Applicability of connectionist methods to predict thermal resistance of pulsating heat pipes with ethanol by using neural networks

Author(s):  
Mohammad Hossein Ahmadi ◽  
Afshin Tatar ◽  
Mohammad Alhuyi Nazari ◽  
Roghayeh Ghasempour ◽  
Ali J. Chamkha ◽  
...  
Author(s):  
Osamu Suzuki ◽  
Atsuo Nishihara

A novel electronics cooling system that uses water heat pipes under an ambient temperature range from −30°C to 40°C has been developed. The system consists of several water heat pipes, air-cooled fins, and a metal block. The heat pipes are separated into two groups according to the thermal resistance of their fins. One set of heat pipes, which have fins with higher thermal resistance, operates under an ambient temperature range from −30°C to 40°C. The other set, which have lower resistance, operates from 0°C to 40°C. A prediction model based on the frozen-startup limitation of a single heat pipe was first devised and experimentally verified. Then, a prediction model for the whole-system was formulated according to the former model. The whole-system model was used to design a prototype cooling system, and it was confirmed that the prototype has a suitable cooling performance for an environmentally friendly electronics cooling system.


2009 ◽  
Vol 15 (1) ◽  
pp. 75-79
Author(s):  
A.G. Kostornov ◽  
◽  
A.A. Shapoval ◽  
G.A. Frolov ◽  
I.V. Shapoval ◽  
...  

Author(s):  
Hsiang-Sheng Huang ◽  
Jung-Chang Wang ◽  
Sih-Li Chen

This article provides an experimental method to study the thermal performance of a heat sink with two pairs (outer and inner pair) of embedded heat pipes. The proposed method can determine the heat transfer rate of the heat pipes under various heating power of the heat source. A comprehensive thermal resistance network of the heat sink is also developed. The network estimates the thermal resistances of the heat sink by applying the thermal performance test result. The results show that the outer and inner pairs of heat pipes carries 21% and 27% of the total heat transfer rate respectively, while 52% of the heating power is dissipated from the base plate to the fins. The dominated thermal resistance of the heat sink is the base to heat pipes resistance which is strongly affected by the thermal performance of the heat pipes. The total thermal resistance of the heat sink shows the lowest value, 0.23°C/W, while the total heat transfer rate of the heat sink is 140W and the heat transfer rate of the outer and inner pairs of heat pipes is 30W and 38 W, respectively.


2011 ◽  
Vol 27 (2) ◽  
pp. 167-176 ◽  
Author(s):  
L.-H. Chien ◽  
Y.-C. Shih

ABSTRACTFlat heat pipes having mesh capillaries were investigated experimentally in this study. An apparatus was designed to test thermal performance of plate type copper water heat pipe having one or two layers of #50 or #80 mesh capillary structures with 5 to 50 W heat input. The working fluid, water, is charged in volumes equivalent to 25%, 33%, or 50% of the internal space. In addition to horizontal orientation, heat pipes were tested with the evaporator section elevated up to 40 degree inclination angle. Temperature distribution of the heat pipe was measured, and the evaporator, adiabatic and condensation resistances were calculated separately. The effects of mesh size, charge volume fraction, and inclination angle on thermal resistance were discussed. In general, the #80 mesh yielded lower thermal resistance than the #50 mesh. Inclination angle has a more significant effect on condenser than evaporator. Analysis of evaporation and condensation in flat heat pipes was conducted and semi-empirical correlations were derived. The present evaporation correlation predicts evaporation resistance between −20% and +30%, and the condensation correlation predicts most condensation resistance data within ±30% for 25% and 33% charge volume fraction.


2017 ◽  
Vol 139 (9) ◽  
Author(s):  
M. Halimi ◽  
A. Abbas Nejad ◽  
M. Norouzi

Closed-loop pulsating heat pipes (CLPHPs) are a new type of two-phase heat transfer devices that can transfer considerable heat in a small space via two-phase vapor and liquid pulsating flow and work with various types of two-phase instabilities so the operating mechanism of CLPHP is not well understood. In this work, two CLPHPs, made of Pyrex, were manufactured to observe and investigate the flow regime that occurs during the operation of CLPHP and thermal performance of the device under different laboratory conditions. In general, various working fluids were used in filling ratios of 40%, 50%, and 60% in horizontal and vertical modes to investigate the effect of thermo-physical parameters, filling ratio, nanoparticles, gravity, CLPHP structure, and input heat flux on the thermal performance of CLPHP. The results indicate that three types of flow regime may be observed given laboratory conditions. Each flow regime exerts a different effect on the thermal performance of the device. There is an optimal filling ratio for each working fluid. The increased number of turns in CLPHP generally improves the thermal performance of the system reducing the effect of the type of the working fluid on the aforementioned performance. The adoption of copper nanoparticles, which positively affect fluid motion, decreases the thermal resistance of the system as much as 6.06–42.76% depending on laboratory conditions. Moreover, gravity brings about positive changes in the flow regime decreasing thermal resistance as much as 32.13–52.58%.


