Impaction of thin films from polar solvent Si/SiOx nanoparticle inks

2020 ◽  
Vol 17 (6) ◽  
pp. 1489-1495
Author(s):  
Sergei S. Bubenov ◽  
Sergey G. Dorofeev ◽  
Vadim M. Popelensky ◽  
Nikolay N. Kononov ◽  
Tatyana A. Kuznetsova
Nano Energy ◽  
2020 ◽  
Vol 67 ◽  
pp. 104207 ◽  
Author(s):  
Wan Sik Kim ◽  
Gopinathan Anoop ◽  
Il-Seok Jeong ◽  
Hye Jeong Lee ◽  
Hyun Bin Kim ◽  
...  

2021 ◽  
Author(s):  
Al Amin Ahmed Simon

Performance of any sensor in a nuclear reactor involves reliable operation under a harsh environment (i.e., high temperature, neutron irradiation, and a high dose of ionizing radiation). In this environment, accurate and continuous monitoring of temperature is critical for the reactor's stability and proper functionality. Furthermore, during the development and testing stages of new materials and structural components for these systems, it is imperative to collect in-situ measurement data about the exact test conditions for real-time analysis of their performance. To meet the compelling need of such sensing devices, we propose radiation-hard temperature sensors based on the phase change phenomenon of chalcogenide glasses. The primary goal is to resolve the monitoring of the cladding temperature of light water and metallic or ceramic sodium-cooled fast reactors within a temperature range of 400°C to 600°C. This work is focused on studies of Ge-Se(S) chalcogenide glasses that have crystallization temperatures in this range. Each chalcogenide glass transforms and becomes crystalline at a specific heating rate at a definite temperature. As a result of this, both the electrical resistance and optical properties of the materials change. As this is the first time such devices have been fabricated, this work submits new data regarding materials research, various device structures, fabrication, performance, and testing under irradiation. The application of these materials in devices usually involves the formation of a thin film that works as an active layer. Traditionally, thin films are prepared by thermal evaporation, sputtering or chemical vapor deposition and they require high vacuum machinery and patterning applying photolithography. To avoid using such heavy machinery and costly fabrication processes, we investigate the formulation of nanoparticle inks of chalcogenide glasses, the formation of printed thin films using the inks, low-cost sintering and demonstrate their application in electronic and photonic sensors utilizing their phase transition effects. The printed chalcogenide glass films showed similar structural, electronic and optical properties as the thermally evaporated films. The newly developed process steps reported in this work describe chalcogenide glasses nanoparticle inks formulation, their application by inkjet printing and dip-coating methods and sintering to fabricate phase change temperature sensors. To interpret and predict the printed films' performance, Raman spectroscopy, X-ray Diffraction Spectroscopy, Energy Dispersion Spectroscopy, Atom Force Microscopy, temperature dependent Ellipsometry, and other methods are used. An essential part of materials' behavior is related to the materials' and devices' response to ion beam irradiation. Both experimental data and simulation are analyzed to study the effect of irradiation. Based on the different working principles, electrical, optical and plasmonic temperature sensors are investigated. An array of optical fiber devices fabricated with different chalcogenide glasses is shown to perform a real-time temperature reading. This work could be used as a paradigm for sensor fabrication and testing for high radiation environments and nanoparticle inks of chalcogenide glasses formulation and their application by inkjet printing and dip-coating. The most novel outcome of this work adds chalcogenide glasses to the list of inkjet printable materials, thus opening up an opportunity to achieve arbitrary structures for optical and electronic applications without photolithography.


RSC Advances ◽  
2015 ◽  
Vol 5 (71) ◽  
pp. 57550-57558 ◽  
Author(s):  
Qiong Nian ◽  
Martin Y. Zhang ◽  
Dong Lin ◽  
Suprem Das ◽  
Yung C. Shin ◽  
...  

