Depth Profiling Biaxial Stresses in Sputter Deposited Molybdenum Films; Use of the Cos2ϕ Method

1997 ◽  
pp. 363-370 ◽  
Author(s):  
B. L. Ballard ◽  
P. K. Predecki ◽  
T. R. Watkins ◽  
K. J. Kozaczek ◽  
D. N. Braski ◽  
...  
1991 ◽  
Vol 237 ◽  
Author(s):  
R. M. Walser ◽  
Byung-Hak Lee ◽  
Alaka Valanju ◽  
Winston Win ◽  
M. F. Becker

ABSTRACTWe report the first kinetic study of metal-semiconductor interface reactions using in-situ, time resolved, laser interferometry. Diffusion couples with Co/Ge thicknesses of 1500 Å/1500 Å were sputter deposited on silicon wafers, and vacuum-annealed at temperatures between 300°C-400°C. Under these conditions polycrystalline CoGe was expected to form [1]. Real time laser (HeNe 6328 Å) interferograms for each anneal were recorded in-situ. These data were supplemented by information from AES and X-ray.For temperatures below 400°C the diffusion controlled formation of CoGe was observed. The composition was confirmed by Auger depth profiling that showed uniform Co and Ge concentrations when the reaction went to completion. The well defined interferences fringes were formed by the dissolution of amorphous Ge. The activation energy = 1.6 eV for the formation of CoGe were determined with precision from the temperature dependence of the time required to anneal the fixed λ/4 distance between adjacent minima and maxima of the interferogram. We discuss the evidence for formation of an intermediate Co-rich compound following the initial diffusion of Co into Ge. The results of these experiments indicate that optical interferometry will be a valuable adjunct to other techniques used to study metal-semiconductor interface reactions.


BIBECHANA ◽  
2021 ◽  
Vol 18 (1) ◽  
pp. 201-213
Author(s):  
Jagadish Bhattarai

Non-destructive in-depth analysis of the surface films formed on the sputter-deposited binary W-xCr (x = 25, 57, 91 at %) alloys in 12 M HCl solution open to air at 30 °C was investigated using an angle-resolved X-ray photoelectron spectroscopic (AR-XPS) technique to understand the synergistic corrosion resistance effects of showing very low corrosion rates, even lower than both alloying metals of the deposits. The average corrosion rates of these three tungsten-based sputter deposits found to be more than five orders of magnitude (between 3.1 × 10−3 and 7.2 × 10−3 mm/y) to that of chromium and also nearly one order of magnitude lower than that of tungsten metals. Such high corrosion resistance of the sputter-deposited W-xCr alloys is due to the formation of homogeneous passive double oxyhydroxide film consisting of Wox and Cr4+ cations without any concentration gradient in-depth after immersion in 12 M HCl solution open to air at 30 °C from the study of the non-destructive depth profiling technique of AR-XPS. Consequently, both alloying elements of tungsten and niobium are acted synergistically in enhancing high corrosion resistance properties of the alloys in such aggressive electrolyte. BIBECHANA 18 (2021) 201-213


1989 ◽  
Vol 170 ◽  
Author(s):  
A. Joshl ◽  
H. S. Hu ◽  
J. Wadsworth

AbstractRecent interest in the development of advanced metal matrix composites has prompted research on interfacial reactions of Nb and Ta with candidate reinforcements such as silicon carbide and alumina. Formation of reaction layers as small as 0.1 μm can be detrimental to composite strength and ductility and in some instances to the corrosion behavior, which suggests the importance of understanding the early stages of interfacial reactions. Thin films of Nb and Ta were sputter deposited on single crystal and polycrystalline silicon carbide and on sapphire substrates, and the nature and extent of reaction evahiated using Auger depth profiling and electron microscopy. In the Nb/SiC system, NbCX is the first reaction product to form, but the overall extent of the reaction is dominated by the formation of the more stable NbCXSiY ternary phase. Little or no interfacial reaction was observed in the Nb/Al2O3 system for up to 4 hburs at 1100°C, which also suggests that Al2O3 may be a potential diffusion barrier to minimize reactions in the Nb/SiC system. Similar interesting observations were made in the Ta/SiC and Ta/Al2O3 systems.


1989 ◽  
Vol 163 ◽  
Author(s):  
J. Lopata ◽  
W. C. Dautremont-Smith ◽  
S. J. Pearton ◽  
J. W. Lee ◽  
N. T. Ha ◽  
...  

AbstractVarious dielectric and metallic films were examined as H-permeable surface protection layers on InP during H2 or D2 plasma exposure for passivation of acceptors in the InP. Plasma deposited SiNx, SiO2, and a-Si(H) films ranging in thickness from 85 to 225 Å were used to protect p-InP during D2 plasma exposure at 250°C. Optimum protective layer thicknesses were determined by a trade-off between the effectiveness of the layer to prevent P loss from the wafer surface and the ability to diffuse atomic H or D at a rate greater than or equal to that in the underlying InP. SIMS and capacitance-voltage depth profiling were used to determine the extent of D in-diffusion and acceptor passivation respectively. Sputter deposited W and e-beam evaporated Ti films ~100 Å thick were also evaluated. The W coated sample yielded similar results to those with dielectric films in that acceptors in p-InP were passivated to a similar depth for the same plasma exposure. The 100 Å Ti film, however, did not allow the D to diffuse into the InP substrate. It is surmised that the Ti film trapped the D, thus preventing diffusion into the substrate.


