Fluorescence quenching by competitive absorption between solid foods: rapid and non-destructive determination of maize flour adulterated in turmeric powder

2021 ◽  
pp. 131887
Author(s):  
Jing-Ya Xie ◽  
Jin Tan ◽  
Shu-Hua Tang ◽  
Ying Wang
Keyword(s):  
Fluorescence Quenching ◽  
Maize Flour ◽  
Solid Foods ◽  
Non Destructive

Stoichiometric Determination of Graphite Intercalation Compounds Using Rutherford Backscatiering Spectrometry

1983 ◽  
Vol 27 ◽  
Author(s):  
L. Salamanca-Riba ◽  
B.S. Elman ◽  
M.S. Dresselhaus ◽  
T. Venkatesan
Keyword(s):  
Experimental Error ◽  
Rutherford Backscattering Spectrometry ◽  
Rutherford Backscattering ◽  
Intercalation Compounds ◽  
Graphite Intercalation Compounds ◽  
X Ray ◽  
Donor And Acceptor ◽  
Graphite Intercalation ◽  
Non Destructive

ABSTRACTRutherford backscattering spectrometry (RBS) is used to characterize the stoichiometry of graphite intercalation compounds (GIC). Specific application is made to several stages of different donor and acceptor compounds and to commensurate and incommensurate intercalants. A deviation from the theoretical stoichiometry is measured for most of the compounds using this non-destructive method. Within experimental error, the RBS results agree with those obtained from analysis of the (00ℓ) x-ray diffractograms and weight uptake measurements on the same samples.

Application of EDS Technique for OSP Film Thickness Measurement

2006 ◽  
Author(s):  
Prong Kongsubto ◽  
Sirarat Kongwudthiti
Keyword(s):  
Thin Film ◽  
Quantitative Analysis ◽  
Joint Strength ◽  
Critical Factor ◽  
Thickness Measurement ◽  
Ic Manufacturing ◽  
And Control ◽  
Film Thickness Measurement ◽  
Non Destructive

Abstract Organic solderability preservatives (OSPs) pad is one of the pad finishing technologies where Cu pad is coated with a thin film of an organic material to protect Cu from oxidation during storage and many processes in IC manufacturing. Thickness of OSP film is a critical factor that we have to consider and control in order to achieve desirable joint strength. Until now, no non-destructive technique has been proposed to measure OSP thickness on substrate. This paper reports about the development of EDS technique for estimating OSP thickness, starting with determination of the EDS parameter followed by establishing the correlation between C/Cu ratio and OSP thickness and, finally, evaluating the accuracy of the EDS technique for OSP thickness measurement. EDS quantitative analysis was proved that it can be utilized for OSP thickness estimation.

scholarly journals Non-Destructive Micromagnetic Determination of Hardness and Case Hardening Depth Using Linear Regression Analysis and Artificial Neural Networks

Metals ◽  
2020 ◽  
Vol 11 (1) ◽  
pp. 18
Author(s):  
Rahel Jedamski ◽  
Jérémy Epp
Keyword(s):  
Neural Network ◽  
Neural Networks ◽  
Regression Analysis ◽  
Artificial Neural Networks ◽  
Linear Regression ◽  
Linear Regression Analysis ◽  
Case Hardening ◽  
Artificial Neural ◽  
Non Destructive

Non-destructive determination of workpiece properties after heat treatment is of great interest in the context of quality control in production but also for prevention of damage in subsequent grinding process. Micromagnetic methods offer good possibilities, but must first be calibrated with reference analyses on known states. This work compares the accuracy and reliability of different calibration methods for non-destructive evaluation of carburizing depth and surface hardness of carburized steel. Linear regression analysis is used in comparison with new methods based on artificial neural networks. The comparison shows a slight advantage of neural network method and potential for further optimization of both approaches. The quality of the results can be influenced, among others, by the number of teaching steps for the neural network, whereas more teaching steps does not always lead to an improvement of accuracy for conditions not included in the initial calibration.

A Homogeneous Nonisotopic Histone Deacetylase Activity Assay

2003 ◽  
Vol 8 (1) ◽  
pp. 89-95 ◽  
Author(s):  
Birgit Heltweg ◽  
Manfred Jung
Keyword(s):  
Drug Discovery ◽  
Fluorescence Quenching ◽  
Histone Deacetylase ◽  
Anticancer Agents ◽  
Histone Deacetylases ◽  
Activity Assay ◽  
Animal Testing ◽  
Hdac Activity

Histone deacetylases (HDACs) are important regulators of transcription, and their inhibitors are a promising class of anticancer agents. The methods for the determination of HDAC activity and its inhibition that are currently available suffer from various drawbacks, such as animal testing, radioactive substrates, or limited throughput. Therefore, a fast nonisotopic method for the measurement of HDAC activity is highly desirable. The authors present such an assay that relies on the fluorescent HDAC substrate developed previously in their group. After incubation of the substrate with the enzyme, a derivatization leads to efficient fluorescence quenching in the deacetylated metabolite. Thus, only the fluorescence emitted by the remaining substrate is detected, which allows for a convenient detection of HDAC activity in a homogeneous format that can be performed on multiwell plate readers. This procedure, called HDASH (histone deacetylase assay—homogeneous), should be a valuable tool in transcriptional research and especially drug discovery. ( Journal of Biomolecular Screening 2003:89-95)

Characterization and Control of Copper CMP with Optoacoustic Metrology

2001 ◽  
Vol 671 ◽  
Author(s):  
Michael Gostein ◽  
Paul Lefevre ◽  
Alex A. Maznev ◽  
Michael Joffe
Keyword(s):  
Film Thickness ◽  
Spatial Resolution ◽  
Chemical Mechanical Polishing ◽  
High Spatial Resolution ◽  
Mechanical Polishing ◽  
Length Measurement ◽  
And Control ◽  
Non Destructive

ABSTRACTWe discuss applications of optoacoustic film thickness metrology for characterization of copper chemical-mechanical polishing (CMP). We highlight areas where the use of optoacoustics for CMP characterization provides data complementary to that obtained by other techniques because of its ability to directly measure film thickness with high spatial resolution in a rapid, non-destructive manner. Examples considered include determination of planarization length, measurement of film thickness at intermediate stages of polish, and measurement of arrays of metal lines.

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