Author(s):  
Tomer Israeli ◽  
T. Agami Reddy ◽  
Young I. Cho

This paper reports on preliminary experimental results on using nanofluids to enhance the thermal performance of heat pipes. Our experience with preparing copper oxide (CuO) nanofluids is described. Contrary to earlier studies which report infinite shelf life, we found that nanofluid stability lasted for about three weeks only; an issue which merits further study. We have also conducted various experiments to measure the variation of thermal conductivity and surface tension with CuO nanofluid concentration. Actual experiments on nanofluid heat pipes were also performed which indicated an average 12.5% decrease in the overall thermal resistance of the heat pipe using nanofluid of 3% vol concentration. This observed improvement is fairly consistent with our predictions using a simple analytical thermal network model for heat pipe overall resistance and the measured nanofluid conductivity. The results, though encouraging, need more careful and elaborate experimental studies before the evidence can be deemed conclusive.


Heat pipes are deliberated to be effective heat dissipation devices compared to other types of heat sinks due to their high effective thermal conductivity. Because of the flexibility in the design and layout of heat pipe turns along the heat source, pulsating heat pipes have gained popularity. One of the parameters that have the mainimpact on the presentation of CLPHP is the thermo physical properties of the working fluid. The properties of the working fluid affect the temperature difference between the evaporator and the condenser which in turn affect the thermal resistance of the CLPHP. In this connection, the influence of different working fluids is experimentally investigated on a two loop CLPHP, varying the evaporator heat flux. Pure fluids, viz., water, acetone, benzene and binary mixture, viz., Acetone-water and Benzene-water are utilized on working fluids. The heat input considered at the evaporator is 32W, 48W and 60W. The filling ratio is kept as 50 %. The results show that among the working fluids considered for the study, acetone exhibits least thermal resistance among the pure fluids at all heat fluxes considered in the analysis, while Acetone-water mixture has exhibited least thermal resistance among the water based mixtures.


Author(s):  
Mahboobe Mahdavi ◽  
Amir Faghri

Abstract In the present works, a comprehensive transient numerical model was developed to evaluate the effect of nanofluid on the transient performance of heat pipes. The numerical model solves for compressible vapor flow, the liquid flow in the wick region, and the energy equations in the vapor, wick and wall. The distinctive feature of the model is that it can uniquely determine the heat pipe operating pressure based on the physical and operating conditions of the system. Three nanoparticle types were considered: Al2O3, CuO, and TiO2. The effects of the concentration of nanoparticles (5%, 10%, 20% and 40%) were investigated on the heat pipe response time, thermal resistance, and pressure drop under various operating conditions. The results showed that the use of nanofluid decreased the response time of the heat pipe by the maximum of 27%. It was also discovered that the thermal resistance decreased significantly with an increase in the volume concentration. A maximum reduction of 84%, 82% and 78% in thermal resistance was obtained for Al2O3, CuO, and TiO2, respectively. In addition, the effect of nanoparticles on the liquid pressure drop highly depends on the nanoparticle type and volume concentration.


Author(s):  
Guangming Xu ◽  
Rongjian Xie ◽  
Nanxi Li ◽  
Cheng Liu

Abstract Two kinds of new refrigerant-R1234ze (E) and R245fa were discussed as substitutes or supplements to traditional working fluids of loop heat pipes based on their favorable thermophysical properties and characteristics such as being safe and environmentally friendly. Thermal characteristics of a loop heat pipe with sintering copper wick at different charging ratios were experimentally investigated under variable heat loads. The results showed that the optimal charging ratio in the loop heat pipe range from 65% to 70%, and at this charging level, the R1234ze(E) system had better start-up response, while the R245fa system presented a stronger heat transfer capacity. The characteristic temperature of R1234ze(E) system was below 35 °C, and the corresponding thermal resistance was 0.08 K/W ~ 1.62 K/W under heat loads ranging from 5 W to 40 W. The thermal resistance of the R245fa system was 0.18 K/W ~ 0.91 K/W under heat loads of 10 W ~ 60 W, and the operating temperature was below 60 °C. The loop heat pipes charged with the proposed new refrigerants exhibit superb performance in room temperature applications, making them beneficial for enhancing the performance of electronics, and could provide a distinctive choice for the cooling of small-sized electronics especially.


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