Temperature field evolution and heat transfer during continual local induction cladding

2020 ◽  
Vol 27 (5) ◽  
pp. 1572-1586
Author(s):  
Si-yu Liu ◽  
Xun-peng Qin ◽  
Jin-peng Zhang ◽  
Jun Zhan
Keyword(s):  
Heat Transfer ◽  
Temperature Field ◽  
Field Evolution

TEMPERATURE FIELD AND HEAT TRANSFER IN LOW REYNOLDS FLOWS INSIDE TRAPEZOIDAL-PROFILED CORRUGATED-PLATE CHANNELS

2015 ◽  
Vol 22 (4) ◽  
pp. 329-343 ◽  
Author(s):  
Jozef Cernecky ◽  
Jan Koniar ◽  
Lukas Ohanka ◽  
Zuzana Brodnianska
Keyword(s):  
Heat Transfer ◽  
Temperature Field ◽  
Low Reynolds

Numerical Simulation of Solidification Process for a Machine Tool Bed

2011 ◽  
Vol 675-677 ◽  
pp. 987-990
Author(s):  
Ling Tang ◽  
Xu Dong Wang ◽  
Hai Jing Zhao ◽  
Man Yao
Keyword(s):  
Heat Transfer ◽  
Temperature Field ◽  
Temperature Distribution ◽  
Machine Tool ◽  
Computation Time ◽  
Solidification Process ◽  
Field Calculation ◽  
Original Design ◽  
Calculation Results ◽  
Improved Design

In this paper, the flow, heat transfer and stress during solidification process of the machine tool bed weighed about 2.5ton that has been optimized by structural topologymethod, was calculated with ProCAST software, and the causes of the crack forming in the casting of the machine tool bed was analysed. According to the calculation results, the structural design of the local part where cracks tends to form has been improved, and the heat transfer and the stress are calculated again. By comparing the temperature field with filling of molten cast iron and without filling, it has been found that there was little effect of filling on the results of temperature distribution of the cast, therefore the effect of filling can be ignored in the following temperature field calculation to save computation time. The model has been simplified in the stress field calculation with considering the complexity of the machine tool bed and the cost of computation. Then, the merits and demerits of the original design and the improved design are compared and analyzed depending on the calculated temperature and stress results. It is suggested that the improved one could get a more uniform temperature distribution and then the trend of the crack occurring can be greatly reduced. These results could provide a guide for the actual casting production, achieving the scientific control of the production of castings, ensuring the quality of the castings.

ANALYSIS OF METHODS FOR CALCULATING HEAT TRANSFER IN THERMOELECTRIC COOLING SYSTEMS FOR HEAT-STRESSED ELEMENTS

2021 ◽  
pp. 21-31
Author(s):  
С.В. Бородкин ◽  
А.В. Иванов ◽  
И.Л. Батаронов ◽  
А.В. Кретинин
Keyword(s):  
Heat Transfer ◽  
Temperature Field ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
Cooling System ◽  
Average Heat Transfer Coefficient ◽  
The Finite Element Method ◽  
Differential Heat ◽  
Average Heat ◽  
Principal Possibility

На основе уравнений теплопереноса в движущейся среде и соотношений теплопередачи в термоэлектрическом охладителе приведен сравнительный анализ методик расчета поля температуры в теплонапряженном элементе. Рассмотрены методики на основе: 1) теплового баланса, 2) среднего коэффициента теплоотдачи, 3) дифференциального коэффициента теплоотдачи, 4) прямого расчета в рамках метода конечных элементов. Установлено, что первые две методики не дают адекватного распределения поля температур, но могут быть полезны для определения принципиальной возможности заданного охлаждения с использованием термоэлектрических элементов. Последние две методики позволяют корректно рассчитать температурное поле, но для использования третьей методики необходим дифференциальный коэффициент теплоотдачи, который может быть найден из расчета по четвертой методике. Сделан вывод о необходимости комбинированного использования методик в общем случае. Методы теплового баланса и среднего коэффициента теплоотдачи позволяют определить принципиальную возможность использования термоэлектрического охлаждения конкретного теплонапряженного элемента (ТЭ). Реальные параметры системы охлаждения должны определяться в рамках комбинации методов дифференциального коэффициента теплоотдачи и конечных элементов (МКЭ). Первый из них позволяет определить теплонапряженные области и рассчитать параметры системы охлаждения, которые обеспечивают тепловую разгрузку этих областей. Второй метод используется для проведения численных экспериментов по определению коэффициента теплоотдачи реальной конструкции The article presents on the basis of the equations of heat transfer in a moving medium and the relations of heat transfer in a thermoelectric cooler, a comparative analysis of methods for calculating the temperature field in a heat-stressed element. We considered methods based on: 1) heat balance, 2) average heat transfer coefficient, 3) differential heat transfer coefficient, 4) direct calculation using the finite element method. We established that the first two methods do not provide an adequate distribution of the temperature field but can be useful for determining the principal possibility of a given cooling using thermoelectric elements. The last two methods allow us to correctly calculate the temperature field; but to use the third method, we need a differential heat transfer coefficient, which can be found from the calculation using the fourth method. We made a conclusion about the need for combined use of methods in a general case. The methods of thermal balance and average heat transfer coefficient allow us to determine the principal possibility of using thermoelectric cooling of a specific heat-stressed element. The actual parameters of the cooling system should be determined using a combination of the differential heat transfer coefficient and the finite element method. The first of them allows us to determine the heat-stressed areas and calculate the parameters of the cooling system that provide thermal discharge of these areas. The second method is used to perform numerical experiments to determine the heat transfer coefficient of a real structure

Analytical Modeling of Temperature Distribution in Interposer-Based Microelectronic Systems

2013 ◽  
Author(s):  
Leila Choobineh ◽  
Dereje Agonafer ◽  
Ankur Jain
Keyword(s):  
Heat Transfer ◽  
Finite Element ◽  
Temperature Field ◽  
Temperature Distribution ◽  
Analytical Modeling ◽  
Three Dimensional ◽  
Heat Transfer Process ◽  
Thermal Design ◽  
Research Attention ◽  
On Chip

Heterogeneous integration in microelectronic systems using interposer technology has attracted significant research attention in the past few years. Interposer technology is based on stacking of several heterogeneous chips on a common carrier substrate, also referred to as the interposer. Compared to other technologies such as System-on-Chip (SoC) or System-in-Package (SiP), interposer-based integration offers several technological advantages. However, the thermal management of an interposer-based system is not well understood. The presence of multiple heat sources in various die and the interposer itself needs to be accounted for in any effective thermal model. While a finite-element based simulation may provide a reasonable temperature prediction tool, an analytical solution is highly desirable for understanding the fundamentals of the heat transfer process in interposers. In this paper, we describe our recent work on analytical modeling of heat transfer in interposer-based microelectronic systems. The basic governing energy conservation equations are solved to derive analytical expressions for the temperature distribution in an interposer-based microelectronic system. These solutions are combined with an iterative approach to provide the three-dimensional temperature field in an interposer. Results are in excellent agreement with finite-element solutions. The analytical model is utilized to study the effect of various parameters on the temperature field in an interposer system. Results from this work may be helpful in the thermal design of microelectronic systems containing interposers.

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