multiple length scale
Recently Published Documents


TOTAL DOCUMENTS

39
(FIVE YEARS 6)

H-INDEX

13
(FIVE YEARS 0)



Author(s):  
Hong-Yu Yang ◽  
Yi-Fan Yan ◽  
Tian-Shu Liu ◽  
Bai-Xin Dong ◽  
Liang-Yu Chen ◽  
...  


CIRP Annals ◽  
2021 ◽  
Author(s):  
Volodymyr Bushlya ◽  
Filip Lenrick ◽  
Axel Bjerke ◽  
Hisham Aboulfadl ◽  
Mattias Thuvander ◽  
...  


2021 ◽  
pp. 152876
Author(s):  
Ming Jiang ◽  
Adel El-Turke ◽  
Georgi Lolov ◽  
Kavin Ammigan ◽  
Patrick Hurh ◽  
...  


2021 ◽  
Vol 12 (1) ◽  
Author(s):  
Thomas A. Dixon ◽  
Thomas C. Williams ◽  
Isak S. Pretorius

AbstractThe practices of synthetic biology are being integrated into ‘multiscale’ designs enabling two-way communication across organic and inorganic information substrates in biological, digital and cyber-physical system integrations. Novel applications of ‘bio-informational’ engineering will arise in environmental monitoring, precision agriculture, precision medicine and next-generation biomanufacturing. Potential developments include sentinel plants for environmental monitoring and autonomous bioreactors that respond to biosensor signaling. As bio-informational understanding progresses, both natural and engineered biological systems will need to be reimagined as cyber-physical architectures. We propose that a multiple length scale taxonomy will assist in rationalizing and enabling this transformative development in engineering biology.



Soft Matter ◽  
2020 ◽  
Vol 16 (24) ◽  
pp. 5718-5726
Author(s):  
Sai Tang ◽  
Zhijun Wang ◽  
Jincheng Wang ◽  
Kai Jiang ◽  
Chaoping Liang ◽  
...  

Formation of quasicrystal structures has always been mysterious since the discovery of these magic structures.



2019 ◽  
Vol 16 (51) ◽  
pp. 83-93 ◽  
Author(s):  
Danijel Gostovic ◽  
Kathryn A. O'Hara ◽  
Nicholas J. Vito ◽  
E. D. Wachsman ◽  
Kevin S. Jones


Author(s):  
C. S. Bonifacio ◽  
P. Nowakowski ◽  
M. L. Ray ◽  
P. E. Fischione ◽  
C. Downing

Abstract Failure analysis of advanced semiconductor devices demands fast and accurate examination from the bulk to the specific area of the defect. Consequently, nanometer resolution and below is critical for finding defects. This work presents the use of argon ion milling methods for multiple length scale sample preparation, micrometer to sub-ångström, without sample preparation- induced artifacts for correlative SEM and TEM failure analysis. The result is an accurately delayered sample from which electron-transparent TEM specimens of less than 20 nm are obtained.



Sign in / Sign up

Export Citation Format

Share Document