2000 ◽  
Vol 614 ◽  
Author(s):  
D. Kubinski ◽  
M. Parsons ◽  
J. Hangas

ABSTRACTSputter-deposited Co/Cu multilayers at the 1st antiferromagnetic maximum (tCu= 9Å) exhibit large magnetoresistance and low relative hysteresis and are attractive for use in many position sensor applications. Unfortunately, their large magnetoresistance values can be hard to reproduce, perhaps a consequence of the difficulties in growing flat, pin-hole free layers. In this study we demonstrate that their magnetoresistive properties can be improved with the addition O2 to the Ar sputtering gas. A sequence of [Co(15Å)/Cu(9Å)]20 multilayers were made using magnetron sputtering in a 2mTorr Ar+O2 atmosphere, with the O2 concentration ranging from <1 ppm to 10,000 ppm. For films sputtered in our purest Ar, the magnetoresistance was typically less than 10%. Adding small amounts of O2 to the Ar improved the magnetoresistance, and at 1000 ppm O2 concentration it reached an optimal value of ∼45% and was found to be quite reproducible. The largest saturation fields were also achieved at 1000 ppm O2. Increasing the O2 concentration beyond 1000 ppm degraded the magnetoresistance and reduced the saturation fields. Magnetic measurements indicate that the improved magnetoresistance for films sputtered in Ar + O2 is primarily a consequence of more complete antiferromagnetic ordering at low fields. Auger depth profiling revealed no evidence for the O2 incorporation into the films, even for those fabricated in 10,000 ppm O2. Influence of the O2 on the microstructure of the multilayers is discussed.


1995 ◽  
Vol 39 ◽  
pp. 363-370
Author(s):  
B. L. Ballard ◽  
P. K. Predecki ◽  
T. R. Watkins ◽  
K. J. Kozaczek ◽  
D. N. Braski ◽  
...  

Depth profiles of intrinsic in-plane, biaxial stresses were obtained as a function of τ, the 1/e penetration depth, in a 1.0 um thick planar d. c. magentron sputter deposited molybdenum film using asymmetric grazing incidence x-ray diffraction (GIXD). τ was varied between 20 and 276 Å. The stresses σ11 and σ22 were characterized in the directions parallel and perpendicular to the long axis of the cathode respectively using a cos2φ method. The results show that starting from τ=17Å, σ11 and σ22 are compressive and become rapidly more compressive with a minimum at τ ∼ 20 - 40 Å thereafter increasing gradually toward tensile values. The reasons for the shape of the stress gradient are not well understood but may be related to the relaxation of the stresses at the tops of the columnar Zone T-type microstructure and to the oxygen gradient in the film.


1993 ◽  
Vol 47 (1) ◽  
pp. 35-37 ◽  
Author(s):  
Emmanuel C. Onyiriuka

X-ray photoelectron spectroscopy (XPS or ESCA), combined with argonion sputter depth profiling, has been employed for the characterization of aluminum, titanium boride, and nitride films deposited by dc-magnetron sputtering from multicomponent alloy targets. The XPS results show that metallic Al, TiB2, and TiN films are formed by this method. However, depth profile results indicated substantial oxide contamination as high as 30 atomic % throughout the bulk of the films. Given the gross oxide contamination, multicomponent alloy target materials appear to be unsuitable for producing high-quality metal/metallic films for applications where electrical conductivity is a critical requirement.


1993 ◽  
Vol 308 ◽  
Author(s):  
C. Cabral ◽  
L.A. Clevenger ◽  
R.G. Schad

ABSTRACTStresses which build up in thin films, such as tantalum, during thermal processing, can cause major reliability problems in x-ray optics and electronic applications. We have demonstrated that 50 nm to 200 nm thick sputtered beta tantalum thin films undergo repeated compressive stress increases when thermally cycled from room temperature to 400°C (at 10°C/min) and back in a purified He ambient because of low levels of oxygen gettered by the tantalum. The oxygen contamination is a result of the poor quality of the quartz annealing chamber atmospheric seal. As-deposited stress in the sputter deposited tantalum films ranges from -1 to -4 GPa. The compressive stress build up was monitored in situ and was shown to increase -0.5 GPa on average after each thermal cycle for a final value of -6 to -7 GPa after seven cycles. After being cycled thermally seven times any perturbation of the film such as a four point probe resistivity measurement can cause the film to instantaneously crack in a serpentine pattern relieving the large compressive stress. Auger electron spectroscopy depth profiling analysis indicated that the as-deposited films contained one atomic percent oxygen which increased to eight to twelve percent after seven thermal cycles accompanied by an approximate doubling in resistivity. In conclusion, the increase in oxygen concentration in tantalum thin films which occurs upon thermal cycling leads to a repetitive increase in compressive stress which could be detrimental when the films are used in x-ray or electronic applications.


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