Effect of Space Gaseous Environment on the Thermophysical Properties of Materials and Structures

Author(s):  
E. Litovsky ◽  
J. I. Kleiman ◽  
N. Menn
Author(s):  
A. D. Loskutova ◽  
A. P. Korolev

The analysis of properties of thermosensitive elements used in devices for monitoring the temperature and thermophysical properties of the medium and materials is carried out. Thermal converters made of various materials are considered: metals, semiconductors, oxides. The sensitivity to infrared radiation of the considered elements is analyzed. The range of measured temperatures and the linearity of the output characteristics of the converters are investigated. A conclusion is made about the purposefulness of using one or another type of thermosensitive elements.


1973 ◽  
Vol 24 (6) ◽  
pp. 721-725
Author(s):  
Yu. V. Bol'shakov ◽  
L. L. Vasil'ev ◽  
F. M. Pozvonkov

Author(s):  
Ishan Srivastava ◽  
Timothy S. Fisher ◽  
Sudheera Fernando ◽  
Ann Christine Catlin ◽  
Puneet Gupta ◽  
...  

New data for thermophysical properties of materials are being discovered and measured routinely throughout the world, but sometimes conflicts exist in the published data from various sources. We introduce an online thermal properties database intended for use as a repository for experimentally obtained thermophysical properties of materials by researchers across the globe. This online database is a part of www.thermalhub.org, which is a NSF-funded cyber infrastructure initiative aimed at serving the global heat transfer community. The relevant details associated with an experiment, such as the material type and composition, the thermophysical property measured, the test methods employed, the test conditions of the experiment, the results of the experiments, the uncertainty associated with the experimental results, and the literature where the results are published, are included as fields in the online database. It is known that one thermophysical property can be tested by various methods whose results may differ. Similarly, one thermophysical property can be experimentally measured under varying test conditions to produce different results.


2009 ◽  
Vol 24 (7) ◽  
pp. 2449-2452 ◽  
Author(s):  
Jianqiang Li ◽  
Takehiko Ishikawa ◽  
Junpei T. Okada ◽  
Yuki Watanabe ◽  
Jianding Yu ◽  
...  

The knowledge of thermophysical properties of active metals is critical to understand their metallurgical processes and further industrial applications. However, due to high reactivity and melt contamination from a crucible and gaseous environment, accurate values of the properties are hard to obtain using conventional methods such as the sessile-drop method. In the present study, a vacuum electrostatic levitator was used to circumvent these difficulties and enabled the noncontact determination of thermophysical properties of liquid cerium even in an undercooled state. The data of density, surface tension, and viscosity of molten cerium were reported, as well as their temperature dependence.


2020 ◽  
Vol 6 (2) ◽  
pp. 127-136
Author(s):  
Ihor Vasylkivskyi ◽  
◽  
Vasyl Fedynets ◽  
Yaroslav Yusyk

The article presents the designs of a number of devices for measuring the thermal conductivity of solids developed using the new methodological approaches proposed by the authors, which enable measurements in a wide range of thermal conductivity values with better accuracy. The proposed approaches rely on the principle of invariance, which consists in ensuring the compensation of the effect of various non-informative parameters on the measurement result. For calculating the developed thermometric bridge circuits (balanced, unbalanced and partially balanced), there was applied the theory of thermal circuits based on the similarity between heat transfer and electricity transfer. The design of thermometric devices based on thermometric bridge circuits makes it possible to raise significantly the accuracy of measuring thermophysical properties of materials due to the reduced errors stemming from the effect of non-informative parameters on the measurement result. This, in turn, allowed the extended measurement range for the thermal conductivity, increased reliability and reduced cost of the devices owing to the simplified measuring circuit.


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