Design of Novel SRAM Cell Using Hybrid VLSI Techniques for Low Leakage and High Speed in Embedded Memories

2019 ◽  
Vol 108 (4) ◽  
pp. 2311-2339 ◽  
Author(s):  
K. Gavaskar ◽  
U. S. Ragupathy ◽  
V. Malini
2016 ◽  
Vol 9 (45) ◽  
Author(s):  
Kanan Bala Ray ◽  
Sushanta K. Mandal ◽  
B. Shivalal Patro

2018 ◽  
Vol 8 (4) ◽  
pp. 41 ◽  
Author(s):  
Tripti Tripathi ◽  
Durg Chauhan ◽  
Sanjay Singh

The semiconductor electronic industry is advancing at a very fast pace. The size of portable and handheld devices are shrinking day by day and the demand for longer battery backup is also increasing. With these requirements, the leakage power in stand-by mode becomes a critical concern for researchers. In most of these devices, memory is an integral part and its size also scales down as the device size is reduced. So, low power and high speed memory design is a prime concern. Another crucial factor is the stability of static random-access memory (SRAM) cells. This paper combines multi threshold and fingering techniques to propose a modified 6T SRAM cell which has high speed, improved stability and low leakage current in stand-by mode of the memory cell. The simulations are done using the Cadence Virtuoso tool on UMC 55 nm technology.


2013 ◽  
Vol 1538 ◽  
pp. 291-302
Author(s):  
Edward Yi Chang ◽  
Hai-Dang Trinh ◽  
Yueh-Chin Lin ◽  
Hiroshi Iwai ◽  
Yen-Ku Lin

ABSTRACTIII-V compounds such as InGaAs, InAs, InSb have great potential for future low power high speed devices (such as MOSFETs, QWFETs, TFETs and NWFETs) application due to their high carrier mobility and drift velocity. The development of good quality high k gate oxide as well as high k/III-V interfaces is prerequisite to realize high performance working devices. Besides, the downscaling of the gate oxide into sub-nanometer while maintaining appropriate low gate leakage current is also needed. The lack of high quality III-V native oxides has obstructed the development of implementing III-V based devices on Si template. In this presentation, we will discuss our efforts to improve high k/III-V interfaces as well as high k oxide quality by using chemical cleaning methods including chemical solutions, precursors and high temperature gas treatments. The electrical properties of high k/InSb, InGaAs, InSb structures and their dependence on the thermal processes are also discussed. Finally, we will present the downscaling of the gate oxide into sub-nanometer scale while maintaining low leakage current and a good high k/III-V interface quality.


Author(s):  
Jitendra Kumar Mishra ◽  
Lakshmi Likhitha Mankali ◽  
Kavindra Kandpal ◽  
Prasanna Kumar Misra ◽  
Manish Goswami

The present day electronic gadgets have semiconductor memory devices to store data. The static random access memory (SRAM) is a volatile memory, often preferred over dynamic random access memory (DRAM) due to higher speed and lower power dissipation. However, at scaling down of technology node, the leakage current in SRAM often increases and degrades its performance. To address this, the voltage scaling is preferred which subsequently affects the stability and delay of SRAM. This paper therefore presents a negative bit-line (NBL) write assist circuit which is used for enhancing the write ability while a separate (isolated) read buffer circuit is used for improving the read stability. In addition to this, the proposed design uses a tail (stack) transistor to decrease the overall static power dissipation and also to maintain the hold stability. The comparison of the proposed design has been done with state-of-the-art work in terms of write static noise margin (WSNM), write delay, read static noise margin (RSNM) and other parameters. It has been observed that there is an improvement of 48%, 11%, 19% and 32.4% in WSNM while reduction of 33%, 39%, 48% and 22% in write delay as compared to the conventional 6T SRAM cell, NBL, [Formula: see text] collapse and 9T UV SRAM, respectively.


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