A transient study on two phase adiabatic flow over micro circular pin heat sinks

2021 ◽  
Vol 81 ◽  
pp. 811-822
Author(s):  
Mohammadreza DaqiqShirazi ◽  
Azeez A. Barzinjy ◽  
Samir M. Hamad ◽  
Rezvan Alamian ◽  
Mostafa Safdari Shadloo
Keyword(s):  
Heat Sinks ◽  
Two Phase ◽  
Adiabatic Flow ◽  
Transient Study

Two-Phase Flow and Heat Transfer in Rectangular Micro-Channels

2003 ◽  
Author(s):  
Weilin Qu ◽  
Seok-Mann Yoon ◽  
Issam Mudawar
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Flow Pattern ◽  
Two Phase Flow ◽  
Flow Patterns ◽  
Heat Sinks ◽  
Phase Flow ◽  
Micro Channel ◽  
Two Phase ◽  
Micro Channels

Knowledge of flow pattern and flow pattern transitions is essential to the development of reliable predictive tools for pressure drop and heat transfer in two-phase micro-channel heat sinks. In the present study, experiments were conducted with adiabatic nitrogen-water two-phase flow in a rectangular micro-channel having a 0.406 × 2.032 mm cross-section. Superficial velocities of nitrogen and water ranged from 0.08 to 81.92 m/s and 0.04 to 10.24 m/s, respectively. Flow patterns were first identified using high-speed video imaging, and still photos were then taken for representative patterns. Results reveal that the dominant flow patterns are slug and annular, with bubbly flow occurring only occasionally; stratified and churn flow were never observed. A flow pattern map was constructed and compared with previous maps and predictions of flow pattern transition models. Annual flow is identified as the dominant flow pattern for conditions relevant to two-phase micro-channel heat sinks, and forms the basis for development of a theoretical model for both pressure drop and heat transfer in micro-channels. Features unique to two-phase micro-channel flow, such as laminar liquid and gas flows, smooth liquid-gas interface, and strong entrainment and deposition effects are incorporated into the model. The model shows good agreement with experimental data for water-cooled heat sinks.

Two-Phase Heat Sinks With Microporous Coating

2011 ◽  
Author(s):  
Tadej Semenic ◽  
Seung M. You
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Heat Sink ◽  
Heat Sinks ◽  
Porous Coating ◽  
Two Phase ◽  
Small Channel ◽  
Rectangular Channels ◽  
Microporous Coating ◽  
Channel Aspect Ratio

To minimize flow boiling instabilities in two-phase heat sinks, two different types of microporous coatings were developed and applied on mini- and small-channel heat sinks and tested using degassed R245fa refrigerant. The first coating was epoxy-based and was sprayed on heat sink channels while the second coating was formed by sintering copper particles on heat sink channels. Mini-channel heat sinks had overall dimensions 25.4 mm × 25.4 mm × 6.4 mm and twelve rectangular channels with a hydraulic diameter 1.7 mm and a channel aspect ratio of 2.7. Small-channel heat sinks had the same overall dimensions, but only three rectangular channels with hydraulic diameter 4.1 mm and channel aspect ratio 0.6. The microporous coatings were found to minimize parallel channel instabilities for mini-channel heat sinks and to reduce the amplitude of heat sink base temperature oscillations from 6 °C to slightly more than 1 °C. No increase in pressure drop or pumping power due to the microporous coating was measured. The mini-channel heat sinks with porous coating had in average 1.5-times higher heat transfer coefficient than uncoated heat sinks. Also, the small-channel heat sinks with the “best” porous coating had in average 2.5-times higher heat transfer coefficient and the critical heat flux was 1.5 to 2-times higher compared with the uncoated heat sinks.

Non-Intrusive Optical Validation of Two-Phase Flow Regimes in a Small Diameter Tube

2014 ◽  
Author(s):  
Darin J. Sharar ◽  
Arthur E. Bergles ◽  
Nicholas R. Jankowski ◽  
Avram Bar-Cohen
Keyword(s):  
Film Thickness ◽  
Flow Regime ◽  
Two Phase Flow ◽  
Small Diameter ◽  
Flow Regimes ◽  
Phase Flow ◽  
Two Phase ◽  
Traditional Use ◽  
Adiabatic Flow ◽  
Flow Pattern Identification

A non-intrusive optical method for two-phase flow pattern identification was developed to validate flow regime maps for two-phase adiabatic flow in a small diameter tube. Empirical measurements of film thickness have been shown to provide objective identification of the dominant two-phase flow regimes, representing a significant improvement over the traditional use of exclusively visual and verbal descriptions. Use of this technique has shown the Taitel-Dukler, Ullmann-Brauner, and Wojtan et al. phenomenological flow regime mapping methodologies to be applicable, with varying accuracy, to small diameter two-phase flow.

A Visual and Photographic Study of the Inception of Vaporization in Adiabatic Flow

1964 ◽  
Vol 86 (2) ◽  
pp. 257-261 ◽  
Author(s):  
E. P. Mikol ◽  
J. C. Dudley
Keyword(s):  
Experimental Method ◽  
Two Phase Flow ◽  
Operating Conditions ◽  
Phase Flow ◽  
Two Phase ◽  
Adiabatic Flow ◽  
Index Data ◽  
Flow Phenomena ◽  
Glass Tubes

Data and observations obtained during the study of two-phase flow phenomena for refrigerants flowing in small bore copper and glass tubes have been examined for their significance to the cavitation. Visual and photographic observations have been made of the inception of vaporization and of the movement of the point of inception as operating conditions are varied. Liquid tension has been deduced as occurring in these tests. Liquid tension and cavitation index data are presented. The experimental method is recommended as a means for studying many aspects of the phenomenon of cavitation.

