Features of the structure of a high-temperature-strength nickel alloy after liquid-phase sintering

1990 ◽  
Vol 32 (8) ◽  
pp. 618-623
Author(s):  
A. P. Gulyaev ◽  
L. P. Sergienko ◽  
A. V. Logunov ◽  
O. I. Samoilov
Author(s):  
Gareth Thomas

Silicon nitride and silicon nitride based-ceramics are now well known for their potential as hightemperature structural materials, e.g. in engines. However, as is the case for many ceramics, in order to produce a dense product, sintering additives are utilized which allow liquid-phase sintering to occur; but upon cooling from the sintering temperature residual intergranular phases are formed which can be deleterious to high-temperature strength and oxidation resistance, especially if these phases are nonviscous glasses. Many oxide sintering additives have been utilized in processing attempts world-wide to produce dense creep resistant components using Si3N4 but the problem of controlling intergranular phases requires an understanding of the glass forming and subsequent glass-crystalline transformations that can occur at the grain boundaries.


1985 ◽  
Vol 27 (10) ◽  
pp. 746-749
Author(s):  
Yu. G. Veksler ◽  
T. M. Maslakova ◽  
V. P. Lesnikov ◽  
M. V. Kukhtin ◽  
V. V. Bogaevskii

2015 ◽  
Vol 2015 (1) ◽  
pp. 000449-000452 ◽  
Author(s):  
Xiangdong Liu ◽  
Hiroshi Nishikawa

We develop a transient liquid phase sinter (TLPS) bonding using Sn-coated Cu micro-sized particles. With this bonding process, a thermally stable joint comprising Cu3Sn phase and a dispersion of ductile Cu particles can be obtained. The particle paste, which contained Cu particles with a thin Sn coating and terpineol, was used to join Cu substrates. The setup was bonded at 300 °C for 30s under an applied pressure of 10 MPa using a thermo-compression bonding system under a formic acid gas atmosphere for reducing the oxide layer on the Sn coating and the Cu substrate. After bonding, the TLPS joint showed a thermally stable microstructure with a good shear strength, which was fully consisted of Cu3Sn intermetallic compounds matrix and embedded ductile Cu particles. The kinetics of the microstructure transformation and high temperature reliability of the TLPS joint were investigated. After 300 °C isothermal aging for 200h, the shear strength and microstructure of the TLPS joints showed almost unchanged. The results demonstrate that joint with high-melting-point obtained by the TLPS bonding using Sn-coated Cu particle paste has the potential to fulfill the requirement of high temperature electronic packaging.


2003 ◽  
Vol 247 ◽  
pp. 267-270 ◽  
Author(s):  
Young Wook Kim ◽  
Shin Han Kim ◽  
Mamoru Mitomo ◽  
Toshiyuki Nishimura

Alloy Digest ◽  
1987 ◽  
Vol 36 (2) ◽  

Abstract NIMONIC Alloy 81 is a wrought nickel alloy designed to provide enhanced resistance to high-temperature corrosion coupled with good high-temperature strength. It is particularly resistant to attack by deposits of alkali metal sulfates and chlorides resulting from combustion of impure fuels. This datasheet provides information on composition, physical properties, elasticity, and tensile properties as well as creep. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, and joining. Filing Code: Ni-345. Producer or source: Inco Alloys International Inc..


2005 ◽  
Vol 498-499 ◽  
pp. 231-237
Author(s):  
M.F. Rodrigues ◽  
Guerold Sergueevitch Bobrovinitchii ◽  
Alan Monteiro Ramalho ◽  
Marcello Filgueira

Hardmetal is usually processed by the conventional powder technology techniques: mix of WC + Co powders compacted and liquid phase sintering. A new method to process hardmetal parts is hereby described. Parts of WC-15%wt Co were processed by using high pressure – high temperature sintering. It was used the pressure of 5GPa, temperatures of 780-1200-1350-1400oC, and times of 2-4 minutes of sintering. Results are shown as a function of micro-structural evolution, densification, and hardness measurements.


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