Development of the structure of thin SiO2 films during thermal growth on Si substrate

YSi2-x thin films were grown by depositing the yttrium metal thin films on (111)Si substrate followed by a rapid thermal annealing (RTA) at 450 to 1100°C. The x value of the YSi2-x films ranges from 0 to 0.3. The (0001) plane of the YSi2-x films have an ideal zero lattice mismatch relative to (111)Si surface lattice. The YSi2 has the hexagonal AlB2 crystal structure. The orientation relationship with Si was determined from the diffraction pattern shown in figure 1(a) to be and . The diffraction pattern in figure 1(a) was taken from a specimen annealed at 500°C for 15 second. As the annealing temperature was increased to 600°C, superlattice diffraction spots appear at position as seen in figure 1(b) which may be due to vacancy ordering in the YSi2-x films. The ordered vacancies in YSi2-x form a mesh in Si plane suggested by a LEED experiment.

Download Full-text

Electron microscopy studies of PZT ferroelectric film capacitor structures

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100131450 ◽

1992 ◽

Vol 50 (2) ◽

pp. 1364-1365

Author(s):

V. Kaushik ◽

P. Maniar ◽

J. Olowolafe ◽

R. Jones ◽

A. Campbell ◽

...

Keyword(s):

Electric Fields ◽

Sol Gel ◽

Ferroelectric Material ◽

Dielectric Constants ◽

Dielectric Films ◽

Lead Zirconium Titanate ◽

Si Substrate ◽

Film Capacitor ◽

Pzt Films ◽

High Dielectric

Lead zirconium titanate films (Pb (Zr,Ti) O3 or PZT) are being considered for potential application as dielectric films in memory technology due to their high dielectric constants. PZT is a ferroelectric material which shows spontaneous polarizability, reversible under applied electric fields. We report herein some results of TEM studies on thin film capacitor structures containing PZT films with platinum-titanium electrodes.The wafers had a stacked structure consisting of PZT/Pt/Ti/SiO2/Si substrate as shown in Figure 1. Platinum acts as electrode material and titanium is used to overcome the problem of platinum adhesion to the oxide layer. The PZT (0/20/80) films were deposited using a sol-gel method and the structure was annealed at 650°C and 800°C for 30 min in an oxygen ambient. XTEM imaging was done at 200KV with the electron beam parallel to <110> zone axis of silicon.Figure 2 shows the PZT and Pt layers only, since the structure had a tendency to peel off at the Ti-Pt interface during TEM sample preparation.

Download Full-text

A crystallographic analysis of the CoSi/Si(111) interface using Transmission Electron Microscopy

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100176009 ◽

1990 ◽

Vol 48 (4) ◽

pp. 574-575

Author(s):

A.C. Daykin ◽

C.J. Kiely ◽

R.C. Pond ◽

J.L. Batstone

Keyword(s):

Electron Microscopy ◽

Transmission Electron Microscopy ◽

Defect Structure ◽

Room Temperature ◽

Theoretical Method ◽

Crystallographic Analysis ◽

Si Substrate ◽

Transmission Electron ◽

Theoretical Predictions

When CoSi2 is grown onto a Si(111) surface it can form in two distinct orientations. A-type CoSi2 has the same orientation as the Si substrate and B-type is rotated by 180° degrees about the [111] surface normal.One method of producing epitaxial CoSi2 is to deposit Co at room temperature and anneal to 650°C.If greater than 10Å of Co is deposited then both A and B-type CoSi2 form via a number of intermediate silicides .The literature suggests that the co-existence of A and B-type CoSi2 is in some way linked to these intermediate silicides analogous to the NiSi2/Si(111) system. The phase which forms prior to complete CoSi2 formation is CoSi. This paper is a crystallographic analysis of the CoSi2/Si(l11) bicrystal using a theoretical method developed by Pond. Transmission electron microscopy (TEM) has been used to verify the theoretical predictions and to characterise the defect structure at the interface.

Download Full-text

The reaction of amorphous Ni-Nb films with Si in the presence of a native SiO2 layer

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100176459 ◽

1990 ◽

Vol 48 (4) ◽

pp. 664-665

Author(s):

N. Rozhanski ◽

A. Barg

Keyword(s):

High Temperature ◽

Crystallization Temperature ◽

Diffusion Barriers ◽

Sio2 Layer ◽

Si Substrate ◽

Cross Sectional ◽

Plan View ◽

Temperature Range ◽

Sputter Deposited

Amorphous Ni-Nb alloys are of potential interest as diffusion barriers for high temperature metallization for VLSI. In the present work amorphous Ni-Nb films were sputter deposited on Si(100) and their interaction with a substrate was studied in the temperature range (200-700)°C. The crystallization of films was observed on the plan-view specimens heated in-situ in Philips-400ST microscope. Cross-sectional objects were prepared to study the structure of interfaces.The crystallization temperature of Ni5 0 Ni5 0 and Ni8 0 Nb2 0 films was found to be equal to 675°C and 525°C correspondingly. The crystallization of Ni5 0 Ni5 0 films is followed by the formation of Ni6Nb7 and Ni3Nb nucleus. Ni8 0Nb2 0 films crystallise with the formation of Ni and Ni3Nb crystals. No interaction of both films with Si substrate was observed on plan-view specimens up to 700°C, that is due to the barrier action of the native SiO2 layer.

Download Full-text

Growth and Characteristics of ZnO Nanotube Arrays on Si Substrate by Atomic Layer Deposition in Anodic Aluminum Oxide

10.1557/proc-1109-b09-09 ◽

2008 ◽

Author(s):

Soo Jin Chua ◽

Miao Wang ◽

Han Gao ◽

Carl V. Thompson ◽

Lee Kheng Tan

Keyword(s):

Atomic Layer Deposition ◽

Aluminum Oxide ◽

Anodic Aluminum Oxide ◽

Atomic Layer ◽

Nanotube Arrays ◽

Si Substrate ◽

Anodic Aluminum ◽

Zno Nanotube ◽

Layer Deposition

Download Full-text

Study of Nucleation of Electroless Cu Deposition on Pd

MRS Proceedings ◽

10.1557/proc-451-451 ◽

1996 ◽

Vol 451 ◽

Author(s):

R. Amster ◽

B. Johnson ◽

L. S. Vanasupa

Keyword(s):

Seed Layer ◽

Si Substrate

ABSTRACTWe studied the nucleation of Cu deposited by an electroless bath. A Pd seed layer was sputtered onto a (100) Si substrate and analyzed with GIX, STM, and AFM. The seed layer was then placed in varying ED-Cu bath conditions and also analyzed using GIX, STM, and AFM. GIX analysis results show a (111) texture for the Pd seed layer as well as the ED-Cu layer. The seed layer's influence on the deposited Cu grain's texture was found to be inconclusive.

Download Full-text