Next Generation Devices for Electronic Cooling

2003 ◽  
Author(s):  
Ralph L. Webb
Keyword(s):  
Heat Sink ◽  
New Technology ◽  
Heat Removal ◽  
Cost Effective ◽  
Heat Sinks ◽  
Working Fluid ◽  
Two Phase ◽  
Conventional Technology ◽  
Removal Technology ◽  
R Value

Conventional technology to cool desktop computers and servers is that of the “direct heat removal” heat sink, which consists of a heat sink/fan mounted on the CPU. Although this is a very cost effective solution, it is nearing its end of life. This is because future higher power CPUs will require a lower R-value than can be provided by this technology, within current size and fan limits. This paper discusses new technology that uses “indirect heat removal” technology, which involves use of a single or two-phase working fluid to transfer heat from the hot source to an ambient heat sink. This technology will support greater heat rejection than is possible with the “direct heat removal” method. Further, it will allow use of higher performance air-cooled ambient heat sinks than are possible with the “direct heat removal” heat sink. A concern of the indirect heat removal technology is the possibility that it may be orientation sensitive. This paper identifies preferred options and discusses the degree to which they are (or or not) orientation sensitive. It should be possible to attain an R-value of 0.12K/W at the balance point on the fan curve.

Design of a Microscale Breather for Two-Phase Thermal Management Devices

2008 ◽  
Author(s):  
B. R. Alexander ◽  
E. N. Wang
Keyword(s):  
Phase Change ◽  
Removal Rate ◽  
Heat Removal ◽  
Design Guidelines ◽  
Heat Sinks ◽  
Two Phase ◽  
Cross Sectional ◽  
Optical Visualization ◽  
Gas Removal ◽  
Microchannel Heat Sinks

Two-phase microchannels promise an efficient method to dissipate heat from high performance electronic systems by utilizing the latent heat of vaporization during the phase-change process. However, phase-change in microchannel heat sinks leads to challenges that are not present in macroscale systems due to the increasing importance of surface tension and viscous forces. In particular, flow instabilities often occur during the boiling process, which lead to liquid dry-out in the microchannels and severely limits the heat removal capabilities of the system. We propose a microscale breather device consisting of an array of hydrophobic breather ports which allow vapor bubbles to escape from the microchannels to improve flow stability. In this study, we use the combination of microfabricated structures and surface chemistry to separate vapor from the liquid flow. We designed test devices that allow for cross-sectional optical visualization to better understand the governing parameters of a breather design with high vapor removal efficiencies and minimal liquid leakage. We examined breather devices with average liquid velocities ranging from 0.5 cm/s to 4 cm/s and breather vacuum levels between 1 kPa and 9 kPa on the maximum gas removal rate through the breather. We demonstrated successful breather performance. In addition, a model was developed that offers design guidelines for future integrated breathers in microchannel heat sinks. The breathers also have significant promise for other microscale systems, such as micro-fuel cells, where liquid-vapor separation can significantly enhance system performance.

Enabling Thermal Management of High-Powered Server Processors Using Passive Thermosiphon Heat Sink

2019 ◽  
Author(s):  
Devdatta P. Kulkarni ◽  
Priyanka Tunuguntla ◽  
Guixiang Tan ◽  
Casey Carte
Keyword(s):  
Heat Pipe ◽  
High Power ◽  
Heat Sink ◽  
Capital Investment ◽  
Thermal Design ◽  
Heat Sinks ◽  
Air Cooling ◽  
Liquid Cooling ◽  
Two Phase ◽  
Pipe Heat

Abstract In recent years, rapid growth is seen in computer and server processors in terms of thermal design power (TDP) envelope. This is mainly due to increase in processor core count, increase in package thermal resistance, challenges in multi-chip integration and maintaining generational performance CAGR. At the same time, several other platform level components such as PCIe cards, graphics cards, SSDs and high power DIMMs are being added in the same chassis which increases the server level power density. To mitigate cooling challenges of high TDP processors, mainly two cooling technologies are deployed: Liquid cooling and advanced air cooling. To deploy liquid cooling technology for servers in data centers, huge initial capital investment is needed. Hence advanced air-cooling thermal solutions are being sought that can be used to cool higher TDP processors as well as high power non-CPU components using same server level airflow boundary conditions. Current air-cooling solutions like heat pipe heat sinks, vapor chamber heat sinks are limited by the heat transfer area, heat carrying capacity and would need significantly more area to cool higher TDP than they could handle. Passive two-phase thermosiphon (gravity dependent) heat sinks may provide intermediate level cooling between traditional air-cooled heat pipe heat sinks and liquid cooling with higher reliability, lower weight and lower cost of maintenance. This paper illustrates the experimental results of a 2U thermosiphon heat sink used in Intel reference 2U, 2 node system and compare thermal performance using traditional heat sinks solutions. The objective of this study was to showcase the increased cooling capability of the CPU by at least 20% over traditional heat sinks while maintaining cooling capability of high-power non-CPU components such as Intel’s DIMMs. This paper will also describe the methodology that will be used for DIMMs serviceability without removing CPU thermal solution, which is critical requirement from data center use perspective.

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