Film thickness limits of a buckling-based method to determine mechanical properties of polymer coatings

2021 ◽  
Vol 582 ◽  
pp. 227-235
Author(s):  
Elina Niinivaara ◽  
Johanna Desmaisons ◽  
Alain Dufresne ◽  
Julien Bras ◽  
Emily D. Cranston
1976 ◽  
Vol 49 (5) ◽  
pp. 1311-1323 ◽  
Author(s):  
Y. S. Lipatov

Abstract In conclusion, we can say that the properties of thin polymer films and their relaxation behavior are strongly dependent on their thickness. This is related to the restriction of molecular mobility at the phase boundary (independent of its nature) as a result of the reduced number of possible chain conformations. The less the polymer thickness, the more pronounced is the contribution of surface layers with diminished molecular mobility to the mechanical properties. This statement may be illustrated by Figure 12, which shows the dependence of the elastic modulus and surface-to-volume ratio on film thickness. Diminishing film thickness leads to increase in film rigidity, beginning at the point where the surface-to-volume ratio increases sharply. This suggests that the effect is associated with change in mechanical properties of thin surface layers, which contributes significantly to total mechanical properties. We have other data which show also that the relaxation spectrum of a film is changed when its thickness changes. The findings discussed above indicate that the solid surface has a noticeable and complex effect on the properties and relaxation behavior and relaxation time spectra of polymer coatings on solid surface, both inorganic and organic. The principal reasons for these changes are the adsorption interaction with the solid surface, decrease of molecular mobility, and strong intermolecular interaction transferring the influence of the solid surface to more remote layers of polymer.


1994 ◽  
Vol 356 ◽  
Author(s):  
V. A. C. Haanappel ◽  
H. D. van Corbach ◽  
T. Fransen ◽  
P. J. Gellings

AbstractAmorphous alumina films were deposited by metal-organic chemical vapour deposition (MOCVD) on stainless steel, type AISI 304. The MOCVD experiments were performed in nitrogen at low pressure (0.17 kPa (1.25 torr)).The effect of deposition temperature (200 − 380 °C), growth rate, film thickness, and post-deposition thermal treatment on the mechanical properties was studied. The experiments were performed with a scanning-scratch tester. The experiments are based on the estimation of the film adhesion to the substrate by determining a critical load, Lc: the load where the film starts to spall or to delaminate.The best mechanical properties were obtained with unannealed samples. After thermal annealing the critical load decreases. Regarding the unannealed samples, the critical load increased with increasing film thickness. The deposition temperature and the growth rate had no effect on the critical load.


1999 ◽  
Vol 594 ◽  
Author(s):  
R. Spolenak ◽  
C. A. Volkert ◽  
K. Takahashi ◽  
S. Fiorillo ◽  
J. Miner ◽  
...  

AbstractIt is well known that the mechanical properties of thin films depend critically on film thickness However, the contributions from film thickness and grain size are difficult to separate, because they typically scale with each other. In one study by Venkatraman and Bravman, Al films, which were thinned using anodic oxidation to reduce film thickness without changing grain size, showed a clear increase in yield stress with decreasing film thickness.We have performed a similar study on both electroplated and sputtered Cu films by using chemical-mechanical polishing (CMP) to reduce the film thickness without changing the grain size. Stress-temperature curves were measured for both the electroplated and sputtered Cu films with thicknesses between 0.1 and 1.8 microns using a laser scanning wafer curvature technique. The yield stress at room temperature was found to increase with decreasing film thickness for both sets of samples. The sputtered films, however, showed higher yield stresses in comparison to the electroplated films. Most of these differences can be attributed to the different microstructures of the films, which were determined by focused ion beam (FIB) microscopy and x-ray diffraction.


2021 ◽  
pp. 111570
Author(s):  
Lianhui Li ◽  
Xinxuan Wang ◽  
Zhiqiang Zhang ◽  
Fugang Qi ◽  
Dechuang Zhang ◽  
...  

Nanomaterials ◽  
2020 ◽  
Vol 10 (4) ◽  
pp. 660
Author(s):  
Mekro Permana Pinem ◽  
Endarto Yudo Wardhono ◽  
Frederic Nadaud ◽  
Danièle Clausse ◽  
Khashayar Saleh ◽  
...  

Chitosan (CH)-based materials are compatible to form biocomposite film for food packaging applications. In order to enhance water resistance and mechanical properties, cellulose can be introduced to the chitosan-based film. In this work, we evaluate the morphology and water resistance of films prepared from chitosan and cellulose in their nanoscale form and study the phenomena underlying the film formation. Nanofluid properties are shown to be dependent on the particle form and drive the morphology of the prepared film. Film thickness and water resistance (in vapor or liquid phase) are clearly enhanced by the adjunction of nanocrystalline cellulose.


2018 ◽  
Vol 12 (5/6) ◽  
pp. 379 ◽  
Author(s):  
Anand Singh Rathaur ◽  
Jitendra Kumar Katiyar ◽  
Vinay Kumar Patel ◽  
Shubrajit Bhaumik ◽  
Anuj Kumar Sharma

2019 ◽  
Vol 358 ◽  
pp. 320-330 ◽  
Author(s):  
Julien Bardon ◽  
Reiner Dieden ◽  
Patrick Grysan ◽  
Gregory Mertz ◽  
Arnaud Martin ◽  
...  

1994 ◽  
Vol 356 ◽  
Author(s):  
R.-M. Keller ◽  
S. Bader ◽  
R. P. Vinci ◽  
E. Arzt

AbstractThe substrate curvature technique was employed to study the mechanical properties of 0.6 μm and 1.0 μm Cu films capped with a 50 nm thick Si3N4 layer and to compare them with the mechanical properties of uncapped Cu films. The microstructures of these films were also investigated. Grain growth, diffusional creep and dislocation processes are impeded by the cap layer. This is evident in the form of high stresses at high temperatures on heating and at low temperatures on cooling. At intermediate temperatures on heating and cooling, stress plateaus a relatively low stresses exist. This can be explained by the so-called Bauschinger effect. A film thickness dependence of the stresses in the film could not be observed for capped Cu films.


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