Thermal Processes and Emission of Atoms from the Liquid Phase Target Surface of a Magnetron Sputtering System

2015 ◽  
Vol 58 (4) ◽  
pp. 431-437 ◽  
Author(s):  
G. A. Bleykher ◽  
V. P. Krivobokov ◽  
A. V. Yuryeva
Vacuum ◽  
2017 ◽  
Vol 141 ◽  
pp. 135-138 ◽  
Author(s):  
Alena V. Yuryeva ◽  
Artyom S. Shabunin ◽  
Dmitry V. Korzhenko ◽  
Olga S. Korneva ◽  
Mikhail V. Nikolaev

Coatings ◽  
2021 ◽  
Vol 11 (5) ◽  
pp. 599
Author(s):  
Handan Huang ◽  
Li Jiang ◽  
Yiyun Yao ◽  
Zhong Zhang ◽  
Zhanshan Wang ◽  
...  

The laterally graded multilayer collimator is a vital part of a high-precision diffractometer. It is applied as condensing reflectors to convert divergent X-rays from laboratory X-ray sources into a parallel beam. The thickness of the multilayer film varies with the angle of incidence to guarantee every position on the mirror satisfies the Bragg reflection. In principle, the accuracy of the parameters of the sputtering conditions is essential for achieving a reliable result. In this paper, we proposed a precise method for the fabrication of the laterally graded multilayer based on a planetary motion magnetron sputtering system for film thickness control. This method uses the fast and slow particle model to obtain the particle transport process, and then combines it with the planetary motion magnetron sputtering system to establish the film thickness distribution model. Moreover, the parameters of the sputtering conditions in the model are derived from experimental inversion to improve accuracy. The revolution and rotation of the substrate holder during the final deposition process are achieved by the speed curve calculated according to the model. Measurement results from the X-ray reflection test (XRR) show that the thickness error of the laterally graded multilayer film, coated on a parabolic cylinder Si substrate, is less than 1%, demonstrating the effectiveness of the optimized method for obtaining accurate film thickness distribution.


2021 ◽  
Vol 1799 (1) ◽  
pp. 012021
Author(s):  
V A Pavlov ◽  
V I Shapovalov ◽  
D S Shestakov ◽  
A V Rudakov ◽  
A E Shabalin

2005 ◽  
Vol 200 (1-4) ◽  
pp. 1026-1030 ◽  
Author(s):  
H.Y. Lee ◽  
W.S. Jung ◽  
J.G. Han ◽  
S.M. Seo ◽  
J.H. Kim ◽  
...  

2010 ◽  
Vol 10 (3) ◽  
pp. S463-S467 ◽  
Author(s):  
Kyu Ung Sim ◽  
Seung Wook Shin ◽  
A.V. Moholkar ◽  
Jae Ho Yun ◽  
Jong Ha Moon ◽  
...  

2007 ◽  
Vol 124-126 ◽  
pp. 431-434
Author(s):  
Joon Hong Park ◽  
Sang Chul Lee ◽  
Jin Ho Lee ◽  
Pung Keun Song

Indium Tin Oxide (ITO) films were deposited on non-alkali glass substrate by magnetron sputtering using commercial ITO target (target A) and improved ITO target (target B). Depositions were carried out at total gas pressure (Ptot) of 0.5 Pa, substrate temperature (Ts) of RT ~ 300 °C, oxygen flow ratio [O2/(O2+Ar)] of 0 ~ 1.0% and dc power of 100W. Target B showed relatively higher stability in film resistivity with increasing sputtering time, i.e., erosion ratio of target surface. Optimum oxygen ratio to obtain the lowest resistivity was decreased with increasing substrate temperature. The lowest resistivity was 1.06x10-4 6cm for the film deposited using target B at O2/(O2+Ar) ratio of 0.05% and at Ts =300 °C.


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