Direct pulsed laser crystallization (DPLC) is explored to rapidly crystallize large area coated copper indium diselenide (CIS) nanoparticle-inks.


2019 ◽  
Vol 674 ◽  
pp. 12-21 ◽  
Author(s):  
Narges Ataollahi ◽  
Claudia Malerba ◽  
Elisa Cappelletto ◽  
Regina Ciancio ◽  
Raju Edla ◽  
...  

2012 ◽  
Vol 501 ◽  
pp. 252-256 ◽  
Author(s):  
Zurianti A. Rahman ◽  
Khaulah Sulaiman ◽  
Ahmad Shuhaimi ◽  
Mohamad Rusop

Two types of polar solvent materials; namely glycerol and ethylene glycol (EG) were used in this study as dopants for PEDOT:PSS. The 2 to 10% of doped PEDOT:PSS were synthesized using sol-gel technique and were spin-coated onto glass substrate. The optical, conductivity and morphological characteristics of the doped PEDOT:PSS thin films were measured via UV-VIS spectrometer, two-point probes technique and AFM measurement, respectively. All films show direct band gap behavior and compared to the pristine thin film, the doped PEDOT:PSS show higher transparency in visible range. Furthermore, the conductivity of glycerol and EG doped PEDOT:PSS thin films were also improved due to the changes in molecule alignment and interchain interaction in the thin films.


Author(s):  
L.J. Chen ◽  
Y.F. Hsieh

One measure of the maturity of a device technology is the ease and reliability of applying contact metallurgy. Compared to metal contact of silicon, the status of GaAs metallization is still at its primitive stage. With the advent of GaAs MESFET and integrated circuits, very stringent requirements were placed on their metal contacts. During the past few years, extensive researches have been conducted in the area of Au-Ge-Ni in order to lower contact resistances and improve uniformity. In this paper, we report the results of TEM study of interfacial reactions between Ni and GaAs as part of the attempt to understand the role of nickel in Au-Ge-Ni contact of GaAs.N-type, Si-doped, (001) oriented GaAs wafers, 15 mil in thickness, were grown by gradient-freeze method. Nickel thin films, 300Å in thickness, were e-gun deposited on GaAs wafers. The samples were then annealed in dry N2 in a 3-zone diffusion furnace at temperatures 200°C - 600°C for 5-180 minutes. Thin foils for TEM examinations were prepared by chemical polishing from the GaA.s side. TEM investigations were performed with JE0L- 100B and JE0L-200CX electron microscopes.


Author(s):  
R. C. Moretz ◽  
G. G. Hausner ◽  
D. F. Parsons

Use of the electron microscope to examine wet objects is possible due to the small mass thickness of the equilibrium pressure of water vapor at room temperature. Previous attempts to examine hydrated biological objects and water itself used a chamber consisting of two small apertures sealed by two thin films. Extensive work in our laboratory showed that such films have an 80% failure rate when wet. Using the principle of differential pumping of the microscope column, we can use open apertures in place of thin film windows.Fig. 1 shows the modified Siemens la specimen chamber with the connections to the water supply and the auxiliary pumping station. A mechanical pump is connected to the vapor supply via a 100μ aperture to maintain steady-state conditions.


Author(s):  
Dudley M. Sherman ◽  
Thos. E. Hutchinson

The in situ electron microscope technique has been shown to be a powerful method for investigating the nucleation and growth of thin films formed by vacuum vapor deposition. The nucleation and early stages of growth of metal deposits formed by ion beam sputter-deposition are now being studied by the in situ technique.A duoplasmatron ion source and lens assembly has been attached to one side of the universal chamber of an RCA EMU-4 microscope and a sputtering target inserted into the chamber from the opposite side. The material to be deposited, in disc form, is bonded to the end of an electrically isolated copper rod that has provisions for target water cooling. The ion beam is normal to the microscope electron beam and the target is placed adjacent to the electron beam above the specimen hot stage, as shown in Figure 1.


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