author(s):  
Thomas Noble ◽  
James R. Davidson ◽  
Christophe Floreani ◽  
Ankur Bajpai ◽  
William Moses ◽  
...  

Large composite structures manufactured out-of-autoclave require the assembly and bonding of multiple parts. A one-shot cure manufacturing method is demonstrated using powder epoxy. Lap shear plates were manufactured from powder epoxy and glass fiber-reinforced plastic with four different bonding cases were assessed: secondary bonding using standard adhesive film, secondary bonding using powder epoxy, co-curing, and co-curing plus a novel Z-pinning method. This work investigates the lap shear strength of the four cases in accordance with ISO 4587:2003. Damage mechanisms and fracture behavior were explored using digital image correlation (DIC) and scanning electron microscopy (SEM), respectively. VTFA400 adhesive had a load at break 24.8% lower than secondary bonding using powder epoxy. Co-curing increased the load at break by 7.8% compared to powder epoxy secondary bonding, with the co-cured and pinned joint resulting in a 45.4% increase. In the co-cured and co-cured plus pinned cases, DIC indicated premature failure due to resin spew. SEM indicated shear failure of resin areas and a large amount of fiber pullout in both these cases, with pinning delaying fracture phenomena resulting in increased lap joint strength. This highlights the potential of powder epoxy for the co-curing of large composite structures out-of-autoclave.


2021 ◽  
pp. 002199832110420
Author(s):  
Mert Akin ◽  
Cagri Oztan ◽  
Rahmi Akin ◽  
Victoria Coverstone ◽  
Xiangyang Zhou

Co-curing holds great promise to minimize assembly weight, time, and cost for stiffened aerospace structures, which are conventionally fabricated separately and then integrated either through mechanical fastening or adhesive bonding—also known as secondary bonding. This study presented a low-cost co-curing process using VARTM to fabricate stiffened shells, particularly composite box beams. The experimental investigation was performed and the co-curing process was improved by scrutinizing the critical process parameters, such as foam strength and coating, and curing cycle. This work was also intended to present the demonstration of the proposed co-curing method and its comparison with the conventional secondary bonding technique for three-cell carbon fiber-reinforced polymer (CFRP) composite box beams. Fiber volume fraction measurements were carried out to the specimens extracted from the various section of the co-cured part, namely top skin, web, and bottom skin and as a result, around 60% of fiber volume fraction was measured, which was in good agreement with the results obtained from optical microscopy-based image analysis. Structural-level four-point bending test results showed that the weight normalized maximum and the ultimate load of the part increased by 44% and 45% with the use of the co-curing process, respectively. The improved mechanical properties indicated that stronger structural integration can be achieved by integrally curing structures. SEM micrographs revealed a favorable fiber-matrix interface, bolstering the superior integration of the co-cured part. These findings suggest that the low-cost co-curing process can be a potential candidate for the fabrication of stiffened aerospace structures, such as composite box beams.


Crystals ◽  
2021 ◽  
Vol 11 (4) ◽  
pp. 433
Author(s):  
Edward R. T. Tiekink

The Cambridge Structural Database was surveyed for crystals featuring I⋯Br secondary-bonding in their supramolecular assemblies occurring independently of other obvious supramolecular synthons and devoid of other halogen bonding interactions. In all, 41 crystals satisfied these criteria, with nine examples of zero-dimensional aggregation (uniformly two-molecule aggregates) and 30 one-dimensional chains of varying topology (linear, zigzag and helical). There is one example each of two- and three-dimensional patterns. Type-I, type-II and intermediate bonding situations are apparent; for type-II bonding, the ratio of iodide:bromide functioning as the electrophile is 2:1. Most molecules participated, on average, in one I⋯Br contact, although smaller numbers of half (zero-dimensional) or two contacts (two- and three-dimensional) were observed. The propensity of the formation of related halogen bonding interactions in congeners of the 41 investigated crystals was also studied. Congeners were apparent for 11 crystals, with seven of these exhibiting isostructural relationships, in terms of space-group symmetry and unit-cell parameters. Isostructural relationships do not ensure the formation of analogous aggregation patterns, particularly and in accord with expectation, for the lighter halides. When formed, often distinct aggregation patterns are observed despite the isostructural relationships. Hetero-atomic halogen bonding offers surprises and opportunities in crystal engineering endeavours.


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