scholarly journals Caffeinating the biofuels market: Effect of the processing conditions during the production of biofuels and high-value chemicals by hydrothermal treatment of residual coffee pulp

2021 ◽  
pp. 127008
Author(s):  
Javier Remón ◽  
Felipe Ravaglio-Pasquini ◽  
Lorena Pedraza-Segura ◽  
Pedro Arcelus-Arrillaga ◽  
Isabel Suelves ◽  
...  
2014 ◽  
Vol 52 (8) ◽  
pp. 5156-5163 ◽  
Author(s):  
Marcelo O. Bello ◽  
María A. Loubes ◽  
Roberto J. Aguerre ◽  
Marcela P. Tolaba

1978 ◽  
Vol 50 (3) ◽  
pp. 254-262
Author(s):  
Christina Westermarck-Rosendahl

Sprout-damaged rye with the falling number of 87 was heat-treated by immersing the grain in water having temperatures of 80, 90 and 100°C. The treatment lasted at the most 60 sec and was followed by an immediate chilling process. The aim of the treatment was to suppress the excess of a-amylase activity in the outer layers of the kernels. The changes in the quality of the rye were determined by the falling number test, amylograph test and baking tests in which yeast and no acid was added. All the performed treatments affected the results of the quality determinations. Treatment at 80, 90 and 100°C lasting 30 sec raised the falling number values to 102, 117 and 155, respectively. After treatment for 60 sec the values were 101, 142 and 223. In the amylograms the peak viscosity increased markedly. Processing at 100 and 90°C for more than 20 sec resulted in an increase of the peak viscosity beyond 1000 B.U. The peak temperature of all the samples was rather low and some decrease in the peak temperature was indicated at the processing temperatures of 80 and 90° C. The loaf volumes of loaf made from the treated samples were all lower than the volume of the loaf from the untreated sample. The samples treated for 30 and 60 sec at 100°C gave lowest volumes. Stickiness of the doughs was diminished by the more severe processing conditions, as also were dampness and elasticity of the crumb. All loaves except the ones made of grain heated at 100“C for 30 and 60 sec had a rather large cavity beneath the crust. The samples processed at 90 and 100°C for 30 and 60 sec gave a lighter brown crust colour than the rest of the samples.


2021 ◽  
Vol 11 (8) ◽  
pp. 3452
Author(s):  
Joanna Kapusta-Duch ◽  
Adam Florkiewicz ◽  
Teresa Leszczyńska ◽  
Barbara Borczak

Little is still known about macro- and micronutrients in processed selected Brassica vegetables such as purple and green cauliflower, rutabaga and kale. This study evaluates the influence of different processing conditions (blanching and boiling) on the stability of selected macro- and micronutrients in the aforementioned vegetables. Results indicated that blanching and boiling affect the mineral content of Brassica vegetables. Of the examined Brassica vegetables, the largest losses were found for potassium and iron (on average by 39.72%).


Author(s):  
Peter Pegler ◽  
N. David Theodore ◽  
Ming Pan

High-pressure oxidation of silicon (HIPOX) is one of various techniques used for electrical-isolation of semiconductor-devices on silicon substrates. Other techniques have included local-oxidation of silicon (LOCOS), poly-buffered LOCOS, deep-trench isolation and separation of silicon by implanted oxygen (SIMOX). Reliable use of HIPOX for device-isolation requires an understanding of the behavior of the materials and structures being used and their interactions under different processing conditions. The effect of HIPOX-related stresses in the structures is of interest because structuraldefects, if formed, could electrically degrade devices.This investigation was performed to study the origin and behavior of defects in recessed HIPOX (RHIPOX) structures. The structures were exposed to a boron implant. Samples consisted of (i) RHlPOX'ed strip exposed to a boron implant, (ii) recessed strip prior to HIPOX, but exposed to a boron implant, (iii) test-pad prior to HIPOX, (iv) HIPOX'ed region away from R-HIPOX edge. Cross-section TEM specimens were prepared in the <110> substrate-geometry.


1997 ◽  
Vol 473 ◽  
Author(s):  
Michael Lane ◽  
Robert Ware ◽  
Steven Voss ◽  
Qing Ma ◽  
Harry Fujimoto ◽  
...  

ABSTRACTProgressive (or time dependent) debonding of interfaces poses serious problems in interconnect structures involving multilayer thin films stacks. The existence of such subcriticai debonding associated with environmentally assisted crack-growth processes is examined for a TiN/SiO2 interface commonly encountered in interconnect structures. The rate of debond extension is found to be sensitive to the mechanical driving force as well as the interface morphology, chemistry, and yielding of adjacent ductile layers. In order to investigate the effect of interconnect structure, particularly the effect of an adjacent ductile Al-Cu layer, on subcriticai debonding along the TiN/SiO2 interface, a set of samples was prepared with Al-Cu layer thicknesses varying from 0.2–4.0 μm. All other processing conditions remained the same over the entire sample run. Results showed that for a given crack growth velocity, the debond driving force scaled with Al-Cu layer thickness. Normalizing the data by the critical adhesion energy allowed a universal subcriticai debond rate curve to be derived.


Food Industry ◽  
2018 ◽  
Vol 3 (4) ◽  
Author(s):  
Albert H-H. Nugmanov ◽  
Olesya A. Aleksanyan ◽  
Miguel A. S. Barzola

2015 ◽  
Vol 14 (3) ◽  
pp. 601-605 ◽  
Author(s):  
Cristina M. Ursescu ◽  
Angelica Olaru ◽  
Teodor Malutan. ◽  
Maria Geba ◽  
Corina Malutan

1998 ◽  
Author(s):  
R. Berriche ◽  
R.K. Lowry ◽  
M.I. Rosenfield

Abstract The present work investigated the use of the Vickers micro-hardness test method to determine the resistance of individual die to cracking. The results are used as an indicator of resistance to failure under the thermal and mechanical stresses of packaging and subsequent thermal cycling. Indentation measurements on die back surfaces are used to determine how changes in wafer backside processing conditions affect cracks that form around impressions produced at different loads. Test methodology and results obtained at different processing conditions are discussed.


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